Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2001
05/08/2001US6228708 Method of manufacturing high voltage mixed-mode device
05/08/2001US6228707 Semiconductor arrangement having capacitive structure and manufacture thereof
05/08/2001US6228706 Vertical DRAM cell with TFT over trench capacitor
05/08/2001US6228705 Overlay process for fabricating a semiconductor device
05/08/2001US6228704 Process for manufacturing semiconductor integrated circuit device
05/08/2001US6228703 Method of fabricating mixed-mode semiconductor device having a capacitor and a gate
05/08/2001US6228702 Method of manufacturing semiconductor device
05/08/2001US6228701 Apparatus and method for minimizing diffusion in stacked capacitors formed on silicon plugs
05/08/2001US6228700 Method for manufacturing dynamic random access memory
05/08/2001US6228699 Cross leakage of capacitors in DRAM or embedded DRAM
05/08/2001US6228698 Manufacture of field-effect semiconductor devices
05/08/2001US6228697 Method of manufacturing semiconductor device including field effect transistors
05/08/2001US6228695 Method to fabricate split-gate with self-aligned source and self-aligned floating gate to control gate
05/08/2001US6228694 Method of increasing the mobility of MOS transistors by use of localized stress regions
05/08/2001US6228693 Selected site, metal-induced, continuous crystallization method
05/08/2001US6228692 Thin film semiconductor device, method for fabricating the same and semiconductor device
05/08/2001US6228691 Silicon-on-insulator devices and method for producing the same
05/08/2001US6228690 Method of manufacturing fuse element used in memory device and fuse element
05/08/2001US6228689 Trench style bump and application of the same
05/08/2001US6228688 Flip-chip resin-encapsulated semiconductor device
05/08/2001US6228687 Wafer-level package and methods of fabricating
05/08/2001US6228685 Framed sheet processing
05/08/2001US6228684 Wafer-level package, a method of manufacturing thereof and a method of manufacturing semiconductor devices from such a wafer-level package
05/08/2001US6228682 Multi-cavity substrate structure for discrete devices
05/08/2001US6228681 Flip chip having integral mask and underfill providing two-stage bump formation
05/08/2001US6228680 Low stress method and apparatus for underfilling flip-chip electronic devices
05/08/2001US6228679 Apparatus and method for automating the underfill of flip-chip devices
05/08/2001US6228678 Flip chip with integrated mask and underfill
05/08/2001US6228676 Near chip size integrated circuit package
05/08/2001US6228673 Method of fabricating a surface coupled InGaAs photodetector
05/08/2001US6228672 Stable surface passivation process for compound semiconductors
05/08/2001US6228667 Field emission displays with reduced light leakage
05/08/2001US6228666 Method of testing integrated circuit including a DRAM
05/08/2001US6228665 Method of measuring oxide thickness during semiconductor fabrication
05/08/2001US6228663 Method of forming semiconductor devices using gate insulator thickness and channel length for controlling drive current strength
05/08/2001US6228662 Method for removing short-circuited sections of a solar cell
05/08/2001US6228651 Preparation of analytical samples, analysis of impurities, preparation of highly purified phosphoric acid and production of semiconductor devices
05/08/2001US6228563 Exposure to plasma activated gas; separation; penetration to vapor phase solvent
05/08/2001US6228558 Blend of polymer and photoacid generator
05/08/2001US6228555 Multilayer; containing melt; carbon black zones with variations in absorption
05/08/2001US6228554 Blend of alkali soluble resin and a 1,2-quinonediazide compound
05/08/2001US6228544 Exposure to radiation flux
05/08/2001US6228542 Photomask method of manufacture method of test/repair and method of use therefor
05/08/2001US6228540 Method of forming a photomask of high dimensional accuracy utilizing heat treatment equipment
05/08/2001US6228538 Using photosensitive material
05/08/2001US6228512 Amorphous layer of molybdenum, ruthenium and crystalline beryllium; multilayer mirrors
05/08/2001US6228511 Structure and process for thin film interconnect
05/08/2001US6228466 Printed wiring board and method for manufacturing the same
05/08/2001US6228452 Adhesive tape for electronic parts
05/08/2001US6228438 Plasma reactor for the treatment of large size substrates
05/08/2001US6228280 Endpoint detection by chemical reaction and reagent
05/08/2001US6228279 Applying a mixture containing hexafluoroethane, a source of hydrogen selected from fluromethane, pentafluooroethane, difluoromethane, a diluent and applying high density plasma to etch antireflective coating
05/08/2001US6228278 Methods and apparatus for determining an etch endpoint in a plasma processing system
05/08/2001US6228277 Etch endpoint detection
05/08/2001US6228276 Method of manufacturing magnetoresistive (MR) sensor element with sunken lead structure
05/08/2001US6228236 Sputter magnetron having two rotation diameters
05/08/2001US6228235 Magnetron for low pressure, full face erosion
05/08/2001US6228234 Apparatus for sputtering
05/08/2001US6228229 Method and apparatus for generating a plasma
05/08/2001US6228211 Apparatus for etching a glass substrate
05/08/2001US6228210 Surface wave coupled plasma etching apparatus
05/08/2001US6228209 Equipment for forming a glue layer of an opening
05/08/2001US6228196 Method of producing a multi-layer ceramic substrate
05/08/2001US6228186 Method for manufacturing metal sputtering target for use in DC magnetron so that target has reduced number of conduction anomalies
05/08/2001US6228179 Contacting a semi-conductor substrate with a surface treatment composition containing a complexing agent as a metal deposition preventive in a liquid medium, in which the complexing agent is an ethylenediaminephenol derivative
05/08/2001US6228176 Contoured platen design for plasma immerson ion implantation
05/08/2001US6228175 Apparatus for generating a wet oxygen stream for a semiconductor processing furnace
05/08/2001US6228174 Heat treatment system using ring-shaped radiation heater elements
05/08/2001US6228173 Single-substrate-heat-treating apparatus for semiconductor process system
05/08/2001US6228171 Heat processing apparatus
05/08/2001US6228166 Method for boron contamination reduction in IC fabrication
05/08/2001US6228164 Process for producing a single crystal
05/08/2001US6228135 Purification of very slightly contaminated air within a clean room
05/08/2001US6227946 Robot assisted method of polishing, cleaning and drying workpieces
05/08/2001US6227945 Method and apparatus for polishing the outer periphery of disc-shaped workpiece
05/08/2001US6227944 Method for processing a semiconductor wafer
05/08/2001US6227941 Support structure with multi-layer support material for use during package removal from a multi-layer integrated circuit device
05/08/2001US6227939 Temperature controlled chemical mechanical polishing method and apparatus
05/08/2001US6227786 Substrate treating apparatus
05/08/2001US6227658 Apparatus and method for forming thin film using ink-jet mechanism
05/08/2001US6227590 Coating and forming support from fluoropolymer
05/08/2001US6227436 Method of fabricating an electronic circuit device and apparatus for performing the method
05/08/2001US6227431 Apparatus and method of clamping semiconductor devices using sliding finger supports
05/08/2001US6227372 Component carrier tray for high-temperature applications
05/08/2001US6227353 System for applying a rotary force to strips of varying widths
05/08/2001US6227345 Transfer apparatus of chip components
05/08/2001US6227213 Method and an apparatus for the wet treatment of a semiconductor wafer
05/08/2001US6227212 Spraying and immersing in cleaning compound and pure water
05/08/2001US6227211 Uniformity improvement of high aspect ratio contact by stop layer
05/08/2001US6227141 RF powered plasma enhanced chemical vapor deposition reactor and methods
05/08/2001US6227140 Semiconductor processing equipment having radiant heated ceramic liner
05/08/2001US6226863 Reworkability method for wirebond chips using high performance capacitor
05/08/2001CA2187269C Semiconductor substrate and producing method thereof
05/08/2001CA2073966C Mosfet structure having reduced gate capacitance and method of forming same
05/08/2001CA2056456C High performance passivation for semiconductor devices
05/07/2001WO2001048790A1 Baffle plate, apparatus for producing the same, method of producing the same, and gas processing apparatus containing baffle plate
05/03/2001WO2001031983A1 Method for providing connection between layers of a circuit board
05/03/2001WO2001031978A1 Ceramic heater
05/03/2001WO2001031709A1 Semiconductor device with a single base region and method therefor
05/03/2001WO2001031706A1 Methods for forming co-axial interconnect lines in a cmos process