| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 07/19/2001 | US20010008050 Vacuum processing apparatus and operating method therefor |
| 07/19/2001 | DE19963824A1 Semiconductor material processing method has electromagnetic beam directed onto local area across which reactive fluid is passed |
| 07/19/2001 | DE19963813A1 Schaltungsanordnung zur Regelung des Leistungsverbrauchs eines integrierten Schaltkreises Circuit arrangement for controlling the power consumption of an integrated circuit |
| 07/19/2001 | DE19963587A1 Optische Anordnung Optical arrangement |
| 07/19/2001 | DE19962431A1 Verfahren zum Herstellen einer Halbleiteranordnung A method of manufacturing a semiconductor device |
| 07/19/2001 | DE10101900A1 Semiconductor component used in integrated circuits comprises zones of various conductivity types, an insulating film, a gate electrode and main electrodes |
| 07/19/2001 | DE10101630A1 Halbleiterspeicherbauelement mit Eingabe-/Ausgabeleitungsstruktur Semiconductor memory device with input / output line structure |
| 07/19/2001 | DE10101568A1 Semiconductor device used as a transistor of the trench-gate type comprises a semiconductor substrate with a trench formed in the main surface and an insulating film arranged on an inner wall of the trench |
| 07/19/2001 | DE10101073A1 Image processing system transfers image pixel color information data from first to second memory without transfer of alpha-value information |
| 07/19/2001 | DE10100816A1 Abtastung integrierter Schaltungen mit differentiell gepulstem Laserstrahl Scanning of integrated circuits with differential pulsed laser beam |
| 07/19/2001 | DE10100194A1 Semiconductor-on-insulator field effect transistor comprises a silicon-germanium layer between an electrically insulating layer and a silicon active layer |
| 07/19/2001 | DE10065852A1 Semiconductor device has bridging capacitor providing connection between 2 separate circuits formed in semiconductor substrate |
| 07/19/2001 | DE10064234A1 Halbleiter-Speichervorrichtung mit einem dreifachen Trogaufbau The semiconductor memory device with a triple trough assembly |
| 07/19/2001 | DE10064067A1 Verfahren zur Herstellung von Halbleitereinrichtungskondensatoren A process for producing semiconductor device capacitors |
| 07/19/2001 | DE10063631A1 Virtual channel synchronized with a dynamic RAM for driving memory cells uses a semiconductor memory device with a base cell structure for a word driver, a main decoder and a reader booster for reading out information from the cells. |
| 07/19/2001 | DE10060665A1 Nichtflüchtiger ferroelektrischer Speicher und Verfahren zu dessen Herstellung A non-volatile ferroelectric memory and method for its production |
| 07/19/2001 | DE10060584A1 Bipolar transistor comprises used for high frequency operations a silicon layer, a silicon epitaxial layer of first type, a silicon-germanium epitaxial layer and a silicon epitaxial layer of second type |
| 07/19/2001 | DE10046945A1 Production of a non-volatile storage device comprises forming trench insulations on a substrate, forming source and drain regions between neighboring insulations |
| 07/19/2001 | DE10045114A1 Semiconductor memory has lower electrode of stacked capacitor coupled to underlying semiconductor substrate via conductor plug projecting through intermediate layer |
| 07/19/2001 | DE10044470A1 Semiconducting device manufacturing method involves forming dielectric layer with contact hole on substrate, forming conductive layer, etching dielectric layer to defined thickness |
| 07/19/2001 | DE10041960A1 Control method for semiconductor device manufacturing arrangement involves predicting time at which processing of last wafer in ready state starts to set transport start time for next item |
| 07/19/2001 | DE10040397A1 Process controller e.g. for semiconductor manufacture, selects item to be processed from number of items based on performance of processing device evaluated by evaluation unit and characteristics of items |
| 07/19/2001 | DE10018638A1 Compact semiconductor element comprises a wafer having a chip region, a substrate arranged on the chip region, conducting bodies, a distancing device between the wafer and the substrate and component contacts |
| 07/19/2001 | DE10009678C1 Heat conducting adhesive joint between two workpieces used in the production of electronic components comprises a layer of heat conducting material having two flat sided surfaces with openings on each surface |
| 07/19/2001 | DE10009345C1 Field effect transistor device with trench-shaped gate electrode |
| 07/19/2001 | DE10001277A1 Elektronenoptischer Korrektor zur Beseitigung der Bildfehler dritter Ordnung Electron optical corrector to eliminate the aberrations of the third order |
| 07/19/2001 | CA2395960A1 Laser system and method for processing a memory link with a burst of laser pulses having ultrashort pulsewidths |
| 07/19/2001 | CA2393940A1 Method for testing circuits with tri-state drivers and circuit for use therewith |
| 07/19/2001 | CA2393283A1 Liner for semiconductor etching chamber |
| 07/18/2001 | EP1117136A1 Ferromagnetic double quantum well tunnel magneto-resistance device |
| 07/18/2001 | EP1117133A1 Semiconductor device and method for the same manufacturing |
| 07/18/2001 | EP1117132A1 Ferroelectric device and semiconductor device |
| 07/18/2001 | EP1117131A2 Method of forming alignment marks |
| 07/18/2001 | EP1117130A2 Heatsink method of manufacturing the same and cooling apparatus using the same |
| 07/18/2001 | EP1117129A2 Semiconductor wafer inspection machine |
| 07/18/2001 | EP1117128A2 Method and apparatus for orienting substrates |
| 07/18/2001 | EP1117127A1 Arrangement for supporting disklike objects in a processing system |
| 07/18/2001 | EP1117110A2 Fabrication method of solid electrolytic capacitor |
| 07/18/2001 | EP1117009A2 Method of making resist pattern |
| 07/18/2001 | EP1117008A2 UV-assisted chemical modification of photoresist images |
| 07/18/2001 | EP1117002A1 Negative-working resist composition |
| 07/18/2001 | EP1116998A2 Blank for halftone phase shift photomask and halftone phase shift photomask |
| 07/18/2001 | EP1116762A1 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing process |
| 07/18/2001 | EP1116552A2 Polishing apparatus with thickness measuring means |
| 07/18/2001 | EP1116314A1 Protective circuit on an integrated circuit |
| 07/18/2001 | EP1116282A2 VERTICAL GEOMETRY InGaN LED |
| 07/18/2001 | EP1116279A1 Semiconductor device |
| 07/18/2001 | EP1116278A1 Bipolar transistor and method for producing same |
| 07/18/2001 | EP1116277A1 Connection arrangement for a semiconductor device and method of manufacturing same |
| 07/18/2001 | EP1116275A1 Non-volatile semiconductor memory device |
| 07/18/2001 | EP1116274A1 Electronic switching device with at least two semiconductor components |
| 07/18/2001 | EP1116273A1 Semiconductor device comprising a high-voltage circuit element |
| 07/18/2001 | EP1116270A1 Integrated circuit comprising vertical transistors, and a method for the production thereof |
| 07/18/2001 | EP1116269A1 Complementary bipolar/cmos epitaxial structure and process |
| 07/18/2001 | EP1116267A1 Process for making high perf0rmance mosfet with an inverted t-shaped gate electrode |
| 07/18/2001 | EP1116266A1 Method for producing self-polarized ferro-electric layers, especially pzt layers, with a rhombohedral crystal structure |
| 07/18/2001 | EP1116265A1 Low capacitance dielectric layer etching using hydrogen-nitrogen plasma |
| 07/18/2001 | EP1116264A1 Device and method for etching spacers formed upon an integrated circuit gate conductor |
| 07/18/2001 | EP1116263A2 Method for producing an ohmic contact |
| 07/18/2001 | EP1116262A2 Heating device containing a multi-lamp cone for heating semiconductor wafers |
| 07/18/2001 | EP1116261A1 Method and apparatus for cooling substrates |
| 07/18/2001 | EP1116248A1 Method of manufacturing a magnetic tunnel junction device |
| 07/18/2001 | EP1116236A1 Method of making flexibly partitioned metal line segments for a simultaneous operation flash memory device with a flexible bank partition architecture |
| 07/18/2001 | EP1116180A1 Method for contacting a circuit chip |
| 07/18/2001 | EP1116141A1 A regionally time multiplexed emulation system |
| 07/18/2001 | EP1116099A1 Prealigner and planarity teaching station |
| 07/18/2001 | EP1116074A1 Environment exchange control for material on a wafer surface |
| 07/18/2001 | EP1116072A1 Low thermal distortion extreme-uv lithography reticle |
| 07/18/2001 | EP1116071A1 Mask for high resolution optical lithography |
| 07/18/2001 | EP1116043A1 Method of manufacturing a magnetic tunnel junction device |
| 07/18/2001 | EP1116042A1 Circuit configuration with a scan path that can be deactivated |
| 07/18/2001 | EP1116011A1 Tuning a substrate temperature measurement system |
| 07/18/2001 | EP1115921A2 Method for producing an amorphous or polycrystalline layer on an insulating region |
| 07/18/2001 | EP1115920A1 Method for obtaining a monocrystalline germanium layer on a monocrystalline silicon substrate, and resulting products |
| 07/18/2001 | EP1115918A2 ENHANCED i n /i TYPE SILICON MATERIAL FOR EPITAXIAL WAFER SUBSTRATE AND METHOD OF MAKING SAME |
| 07/18/2001 | EP1115900A1 Methods for preparing ruthenium metal films |
| 07/18/2001 | EP1115898A1 Tantalum films and methods for their deposition |
| 07/18/2001 | EP1115892A1 Wire-bonding alloy composites |
| 07/18/2001 | EP1115806A1 Workpiece retainer and method for attaching/detaching workpiece by using the same |
| 07/18/2001 | EP1115805A1 Polishing cloth and method for attaching/detaching the polishing cloth to/from polishing machine base plate |
| 07/18/2001 | EP1115804A1 Polishing liquid for polishing components, preferably wafers, especially for chemically-mechanically polishing components of this type |
| 07/18/2001 | EP1115803A1 Oxidizing polishing slurries for low dielectric constant materials |
| 07/18/2001 | EP1115648A1 Method for producing nanometer structures on semiconductor surfaces |
| 07/18/2001 | EP1115643A1 Apparatus for sensing the presence of a wafer |
| 07/18/2001 | EP1115565A1 Composite wire with noble metal cladding |
| 07/18/2001 | EP1115535A1 Substrate transport apparatus |
| 07/18/2001 | EP1115511A1 Offset rotor flat media processor |
| 07/18/2001 | EP1115503A1 Electroless metal deposition of electronic components in an enclosable vessel |
| 07/18/2001 | EP1044465A4 Wet processing methods for the manufacture of electronic components |
| 07/18/2001 | EP0900477B1 Electronic component, in particular a component using acoustical surface acoustic waves |
| 07/18/2001 | EP0740849B1 Method of forming a silicon-on-insulator (soi) material having a high degree of thickness uniformity |
| 07/18/2001 | CN1304635A Method for producing wirings having solder bumps |
| 07/18/2001 | CN1304634A Wiring method and wiring device |
| 07/18/2001 | CN1304552A Methods for reducing semiconductor contact resistance |
| 07/18/2001 | CN1304551A Self-aligned methods of fabricating silicon carbide power devices by implantation and lateral diffusions |
| 07/18/2001 | CN1304550A Porous insulating compounds and method for making same |
| 07/18/2001 | CN1304549A Method for single chamber processing of PECVD-Ti and CVD-Ti films in IC mfg. |
| 07/18/2001 | CN1304548A Method and apparatus for laser heat treatment, and semiconductor device |
| 07/18/2001 | CN1304547A Method for producing thin film semiconductor device |
| 07/18/2001 | CN1304546A Method of fabricating silicon carbide power device by controlled annealing |