| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 07/17/2001 | US6261849 Method of forming integrated circuit capacitors having recessed oxidation barrier spacers and method of forming same |
| 07/17/2001 | US6261845 Determining initial concentrations in liquid streams, mixing to form wet processing stream, measuring flow rates during mixing, using data to calculate concentration of chemicals in processing stream, calculating exposure time, then exposing |
| 07/17/2001 | US6261776 Nucleic acid arrays |
| 07/17/2001 | US6261751 Low temperature anti-reflective coating for IC lithography |
| 07/17/2001 | US6261745 Comprises salt of hydrofluoric acid with base free from metal, organic solvent, water, and acetylene alcohol/alkylene oxide adduct; used in removing photoresist residues via dry-etched, ashed substrates without damaging spin on glass layer |
| 07/17/2001 | US6261743 Antireflective coating compositions comprising photoacid generators |
| 07/17/2001 | US6261735 Composition and method for removing probing ink and negative photoresist from silicon wafers enclosures |
| 07/17/2001 | US6261726 Projection electron-beam lithography masks using advanced materials and membrane size |
| 07/17/2001 | US6261705 Poly-si film and a semiconductor device wherein the poly-si film is applied |
| 07/17/2001 | US6261637 Use of palladium immersion deposition to selectively initiate electroless plating on Ti and W alloys for wafer fabrication |
| 07/17/2001 | US6261635 Applying liquid |
| 07/17/2001 | US6261501 Resin sealing method for a semiconductor device |
| 07/17/2001 | US6261492 Method for fitting a semiconductor chip |
| 07/17/2001 | US6261428 Magnetron plasma process apparatus |
| 07/17/2001 | US6261408 Method and apparatus for semiconductor processing chamber pressure control |
| 07/17/2001 | US6261407 Method and apparatus for removal of thin films from wafers |
| 07/17/2001 | US6261404 Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device |
| 07/17/2001 | US6261382 Wafer marking |
| 07/17/2001 | US6261378 Substrate cleaning unit and cleaning method |
| 07/17/2001 | US6261377 Cleaning, decontaminating, removing using wetted, rotating cleaning pads; used in integrated circuits fabrication; liquid-vapor boundary created on substrate surface |
| 07/17/2001 | US6261375 Plasma processing methods and apparatus |
| 07/17/2001 | US6261373 Method and apparatus for metal oxide chemical vapor deposition on a substrate surface |
| 07/17/2001 | US6261372 Vacuum process system |
| 07/17/2001 | US6261370 Product holder |
| 07/17/2001 | US6261365 Heat treatment method, heat treatment apparatus and treatment system |
| 07/17/2001 | US6261364 Semiconductor single-crystal growth system |
| 07/17/2001 | US6261362 Silicon epitaxial wafer manufacturing method |
| 07/17/2001 | US6261357 Coating liquid for forming low-permittivity silica film and substrate having low-permittivity coating film |
| 07/17/2001 | US6261168 Chemical mechanical planarization or polishing pad with sections having varied groove patterns |
| 07/17/2001 | US6261160 Method and apparatus for specular-polishing of work edges |
| 07/17/2001 | US6261158 Multi-step chemical mechanical polishing |
| 07/17/2001 | US6261157 Selective damascene chemical mechanical polishing |
| 07/17/2001 | US6261155 Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher |
| 07/17/2001 | US6261152 Heterdoyne Thickness Monitoring System |
| 07/17/2001 | US6261048 Multi-level substrate processing apparatus |
| 07/17/2001 | US6261044 Pod to port door retention and evacuation system |
| 07/17/2001 | US6261007 Substrate process method and substrate process apparatus |
| 07/17/2001 | US6260899 Centrifugal gripper mechanism for dynamic force compensation |
| 07/17/2001 | US6260894 Assembly for wafer handling system |
| 07/17/2001 | US6260753 Gold bumps bonding on connection pads and subsequent coining of their vertex |
| 07/17/2001 | US6260741 Method and apparatus for forming droplets |
| 07/17/2001 | US6260610 Convoluted fin heat sinks with base topography for thermal enhancement |
| 07/17/2001 | US6260562 Substrate cleaning apparatus and method |
| 07/17/2001 | US6260285 Precision workpiece positioning device |
| 07/17/2001 | US6260282 Stage control with reduced synchronization error and settling time |
| 07/17/2001 | US6260266 Method of forming wire interconnection wire |
| 07/17/2001 | US6260264 Methods for making z-axis electrical connections |
| 07/17/2001 | US6260259 Solder ball mounting device |
| 07/17/2001 | CA2026605C Multi-level interconnection cmos devices including sog |
| 07/12/2001 | WO2001050818A1 Ceramic heater |
| 07/12/2001 | WO2001050558A1 Group iii-nitride semiconductor structures with reduced phase separation |
| 07/12/2001 | WO2001050557A1 Group iii-nitride semiconductor structures with reduced phase separation |
| 07/12/2001 | WO2001050538A1 A thin film transistor and a method for manufacturing thereof |
| 07/12/2001 | WO2001050536A1 Semiconductor device, method of manufacture thereof, and information processing device |
| 07/12/2001 | WO2001050535A2 Field effect transistor structure with partially isolated source/drain junctions and methods of making same |
| 07/12/2001 | WO2001050533A1 Apparatus for current ballasting esd sensitive devices |
| 07/12/2001 | WO2001050530A1 Anti tamper encapsulation for an integrated circuit |
| 07/12/2001 | WO2001050529A1 Method for making an anti-fuse |
| 07/12/2001 | WO2001050527A1 A semiconductor device having a reduced signal processing time and a method of fabricating the same |
| 07/12/2001 | WO2001050525A2 Integrated circuit die having bond pads near adjacent sides to allow stacking of dice without regard to dice size |
| 07/12/2001 | WO2001050524A1 Interconnection structure with insulation comprising cavities |
| 07/12/2001 | WO2001050523A2 Method to measure alignment using latent image grating structures |
| 07/12/2001 | WO2001050522A1 Method for determining optimal process targets in microelectronic fabrication |
| 07/12/2001 | WO2001050521A1 Process control system |
| 07/12/2001 | WO2001050520A1 In-situ contril of a dry etcher |
| 07/12/2001 | WO2001050519A2 Method of minimizing placement-related defects in the placement of semiconductor chips and other microelectronic components |
| 07/12/2001 | WO2001050518A1 Method of forming a self-aligned contact opening |
| 07/12/2001 | WO2001050517A1 Semiconductor package and enhanced fbg manufacturing |
| 07/12/2001 | WO2001050516A1 Method of manufacturing a thin-film transistor |
| 07/12/2001 | WO2001050515A1 Thin-film transistor |
| 07/12/2001 | WO2001050514A1 Thin film transistor |
| 07/12/2001 | WO2001050513A1 Thin film transistor |
| 07/12/2001 | WO2001050512A1 Thin-film transistor and its manufacturing method |
| 07/12/2001 | WO2001050511A1 Semiconductor manufacture using helium-assisted etch |
| 07/12/2001 | WO2001050510A2 Low thermal budget metal oxide deposition for capacitor structures |
| 07/12/2001 | WO2001050509A1 High dielectric constant material deposition to achieve high capacitance |
| 07/12/2001 | WO2001050508A1 Etch and ash photoresist removal process |
| 07/12/2001 | WO2001050507A1 Methods of forming semiconductor structures |
| 07/12/2001 | WO2001050506A1 Mask recycle process |
| 07/12/2001 | WO2001050505A2 A microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece |
| 07/12/2001 | WO2001050504A2 An improved method for buried anti-reflective coating removal |
| 07/12/2001 | WO2001050503A1 Advanced wafer passive end-effector |
| 07/12/2001 | WO2001050502A1 Method and apparatus for the treatment of substrates |
| 07/12/2001 | WO2001050501A2 Silicon corner rounding by ion implantation for shallow trench isolation |
| 07/12/2001 | WO2001050498A1 Linear drive system for use in a plasma processing system |
| 07/12/2001 | WO2001050497A1 Electrode assembly |
| 07/12/2001 | WO2001050496A1 Automated high-density plasma (hdp) workpiece temperature control |
| 07/12/2001 | WO2001050415A2 Flip-chip mounted integrated circuit card element |
| 07/12/2001 | WO2001050206A1 Wafer manufacturing control |
| 07/12/2001 | WO2001050198A2 Method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows |
| 07/12/2001 | WO2001050171A1 Projection lens comprising adjacent aspheric lens surfaces |
| 07/12/2001 | WO2001050161A1 CALCIUM FLUORIDE (CaF2) STRESS PLATE AND METHOD OF MAKING THE SAME |
| 07/12/2001 | WO2001050109A2 Wafer band-edge measurement using spectroscopy and a process of uniform wafer temperature control |
| 07/12/2001 | WO2001050084A1 Specimen topography reconstruction |
| 07/12/2001 | WO2001050061A1 Method and device for forming required gas atmosphere |
| 07/12/2001 | WO2001049898A1 Method for metal plating, pre-treating agent, and semiconductor wafer and semiconductor device using the same |
| 07/12/2001 | WO2001049896A1 Methods of forming a high k dielectric layer and a capacitor |
| 07/12/2001 | WO2001049894A1 Multi wafer introduction/single wafer conveyor mode processing system and method of processing wafers using the same |
| 07/12/2001 | WO2001049450A1 Chemical mechanical polishing process for manufacturing dopant-striation-free silicon wafers |
| 07/12/2001 | WO2001049389A1 Method and apparatus for metal removal by ion exchange |