Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2001
07/03/2001US6255726 Vertical interconnect process for silicon segments with dielectric isolation
07/03/2001US6255721 Method and tool for handling micro-mechanical structures
07/03/2001US6255718 Laser ablateable material
07/03/2001US6255717 Shallow trench isolation using antireflection layer
07/03/2001US6255716 Bipolar junction transistors having base electrode extensions
07/03/2001US6255715 Fuse window guard ring structure for nitride capped self aligned contact processes
07/03/2001US6255714 Integrated circuit having a micromagnetic device including a ferromagnetic core and method of manufacture therefor
07/03/2001US6255712 Semi-sacrificial diamond for air dielectric formation
07/03/2001US6255711 Encroachless LOCOS isolation
07/03/2001US6255710 3-D smart power IC
07/03/2001US6255706 Thin film transistor and method of manufacturing same
07/03/2001US6255705 Producing devices having both active matrix display circuits and peripheral circuits on a same substrate
07/03/2001US6255704 Semiconductor device and method for fabricating the same
07/03/2001US6255703 Device with lower LDD resistance
07/03/2001US6255702 Semiconductor device having junction depths for reducing short channel effect
07/03/2001US6255701 Semiconductor device containing local interconnection and method of manufacturing the same
07/03/2001US6255700 CMOS semiconductor device
07/03/2001US6255699 Pillar CMOS structure
07/03/2001US6255698 Separately optimized gate structures for n-channel and p-channel transistors in an integrated circuit
07/03/2001US6255697 Integrated circuit devices including distributed and isolated dummy conductive regions
07/03/2001US6255696 Retrograde ESD protection apparatus
07/03/2001US6255695 TFT CMOS logic circuit having source/drain electrodes of differing spacing from the gate electrode for decreasing wiring capacitance and power consumption
07/03/2001US6255694 Multi-function semiconductor structure and method
07/03/2001US6255693 Ion implantation with programmable energy, angle, and beam current
07/03/2001US6255692 Trench-gate semiconductor device
07/03/2001US6255691 Nonvolatile semiconductor memory device and manufacturing process thereof
07/03/2001US6255690 Non-volatile semiconductor memory device
07/03/2001US6255689 Flash memory structure and method of manufacture
07/03/2001US6255688 A capacitor dielectric that is subject to reduction by titanium and sandwiched between one electrode located on an interconnect made of layers of aluminum or aluminum alloy and a second electrode
07/03/2001US6255687 Doped silicon structure with impression image on opposing roughened surfaces
07/03/2001US6255686 Semiconductor storage device including short circuit avoiding structure and method of fabricating thereof
07/03/2001US6255685 Semiconductor device and method of manufacturing the same
07/03/2001US6255684 DRAM cell configuration and method for its production
07/03/2001US6255683 Dynamic random access memory
07/03/2001US6255682 Trench DRAM cells with self-aligned field plate
07/03/2001US6255679 Field effect transistor which can operate stably in millimeter wave band
07/03/2001US6255678 Apparatus for measuring physical and chemical phenomena
07/03/2001US6255675 Programmable capacitor for an integrated circuit
07/03/2001US6255673 Hetero-junction field effect transistor
07/03/2001US6255671 Metal embedded passivation layer structure for microelectronic interconnect formation, customization and repair
07/03/2001US6255668 Thin film transistor with inclined eletrode side surfaces
07/03/2001US6255663 Charged particle beam exposure apparatus and semiconductor device manufacturing method
07/03/2001US6255661 Mirror projection system for a scanning lithographic projection apparatus, and lithographic apparatus comprising such a system
07/03/2001US6255601 Conductive feedthrough for a ceramic body and method of fabricating same
07/03/2001US6255599 Relocating the neutral plane in a PBGA substrate to eliminate chip crack and interfacial delamination
07/03/2001US6255586 Interlocked bonding pad structures and methods of fabrication therefor
07/03/2001US6255585 Packaging and interconnection of contact structure
07/03/2001US6255447 Oligomers or polymers which demonstrate fluorescence, high glass transition temperatures or liquid-crystalline properties; facilitate preparation of films having high heat resistance and solvent resistance
07/03/2001US6255423 Pressure sensitive adhesive sheet and use thereof
07/03/2001US6255405 Radiation absorbing copolymer comprising recurring unit containing organic chromophore
07/03/2001US6255233 In-situ silicon nitride and silicon based oxide deposition with graded interface for damascene application
07/03/2001US6255232 Spin-on-polymer dielectric material being susceptible to greater shrinkage when thermally processed at sub-atmospheric pressure than when thermally processed at atmospheric pressure; polyarylene ether or fluorinated polyarylene ether
07/03/2001US6255231 Method for forming a gate oxide layer
07/03/2001US6255230 Method for modifying a film forming surface of a substrate on which a film is to be formed, and method for manufacturing a semiconductor device using the same
07/03/2001US6255229 Method for forming semiconductor dielectric layer
07/03/2001US6255228 Method for removing contaminants from a semiconductor wafer
07/03/2001US6255227 Etching process of CoSi2 layers
07/03/2001US6255226 Optimized metal etch process to enable the use of aluminum plugs
07/03/2001US6255225 Method of forming a resist pattern, a method of manufacturing semiconductor device by the same method, and a device and a hot plate for forming a resist pattern
07/03/2001US6255224 Method of forming contact for semiconductor device
07/03/2001US6255223 Substrate handling method and apparatus, and attractive force inspection method and apparatus used therewith
07/03/2001US6255222 Method for removing residue from substrate processing chamber exhaust line for silicon-oxygen-carbon deposition process
07/03/2001US6255221 Methods for running a high density plasma etcher to achieve reduced transistor device damage
07/03/2001US6255219 Method for fabricating high-performance submicron MOSFET with lateral asymmetric channel
07/03/2001US6255218 Semiconductor device and fabrication method thereof
07/03/2001US6255217 Plasma treatment to enhance inorganic dielectric adhesion to copper
07/03/2001US6255216 Forming titanium silicide by chemical vapor deposition (cvd) on an exposed silicon base layer of the contact hole; forming a barrier layer on the titanium silicide; and forming a plug material on the barrier layer.
07/03/2001US6255215 Semiconductor device having silicide layers formed using a collimated metal layer
07/03/2001US6255214 Method of forming junction-leakage free metal silicide in a semiconductor wafer by amorphization of source and drain regions
07/03/2001US6255213 Method of forming a structure upon a semiconductive substrate
07/03/2001US6255211 Silicon carbide stop layer in chemical mechanical polishing over metallization layers
07/03/2001US6255210 Semiconductor dielectric structure and method for making the same
07/03/2001US6255209 Methods of forming a contact having titanium formed by chemical vapor deposition
07/03/2001US6255208 Selective wafer-level testing and burn-in
07/03/2001US6255207 Composite planarizing dielectric layer employing high density plasma chemical vapor deposited (HDP-CVD) underlayer
07/03/2001US6255206 Method of forming gate electrode with titanium polycide structure
07/03/2001US6255205 High density programmable read-only memory employing double-wall spacers
07/03/2001US6255204 Method for forming a semiconductor device
07/03/2001US6255203 Technique for low-temperature formation of excellent silicided α-Si gate structures
07/03/2001US6255202 Damascene T-gate using a spacer flow
07/03/2001US6255201 Method and device for activating semiconductor impurities
07/03/2001US6255200 Polysilicon structure and process for improving CMOS device performance
07/03/2001US6255199 Method of producing polycrystalline silicon
07/03/2001US6255198 Methods of fabricating gallium nitride microelectronic layers on silicon layers and gallium nitride microelectronic structures formed thereby
07/03/2001US6255197 Hydrogen annealing method and apparatus
07/03/2001US6255196 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
07/03/2001US6255195 Method for forming a bonded substrate containing a planar intrinsic gettering zone and substrate formed by said method
07/03/2001US6255194 Trench isolation method
07/03/2001US6255193 Method for fabricating an isolation trench using an auxiliary layer
07/03/2001US6255192 Methods for barrier layer formation
07/03/2001US6255191 Method of fabricating an isolation structure in an integrated circuit
07/03/2001US6255190 Method for dielectrically isolated deep pn-junctions in silicon substrates using deep trench sidewall predeposition technology
07/03/2001US6255189 Method of manufacturing a semiconductor device in a silicon body, a surface of said silicon body being provided with an alignment grating and an at least partly recessed oxide pattern
07/03/2001US6255188 Method of removing a polysilicon buffer using an etching selectivity solution
07/03/2001US6255187 Method of fabricating self-aligning stacked capacitor using electroplating method
07/03/2001US6255186 Methods of forming integrated circuitry and capacitors having a capacitor electrode having a base and a pair of walls projecting upwardly therefrom
07/03/2001US6255185 Two step anneal for controlling resistor tolerance
07/03/2001US6255184 Fabrication process for a three dimensional trench emitter bipolar transistor
07/03/2001US6255183 Manufacture of a semiconductor device with a MOS transistor having an LDD structure using SiGe spacers
07/03/2001US6255182 Method of forming a gate structure of a transistor by means of scalable spacer technology