Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2001
07/24/2001US6265244 Method for mounting semiconductor elements
07/24/2001US6265243 Process for fabricating organic circuits
07/24/2001US6265235 Method of sectioning of photoresist for shape evaluation
07/24/2001US6265234 Alignment system for a spherical device
07/24/2001US6265233 Method for determining crack limit of film deposited on semiconductor wafer
07/24/2001US6265232 Yield based, in-line defect sampling method
07/24/2001US6265231 Process control via valve position and rate of position change monitoring
07/24/2001US6265230 Methods to cure the effects of hydrogen annealing on ferroelectric capacitors
07/24/2001US6265138 Process and apparatus for oblique beam revolution, for the effective laser stripping of sidewalls
07/24/2001US6265137 Exposure method and device producing method using the same
07/24/2001US6265135 Positive-working electron beam or X-ray resist composition
07/24/2001US6265129 Form a resist pattern that had a micro-groove in each element and which yet was satisfactory in feature profile and resolution.
07/24/2001US6265119 Method for producing semiconductor devices
07/24/2001US6265114 Method of generating mask data in fabricating semiconductor devices
07/24/2001US6265113 Stress adjustment method of X-ray mask
07/24/2001US6265089 Electronic devices grown on off-axis sapphire substrate
07/24/2001US6265085 Bonding material and bump
07/24/2001US6265042 Adhesive tape for electronic parts
07/24/2001US6264906 Method for heat treatment of silicon substrate, substrate treated by the method, and epitaxial wafer utilizing the substrate
07/24/2001US6264862 Method for manufacturing a plug
07/24/2001US6264852 Substrate process chamber and processing method
07/24/2001US6264843 Process for reclaiming a suspension
07/24/2001US6264812 Method and apparatus for generating a plasma
07/24/2001US6264789 System for dispensing polishing liquid during chemical mechanical polishing of a semiconductor wafer
07/24/2001US6264785 Mounting structure of electric part and mounting method thereof
07/24/2001US6264752 Reactor for processing a microelectronic workpiece
07/24/2001US6264749 Process and apparatus for making composite films
07/24/2001US6264748 Substrate processing apparatus
07/24/2001US6264709 Method for making electrical and electronic devices with vertically integrated and interconnected thin-film type battery
07/24/2001US6264706 Used foor manufacturing semiconductor device or liquid crystal display device
07/24/2001US6264705 Processing system
07/24/2001US6264704 Method and apparatus for mounting component
07/24/2001US6264533 Abrasive processing apparatus and method employing encoded abrasive product
07/24/2001US6264477 Photolithographically patterned spring contact
07/24/2001US6264467 Micro grooved support surface for reducing substrate wear and slip formation
07/24/2001US6264404 System and method for hydrodynamic loading and unloading of objects into and out of substantially touchless hydrodynamic transport systems
07/24/2001US6264381 Process system
07/24/2001US6264246 Purge system and purge joint
07/24/2001US6264097 Method for forming a solder ball
07/24/2001US6264094 Rework and underfill nozzle for electronic components
07/24/2001US6264089 Connecting apparatus
07/24/2001US6264064 Chemical delivery system with ultrasonic fluid sensors
07/24/2001US6264037 Tray for ball grid array integrated circuit
07/24/2001US6264036 Process cassette
07/24/2001US6263941 Nozzle for cleaving substrates
07/24/2001US6263830 Microwave choke for remote plasma generator
07/24/2001US6263829 Process chamber having improved gas distributor and method of manufacture
07/24/2001US6263740 CMOS compatible integrated pressure sensor
07/24/2001US6263605 Pad conditioner coupling and end effector for a chemical mechanical planarization system and method therefor
07/24/2001US6263588 Vacuum processing apparatus and operating method therefor
07/24/2001US6263587 Degassing method using simultaneous dry gas flux pressure and vacuum
07/24/2001US6263586 Device and method for planarizing a thin film
07/24/2001US6263563 Method of manufacturing and checking electronic components
07/24/2001US6263542 Tolerance resistant and vacuum compliant door hinge with open-assist feature
07/24/2001CA2280904C Methods for forming a structured metallization on a semiconductor wafer
07/24/2001CA2211699C Nonvolatile magnetoresistive memory with fully closed-flux operation
07/24/2001CA2055665C Field effect transistor
07/19/2001WO2001052398A1 Charge pump circuit
07/19/2001WO2001052326A1 Virtual-ground, split-gate flash memory cell arrangements
07/19/2001WO2001052322A1 Semiconductor device, metal laminated plate for fabricating circuit on semiconductor, and method of fabricating circuit
07/19/2001WO2001052321A2 Uniform recess depth of recessed resist layers in trench structures
07/19/2001WO2001052320A2 A method for requesting trace data reports from fault detection controlled semiconductor fabrication processes
07/19/2001WO2001052319A1 Method and apparatus for determining measurement frequency based on hardware age and usage
07/19/2001WO2001052318A1 Part mounter
07/19/2001WO2001052317A1 Method and device for chip mounting
07/19/2001WO2001052316A1 Chip mounting method
07/19/2001WO2001052315A1 Semiconductor device and method for producing the same
07/19/2001WO2001052313A1 Top gate thin-film transistor and method of producing the same
07/19/2001WO2001052312A1 Semiconductor wafer manufacturing process
07/19/2001WO2001052311A2 Method of preparing a semiconductor substrate for subsequent silicide formation
07/19/2001WO2001052310A1 Method of performing plasma warm-up on semiconductor wafers
07/19/2001WO2001052309A1 Method of surface preparation
07/19/2001WO2001052307A2 Semiconductor workpiece proximity plating methods and apparatus
07/19/2001WO2001052303A1 Liner for semiconductor etching chamber
07/19/2001WO2001052302A1 Segmented electrode assembly and method for plasma processing
07/19/2001WO2001052301A1 Electron-optical corrector for eliminating third-order aberrations
07/19/2001WO2001052271A1 Dielectric material and process for producing the same, and semiconductor device made therewith and process for producing the same
07/19/2001WO2001051979A2 Microlithographic reduction projection catadioptric objective
07/19/2001WO2001051942A1 Method for testing circuits with tri-state drivers and circuit for use therewith
07/19/2001WO2001051866A1 Method and apparatus for high-pressure wafer processing and drying
07/19/2001WO2001051680A1 Vacuum processing apparatus
07/19/2001WO2001051679A2 Anti-reflective coating process and apparatus
07/19/2001WO2001051580A1 Porous adhesive sheet, semiconductor wafer with porous adhesive sheet, and method of manufacture thereof
07/19/2001WO2001051243A2 Laser system and method for processing a memory link with a burst of laser pulses having ultrashort pulsewidths
07/19/2001WO2001045160A8 Ceramic heater and support pin
07/19/2001WO2001024581A8 Multi-zone resistance heater
07/19/2001WO2001015219A3 Method for producing an integrated circuit having at least one metalicized surface
07/19/2001WO2001006542A3 Method for producing a vertical semiconductor transistor component element and a vertical semiconductor transistor component
07/19/2001WO2000070654A3 Low-resistance vdmos semiconductor component
07/19/2001WO2000067297A3 Method of producing a semiconductor element
07/19/2001WO2000034998A9 Process and system for rinsing of semiconductor substrates
07/19/2001WO2000029636A9 High purity tantalum targets for sputtering
07/19/2001US20010009029 Device and method for testing integrated circuit dice in an integrated circuit module
07/19/2001US20010008993 Non-invasive system and method for diagnosing potential malfunctions of semiconductor equipment components
07/19/2001US20010008983 Carrier system for carrying objects, carrier unit constituting carrier system, and control system for carrier system
07/19/2001US20010008878 Comprising boric acid, organic amine, water, optional glycol solvent, chelating agent
07/19/2001US20010008830 CMP polishing pad
07/19/2001US20010008828 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing process
07/19/2001US20010008827 Polishing apparatus
07/19/2001US20010008809 Forming a resist layer on a target layer and patterning the resist layer to form original openings and a slit in the resist layer, reflowing resist layer patterned under heat to cause deformation of original openings and the slit