| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/10/2001 | US6214523 Laser irradiation to remove unwanted areas of green ceramic paste pad positioned onto green ceramic substrate to write a label pattern, then sintering |
| 04/10/2001 | US6214520 Thermal transfer element for forming multilayer devices |
| 04/10/2001 | US6214516 Photosensitive resin compositions |
| 04/10/2001 | US6214498 Lithography mask and a fabricating method thereof |
| 04/10/2001 | US6214496 Method for reducing corner rounding in mask fabrication utilizing elliptical energy beam |
| 04/10/2001 | US6214446 Resin film and a method for connecting electronic parts by the use thereof |
| 04/10/2001 | US6214441 Use of wee (water edge exposure) to prevent polyimide |
| 04/10/2001 | US6214427 Method of making an electronic device having a single crystal substrate formed by solid state crystal conversion |
| 04/10/2001 | US6214425 Storage box for an object to be protected against physicochemical contamination |
| 04/10/2001 | US6214423 Method of forming a polymer on a surface |
| 04/10/2001 | US6214413 Stencil used to control deposition of material in a physical vapor deposition (pvd) system |
| 04/10/2001 | US6214229 Integrated circuits |
| 04/10/2001 | US6214193 Semiconductor wafers |
| 04/10/2001 | US6214184 Insulated wafer pedestal |
| 04/10/2001 | US6214180 Method for shorting pin grid array pins for plating |
| 04/10/2001 | US6214161 Method and apparatus for anisotropic etching of substrates |
| 04/10/2001 | US6214160 Method and apparatus for removing particulates from semiconductor substrates in plasma processing chambers |
| 04/10/2001 | US6214156 Semiconductor device mounted on board by flip-chip and method for mounting the same |
| 04/10/2001 | US6214152 Lead frame moisture barrier for molded plastic electronic packages |
| 04/10/2001 | US6214130 Supplying cleaning gas comprising 1% to 5% of oxygen and high-purity argon into pipe while heating pipe by changing temperature elevation rate step by step to effectively remove organic matter from the inner wall surface of the pipe |
| 04/10/2001 | US6214129 Supplying into cleaning bath a mixture comprising hydrochloric acid, hydrogen peroxide and water through a filter and a supplying port, and dipping the member in the cleaning bath, at controlled temperature and bubbling rate |
| 04/10/2001 | US6214128 Providing cleaning tank for receiving aqueous solution of ammonia from supply tank, connecting supply tank to cleaning tank with conduit, cooling conduit to temperature low enough that formation of ammonia vapor is prevented, cleaning |
| 04/10/2001 | US6214127 Providing an electronic device workpiece carrier including a plurality of workpiece receivers, positioning individual electronic device workpieces within the workpiece receivers, processing |
| 04/10/2001 | US6214126 Adding at constant time intervals an ammonia solution to a liquid mixture of ammonia and hydrogen peroxide to obtain a concentration in the liquid mixture of 3.5 wt. %, applying the liquid mixture to the silicon oxide coated silicon substrate |
| 04/10/2001 | US6214122 Rapid thermal processing susceptor |
| 04/10/2001 | US6214121 Pedestal with a thermally controlled platen |
| 04/10/2001 | US6214120 High throughput multi-vacuum chamber system for processing wafers and method of processing wafers using the same |
| 04/10/2001 | US6214119 Vacuum substrate processing system having multiple processing chambers and a central load/unload chamber |
| 04/10/2001 | US6214117 Dispensing system and method |
| 04/10/2001 | US6214116 For processing gallium nitride based semiconductors; high quality epitaxial growth because no dust is produced |
| 04/10/2001 | US6214110 Apparatus for producing uniform coating thickness on a spherical substrate |
| 04/10/2001 | US6214109 Apparatus for controlling the oxygen content in silicon wafers heavily doped with antimony or arsenic |
| 04/10/2001 | US6214107 Method for manufacturing a SiC device |
| 04/10/2001 | US6214104 Coating solution for forming silica coating and method of forming silica coating |
| 04/10/2001 | US6214098 Chemical-mechanical polishing slurry |
| 04/10/2001 | US6213858 Belts for polishing semiconductors |
| 04/10/2001 | US6213856 Conditioner and conditioning disk for a CMP pad, and method of fabricating, reworking, and cleaning conditioning disk |
| 04/10/2001 | US6213853 Integral machine for polishing, cleaning, rinsing and drying workpieces |
| 04/10/2001 | US6213852 Polishing apparatus and method of manufacturing a semiconductor device using the same |
| 04/10/2001 | US6213848 Method for determining a polishing recipe based upon the measured pre-polish thickness of a process layer |
| 04/10/2001 | US6213847 Semiconductor wafer polishing device and polishing method thereof |
| 04/10/2001 | US6213846 Real-time control of chemical-mechanical polishing processes using a shaft distortion measurement |
| 04/10/2001 | US6213844 Method for obtaining a desired film thickness using chemical mechanical polishing |
| 04/10/2001 | US6213789 Method and apparatus for interconnecting devices using an adhesive |
| 04/10/2001 | US6213747 Package stack via bottom leaded plastic (BLP) packaging |
| 04/10/2001 | US6213708 System for sorting multiple semiconductor wafers |
| 04/10/2001 | US6213704 Method and apparatus for substrate transfer and processing |
| 04/10/2001 | US6213478 Holding mechanism for a susceptor in a substrate processing reactor |
| 04/10/2001 | US6213443 Anti-vibration apparatus and exposure apparatus using the same |
| 04/10/2001 | US6213386 Method of forming bumps |
| 04/10/2001 | US6213384 Wire bonding method |
| 04/10/2001 | US6213382 Forming a ball at an end of gold alloy wire (composed of palladium and bismuth) passing through a capillary which is lowered to press and bond to an electrode; pulling the wire upward to break it off of the ball bonded to the electode |
| 04/10/2001 | US6213378 Method and apparatus for ultra-fine pitch wire bonding |
| 04/10/2001 | US6213376 Stacked chip process carrier |
| 04/10/2001 | US6213356 Bump forming apparatus and bump forming method |
| 04/10/2001 | US6213347 Low stress method and apparatus of underfilling flip-chip electronic devices |
| 04/10/2001 | US6213136 Robot end-effector cleaner and dryer |
| 04/10/2001 | US6213049 Nozzle-injector for arc plasma deposition apparatus |
| 04/10/2001 | US6212961 Buffer system for a wafer handling system |
| 04/10/2001 | US6212789 Semiconductor device manufacturing system |
| 04/10/2001 | US6212786 Thin board holding device and method of and apparatus for measuring thickness of thin board |
| 04/10/2001 | US6212768 Flip chip mounting method and apparatus therefor |
| 04/10/2001 | US6212767 Assembling a stacked die package |
| 04/10/2001 | CA2217595C An integrated rf switching cell built in cmos technology and utilizing a high voltage integrated circuit diode with a charge injecting node |
| 04/10/2001 | CA2126015C Resist materials |
| 04/10/2001 | CA2069767C High accuracy beam blanker |
| 04/07/2001 | CA2322080A1 New metamorphic heterojunction bipolar transistor having material structure for low cost fabrication on large size gallium arsenide wafers |
| 04/05/2001 | WO2001024581A1 Multi-zone resistance heater |
| 04/05/2001 | WO2001024364A1 Electronic digital circuit operable active mode and sleep mode |
| 04/05/2001 | WO2001024348A1 Method and apparatus for reducing stress across capacitors used in integrated circuits |
| 04/05/2001 | WO2001024279A1 Method for the production of a semiconductor device |
| 04/05/2001 | WO2001024278A1 Trench capacitor with retrograded isolation collar doping to suppress parasitic leakages |
| 04/05/2001 | WO2001024276A1 Semiconductor assembly with charge compensation |
| 04/05/2001 | WO2001024275A1 Ferroelectric transistor and use thereof in a memory cell arrangement |
| 04/05/2001 | WO2001024273A1 High-speed lateral bipolar device in soi process |
| 04/05/2001 | WO2001024272A1 Ferroelectric transistor |
| 04/05/2001 | WO2001024270A1 Ultrahigh speed image pickup device |
| 04/05/2001 | WO2001024268A1 A nonvolatile memory device with a high work function floating-gate and method of fabrication |
| 04/05/2001 | WO2001024261A1 Method for reducing die cracking in integrated circuits |
| 04/05/2001 | WO2001024260A1 Low cost 3d flip-chip packaging technology for integrated power electronics modules |
| 04/05/2001 | WO2001024259A2 Semiconductor packaging |
| 04/05/2001 | WO2001024258A1 Method for producing integrated semiconductor read-only memories (roms) |
| 04/05/2001 | WO2001024257A1 Methods and apparatus for treating seed layer in copper interconnctions |
| 04/05/2001 | WO2001024256A1 Method for the tri-dimensional integration of micro-electronic systems |
| 04/05/2001 | WO2001024255A2 Interferometric method for endpointing plasma etch processes |
| 04/05/2001 | WO2001024254A1 Method for determining the endpoint of etch process steps |
| 04/05/2001 | WO2001024253A1 Semiconductor device with bond pad and test pad |
| 04/05/2001 | WO2001024252A1 Electronic device and method of manufacture thereof |
| 04/05/2001 | WO2001024251A2 Manufacture of trench-gate semiconductor devices |
| 04/05/2001 | WO2001024250A1 Devices with graded top oxide and graded drift region |
| 04/05/2001 | WO2001024249A1 Method for preventing diffusion of boron in silicon by ion implantation of carbon |
| 04/05/2001 | WO2001024248A1 Hydrocarbon gases for anisotropic etching of metal-containing layers |
| 04/05/2001 | WO2001024247A1 Electron beam treatment of fluorinated silicate glass |
| 04/05/2001 | WO2001024246A1 Method of thermally growing a silicon dioxide layer of substantially uniform thickness in a trench |
| 04/05/2001 | WO2001024245A1 Process for ashing organic materials from substrates |
| 04/05/2001 | WO2001024244A1 High etch selectivity etchant for doped silicate glass |
| 04/05/2001 | WO2001024243A1 Method of forming smooth morphologies in inp-based semiconductors |
| 04/05/2001 | WO2001024242A1 Cleaning solution for semiconductor surfaces following chemical-mechanical polishing |
| 04/05/2001 | WO2001024241A1 Method for chemical mechanical polishing |
| 04/05/2001 | WO2001024240A1 Method for manufacturing of a semiconductor device |