| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/24/2001 | US6221171 Method and apparatus for conveying a workpiece |
| 04/24/2001 | US6221169 Generating ion beam having fluorine component; directing ion beam toward surface to be cleaned; neutralizing ion beam by; cleaning surface by allowing beam of neutral fluorine atoms to react with contaminants; removing volatile reaction product |
| 04/24/2001 | US6221168 HF/IPA based process for removing undesired oxides form a substrate |
| 04/24/2001 | US6221167 Process and system for treatments by fluids |
| 04/24/2001 | US6221166 Multi-thermal zone shielding apparatus |
| 04/24/2001 | US6221165 High temperature plasma-assisted diffusion |
| 04/24/2001 | US6221163 Molecular contamination control system |
| 04/24/2001 | US6221157 Spin coating bowl exhaust system |
| 04/24/2001 | US6221156 Apparatus for growing a semiconductor crystal |
| 04/24/2001 | US6221118 Cerium oxide abrasive and method of polishing substrates |
| 04/24/2001 | US6220944 Carrier head to apply pressure to and retain a substrate |
| 04/24/2001 | US6220938 Grinding machines |
| 04/24/2001 | US6220935 Apparatus and method for cleaning substrate |
| 04/24/2001 | US6220934 Method for controlling pH during planarization and cleaning of microelectronic substrates |
| 04/24/2001 | US6220928 Surface grinding method and apparatus for thin plate work |
| 04/24/2001 | US6220808 Ergonomic, variable size, bottom opening system compatible with a vertical interface |
| 04/24/2001 | US6220771 Wafer backside protection apparatus |
| 04/24/2001 | US6220607 Thermally conductive conformal media |
| 04/24/2001 | US6220503 Rework and underfill nozzle for electronic components |
| 04/24/2001 | US6220499 Method for assembling a chip carrier to a semiconductor device |
| 04/24/2001 | US6220438 Container for transporting precision substrates |
| 04/24/2001 | US6220259 Tank design for sonic wafer cleaning |
| 04/24/2001 | US6220204 Film deposition method for forming copper film |
| 04/24/2001 | US6220202 Apparatus for producing thin films by low temperature plasma-enhanced chemical vapor deposition |
| 04/24/2001 | US6220091 Liquid level pressure sensor and method |
| 04/24/2001 | US6219936 Wafer drying device and method |
| 04/24/2001 | US6219912 Method for manufacture electronic component device |
| 04/24/2001 | US6219911 Flip chip mounting technique |
| 04/24/2001 | US6219910 Method for cutting integrated circuit dies from a wafer which contains a plurality of solder bumps |
| 04/24/2001 | US6219908 Method and apparatus for manufacturing known good semiconductor die |
| 04/24/2001 | US6219872 Brush scrubbing apparatus |
| 04/24/2001 | CA2205763C Ultrasonic vibration bonding chip mounter |
| 04/21/2001 | CA2313551A1 Wafer integrated rigid support ring |
| 04/19/2001 | WO2001028300A1 Matching device and plasma processing apparatus |
| 04/19/2001 | WO2001028097A1 Heterogeneous interconnection architecture for programmable logic devices |
| 04/19/2001 | WO2001028000A1 Method for manufacturing soi wafer, and soi wafer |
| 04/19/2001 | WO2001027999A1 Bonded wafer producing method and bonded wafer |
| 04/19/2001 | WO2001027998A1 Integrated circuit |
| 04/19/2001 | WO2001027994A1 Method of manufacturing a semiconductor memory device with anti-reflective coating |
| 04/19/2001 | WO2001027993A1 Semiconductor memory device and its usage |
| 04/19/2001 | WO2001027992A1 Substrate falling-preventive mechanism and substrate tester having the same |
| 04/19/2001 | WO2001027991A1 Centrifugal gripper mechanism for dynamic force compensation |
| 04/19/2001 | WO2001027990A1 A method and system for polishing semiconductor wafers |
| 04/19/2001 | WO2001027988A1 Processing method |
| 04/19/2001 | WO2001027986A1 Method and device for treating surfaces of objects |
| 04/19/2001 | WO2001027984A1 Ultraviolet radiation producing apparatus |
| 04/19/2001 | WO2001027983A1 Method and apparatus for forming interconnection |
| 04/19/2001 | WO2001027982A1 Method and apparatus for lining contact, via and trench layers with high-density ionized metal plasma (imp) titanium and cvd titanium nitride layers |
| 04/19/2001 | WO2001027981A2 Indium-enhanced bipolar transistor |
| 04/19/2001 | WO2001027980A1 Single step pendeo- and lateral epitaxial overgrowth of group iii-nitride layers |
| 04/19/2001 | WO2001027979A1 Reference wafer for controlling accuracy and method for producing the same, aligner, and method for fabricating device |
| 04/19/2001 | WO2001027977A1 Epicyclic stage |
| 04/19/2001 | WO2001027976A1 Semiconductor device processing and sorting apparatus and method of handling |
| 04/19/2001 | WO2001027975A1 An apparatus for in-cassette monitoring of semiconductor wafers |
| 04/19/2001 | WO2001027974A2 Dram with bit lines in two metallised sheets |
| 04/19/2001 | WO2001027973A1 Method and device for treating substrates |
| 04/19/2001 | WO2001027972A2 Molecular scale electronic devices |
| 04/19/2001 | WO2001027970A1 Electric supply unit and a method for reducing sparking during sputtering |
| 04/19/2001 | WO2001027968A1 Determining beam alignment in ion implantation using rutherford back scattering |
| 04/19/2001 | WO2001027871A2 Method for production of contactless chip cards and for production of electrical units comprising chips with contact elements |
| 04/19/2001 | WO2001027695A2 Removable cover for protecting a reticle, system including and method of using the same |
| 04/19/2001 | WO2001027600A1 Method for inspecting surface of semiconductor wafer |
| 04/19/2001 | WO2001027362A1 Silicon single-crystal wafer for epitaxial wafer, epitaxial wafer, methods for producing them, and evaluating method |
| 04/19/2001 | WO2001027357A1 Method and apparatus for executing plural processes on a microelectronic workpiece at a single processing station |
| 04/19/2001 | WO2001027350A1 Optimal offset, pad size and pad shape for cmp buffing and polishing |
| 04/19/2001 | WO2001027347A1 Method of depositing transition metal nitride thin films |
| 04/19/2001 | WO2001027346A1 Method of modifying source chemicals in an ald process |
| 04/19/2001 | WO2001027235A1 Processes for removing water from the surface of a substrate |
| 04/19/2001 | WO2001027217A1 Hydrofluoroether as a heat-transfer fluid |
| 04/19/2001 | WO2001026910A1 Non-contact data carrier and ic chip |
| 04/19/2001 | WO2001026830A1 Improvements in drying and cleaning objects using controlled aerosols and gases |
| 04/19/2001 | WO2001026829A1 Single semiconductor wafer processor |
| 04/19/2001 | WO2001018855A8 Systems and methods using sequential lateral solidification for producing single or polycrystalline silicon thin films at low temperatures |
| 04/19/2001 | WO2001003186A9 Semiconductor device, method of manufacturing the same, and structure for mounting semiconductor device |
| 04/19/2001 | WO2000068472A8 Truncated susceptor for vapor-phase deposition |
| 04/19/2001 | WO2000034999A9 An epitaxial silicon wafer with intrinsic gettering and a method for the preparation thereof |
| 04/19/2001 | WO2000034984A3 Transistor with notched gate |
| 04/19/2001 | WO2000025984A9 Chemical mechanical polishing a substrate having a filler layer and a stop layer |
| 04/19/2001 | US20010000336 Method for forming quantum dot in semiconductor device and a semiconductor device resulting therefrom |
| 04/19/2001 | US20010000335 Comprising uniform medium with controllable electric characteristic and semiconductor ultrafine particles dispersed in medium and having a mean particle size of 100 nm or less |
| 04/19/2001 | US20010000334 Bleeding liquid continuously from source of liquid through a bleed line to a receptacle of a collector, drawing a sample of the liquid from the receptacle by an automated sample collecting device, depositing liquid into analyzer |
| 04/19/2001 | US20010000322 A collector for collecting samples of liquid from cleaning bath which allows for analysis of the contaaminants in a cleaning bath solution via on-line process without delaying the wafer cleaning; reliable and reproducible analysis |
| 04/19/2001 | US20010000309 Semiconductor device |
| 04/19/2001 | US20010000306 High density flash memory architecture with columnar substrate coding |
| 04/19/2001 | US20010000289 Well isolation bipolar transistor |
| 04/19/2001 | US20010000288 Semiconductor device and fabrication method thereof |
| 04/19/2001 | DE19949394A1 Elektrische Versorgungseinheit und Verfahren zur Reduktion der Funkenbildung beim Sputtern Electric power supply unit and method for reducing spark formation in sputtering |
| 04/19/2001 | DE19948572A1 Vorrichtung zum Handling von Halbleiterscheiben An apparatus for handling semiconductor wafers |
| 04/19/2001 | DE19948571A1 Speicheranordnung Memory array |
| 04/19/2001 | DE19948570A1 Semiconductor body conductor-paths wiring arrangement |
| 04/19/2001 | DE19948569A1 Computer-assisted measurement method for semiconductor manufacturing machine |
| 04/19/2001 | DE19948568A1 Etching process comprises etching contact holes through one or more silicon dioxide insulating layers so that a residual layer remains, and then etching a trench structure |
| 04/19/2001 | DE19947082A1 Integrated circuit device incorporating capacitor e.g. dynamic random access memory device |
| 04/19/2001 | DE19947020A1 Kompensationsbauelement mit variabler Ladungsbilanz Compensation component with variable charge balance |
| 04/19/2001 | DE19946719A1 Trench capacitor used in the production of DRAM storage cells has a conducting contact layer between the substrate and the conducting trench filling in the trench above the insulating collar |
| 04/19/2001 | DE19946495A1 Anordnung zur Verringerung der Anzahl der Messpads auf einem Halbleiterchip Arrangement for reducing the number of the measuring pads on a semiconductor chip |
| 04/19/2001 | DE19946490A1 Magnetoresistiver Schreib/Lese-Speicher sowie Verfahren zum Beschreiben und Auslesen eines solchen Speichers A magnetoresistive read / write memory as well as methods for writing and reading out of such a memory |
| 04/19/2001 | DE19946153A1 Production of semiconductor device comprises forming dielectric material on component structure and filling chambers between structures, chemical-mechanical polishing and forming fluid insulating material on dielectric |
| 04/19/2001 | DE19945648A1 Vorrichtung zum Be- und Entladen von Substraten Apparatus for loading and unloading of substrates |
| 04/19/2001 | DE19945425A1 Structuring a metal layer during semiconductor finishing comprises applying a lacquer layer to a semiconductor substrate, structuring and producing an etching mask and structuring the metal layer using the mask |