Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2001
07/10/2001US6258677 Method of fabricating wedge isolation transistors
07/10/2001US6258676 High density plasma vapor deposition
07/10/2001US6258675 High K gate electrode
07/10/2001US6258674 High voltage field effect transistor and method of fabricating the same
07/10/2001US6258673 Multiple thickness of gate oxide
07/10/2001US6258671 Methods of providing spacers over conductive line sidewalls, methods of forming sidewall spacers over etched line sidewalls, and methods of forming conductive lines
07/10/2001US6258670 Method for improving breakdown voltage of a semiconductor transistor
07/10/2001US6258669 Methods and arrangements for improved formation of control and floating gates in non-volatile memory semiconductor devices
07/10/2001US6258668 Array architecture and process flow of nonvolatile memory devices for mass storage applications
07/10/2001US6258667 Method for implementing embedded flash
07/10/2001US6258666 Method of producing semiconductor thin film and method of producing solar cell using same
07/10/2001US6258665 Non-volatile semiconductor memory device and method for manufacturing the same
07/10/2001US6258664 Methods of forming silicon-comprising materials having roughened outer surfaces, and methods of forming capacitor constructions
07/10/2001US6258663 Method for forming storage node
07/10/2001US6258662 Method for forming cylindrical DRAM capacitors
07/10/2001US6258661 Formation of out-diffused bitline by laser anneal
07/10/2001US6258660 Method of making a self-aligned recessed container cell capacitor
07/10/2001US6258659 Embedded vertical DRAM cells and dual workfunction logic gates
07/10/2001US6258658 Memory cell configuration and corresponding fabrication method
07/10/2001US6258656 Capacitor with high-ε dielectric or ferroelectric material based on the fin stack principle and production process using a negative mold
07/10/2001US6258655 Method for improving the resistance degradation of thin film capacitors
07/10/2001US6258654 Method of manufacturing a semiconductor device
07/10/2001US6258653 Silicon nitride barrier for capacitance maximization of tantalum oxide capacitor
07/10/2001US6258652 Spiral-shaped inductor structure for monolithic microwave integrated circuits having air gaps in underlying pedestal
07/10/2001US6258651 Method for forming an embedded memory and a logic circuit on a single substrate
07/10/2001US6258650 Method for manufacturing semiconductor memory device
07/10/2001US6258649 Semiconductor integrated circuit device and method of manufacturing the same
07/10/2001US6258648 Selective salicide process by reformation of silicon nitride sidewall spacers
07/10/2001US6258647 Method of fabricating semiconductor device
07/10/2001US6258646 CMOS integrated circuit and method for implanting NMOS transistor areas prior to implanting PMOS transistor areas to optimize the thermal diffusivity thereof
07/10/2001US6258645 Halo structure for CMOS transistors and method of manufacturing the same
07/10/2001US6258644 Mixed voltage CMOS process for high reliability and high performance core and I/O transistors with reduced mask steps
07/10/2001US6258643 Method for forming twin gate CMOS
07/10/2001US6258640 Semiconductor device manufacturing method
07/10/2001US6258639 Sintered gate schottky barrier fet passivated by a degradation-stop layer
07/10/2001US6258638 Method of manufacturing thin film transistor
07/10/2001US6258637 Method for thin film deposition on single-crystal semiconductor substrates
07/10/2001US6258635 Removal of metal contaminants from the surface of a silicon substrate by diffusion into the bulk
07/10/2001US6258632 Molded packaging for semiconductor device and method of manufacturing the same
07/10/2001US6258630 Resin-sealed semiconductor device having island for mounting semiconductor element coupled to heat spreader
07/10/2001US6258628 Method and apparatus for processing resin sealed lead frame
07/10/2001US6258627 Underfill preform interposer for joining chip to substrate
07/10/2001US6258626 Method of making stacked chip package
07/10/2001US6258625 Method of interconnecting electronic components using a plurality of conductive studs
07/10/2001US6258622 Flip clip bonding leadframe-type packaging method for integrated circuit device and a device formed by the packaging method
07/10/2001US6258619 Fabrication of semiconductor light emitting device
07/10/2001US6258615 Method of varying a characteristic of an optical vertical cavity structure formed by metalorganic vapor phase epitaxy
07/10/2001US6258613 Control methods of semiconductor manufacturing process, semiconductor manufacturing equipment, and semiconductor manufacturing environment
07/10/2001US6258612 Determination of flux prior to package assembly
07/10/2001US6258611 Method for determining translation portion of misalignment error in a stepper
07/10/2001US6258610 Method analyzing a semiconductor surface using line width metrology with auto-correlation operation
07/10/2001US6258609 Method and system for making known good semiconductor dice
07/10/2001US6258608 Method for forming a crystalline perovskite ferroelectric material in a semiconductor device
07/10/2001US6258595 Compositions and methods for helper-free production of recombinant adeno-associated viruses
07/10/2001US6258513 Phase shifting
07/10/2001US6258511 Dividing pattern to be transferred; forming stripes; masking; exposuring zones; transferring light source
07/10/2001US6258507 Photoresist compositions
07/10/2001US6258506 Ultraviolet-curable polysiloxane composition and method for the formation of cured patterns therefrom
07/10/2001US6258497 For semiconductors; homogeneity markers
07/10/2001US6258492 X-ray mask structure and method of making the same
07/10/2001US6258491 Membrane on support substrate
07/10/2001US6258466 Metallization on titanium aluminide
07/10/2001US6258449 Low-thermal expansion circuit board and multilayer circuit board
07/10/2001US6258440 Ceramic parts and a producing process thereof
07/10/2001US6258437 Test structure and methodology for characterizing etching in an integrated circuit fabrication process
07/10/2001US6258426 Ultraviolet curing pressure-sensitive adhesive sheet
07/10/2001US6258411 Pregrounding; overcaoting nickel alloy with fluorine
07/10/2001US6258407 Precursors for making low dielectric constant materials with improved thermal stability
07/10/2001US6258314 Preparing lead frame having an inner lead portion and die pad portion, a semiconductor chip being bonded on die pad portion; attaching sealing sheet; placing in mold; applying tension; pressing; encapsulating to form resin molding
07/10/2001US6258244 Treating method and apparatus utilizing chemical reaction
07/10/2001US6258241 Process for electroplating metals
07/10/2001US6258240 Anodizing apparatus and method
07/10/2001US6258228 Wafer holder and clamping ring therefor for use in a deposition chamber
07/10/2001US6258227 Method and apparatus for fabricating a wafer spacing mask on a substrate support chuck
07/10/2001US6258223 In-situ electroless copper seed layer enhancement in an electroplating system
07/10/2001US6258220 Electro-chemical deposition system
07/10/2001US6258205 Endpoint detection method and apparatus which utilize an endpoint polishing layer of catalyst material
07/10/2001US6258198 Method and apparatus for applying a protecting film to a semiconductor wafer
07/10/2001US6258192 Multi-thickness, multi-layer green sheet processing
07/10/2001US6258191 Method and materials for increasing the strength of crystalline ceramic
07/10/2001US6258174 Gas supplying apparatus
07/10/2001US6258173 Film forming apparatus for forming a crystalline silicon film
07/10/2001US6258170 Vaporization and deposition apparatus
07/10/2001US6258169 Control apparatus and control method
07/10/2001US6258167 Process liquid film forming apparatus
07/10/2001US6258137 CMP products
07/10/2001US6257966 Wafer surface machining apparatus
07/10/2001US6257960 Lapping method and method for manufacturing lapping particles for use in the lapping method
07/10/2001US6257857 Molding apparatus for flexible substrate based package
07/10/2001US6257827 Apparatus and method for transporting substrates
07/10/2001US6257778 Method for developing front surface of substrate with improved developing function of developing solution and apparatus thereof
07/10/2001US6257760 Using a superlattice to determine the temperature of a semiconductor fabrication process
07/10/2001US6257564 Vacuum chuck having vacuum-nipples wafer support
07/10/2001US6257270 Fluid control device
07/10/2001US6257255 Substrate treatment device
07/10/2001US6257224 Process for working a preform made of an oxide single crystal, and a process for producing functional devices
07/10/2001US6257168 Elevated stationary uniformity ring design
07/10/2001US6257045 Automated substrate processing systems and methods
07/10/2001US6256880 Method for preparing side attach pad traces through buried conductive material
07/10/2001US6256875 Method for manufacturing semiconductor device