Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2001
07/05/2001US20010006830 Method of producing a semiconductor device
07/05/2001US20010006827 Film formation apparatus and method for forming a film
07/05/2001US20010006826 Method for forming a capacitor for semiconductor devices
07/05/2001US20010006765 Thin film transistor; liquid crystal display; one step photolithography
07/05/2001US20010006764 Using masking pattern
07/05/2001US20010006763 Plurality electrodes arranged along baseplate; transportation means; controllers
07/05/2001US20010006762 Balanced positioning system for use in lithographic apparatus
07/05/2001US20010006761 Method and apparatus for resist planarization
07/05/2001US20010006758 Fine photoresist patterns
07/05/2001US20010006753 Photomask substrate and a light-impermeable film patterned into a semiconductor integrated circuit and a second pattern adjusting a numerical aperture of the first pattern
07/05/2001US20010006752 Adamantane or derivatives as additive and a negative-type chloromethylstyrene/chlorostyrene copolymer as the resist
07/05/2001US20010006735 Prior to anodization a discontinuous of a valve metal oxide is deposited on a foil to preserve the high surface area and promote formation of a dielectric coating
07/05/2001US20010006701 Chemical vapor deposition (CVD); trimethylvinylsilyl hexafluoroacetylacetonate (hfac) copper(I) with small deposition rate and allyltrimethylsilyl (hfac) copper(I) with large deposition rate to form copper interconnect film
07/05/2001US20010006530 Sensor for measuring a substrate temperature
07/05/2001US20010006528 Surface emitting semiconductor laser, and its fabrication method
07/05/2001US20010006476 Static memory cell having independent data holding voltage
07/05/2001US20010006474 FeRAM configuration
07/05/2001US20010006473 Nonvolatile ferroelectric memory device and method for fabricating the same
07/05/2001US20010006456 Method of manufacturing electronic parts
07/05/2001US20010006455 Method for mounting semiconductor device and structure thereof
07/05/2001US20010006451 Monolithic ceramic electronic component and production process therefor, and ceramic paste and production process therefor
07/05/2001US20010006422 Stage system in projection exposure apparatus
07/05/2001US20010006418 Reduced particle contamination manufacturing and packaging for reticles
07/05/2001US20010006413 Interferometric alignment system for use in vacuum-based lithographic apparatus
07/05/2001US20010006412 Optical arrangement
07/05/2001US20010006399 Laser marking method and laser marker for carrying out the method
07/05/2001US20010006352 Metal oxide semiconductor transistor circuit and semiconductor integrated circuit using the same
07/05/2001US20010006348 Programmable logic device architectures
07/05/2001US20010006339 Circuit configuration for regulating the power consumption of an integrated circuit
07/05/2001US20010006310 Electronic switch member having one inlet and a plurality of outlets, and application thereof to a switch matrix
07/05/2001US20010006259 Semiconductor device and method of producing the same
07/05/2001US20010006257 Method of fabricating a three-dimensional system-on-chip and its structure
07/05/2001US20010006256 Semiconductor device
07/05/2001US20010006255 Semiconductor device having improved metal line structure and manufacturing method therefor
07/05/2001US20010006254 Thin film multilayered structure, ferroelectric thin film element, and manufacturing method of the same
07/05/2001US20010006251 Semiconductor device and manufacturing method
07/05/2001US20010006249 Co-planar si and ge composite substrate and method of producing same
07/05/2001US20010006248 Micromachined device having electrically isolated components and a method for making the same
07/05/2001US20010006247 Semiconductor memory device with a triple well structure
07/05/2001US20010006246 Method of manufacturing semiconductor devices, etching composition for manufacturing semiconductor devices, and semiconductor devices made using the method
07/05/2001US20010006245 Manufacturing method of semiconductor integrated circuit device
07/05/2001US20010006244 Element isolating method in semiconductor integrated circuit device, semiconductor integrated circuit device and manufacturing method thereof
07/05/2001US20010006242 Semiconductor device with pillar-shaped capacitor storage node
07/05/2001US20010006241 Semicconductor device having a capacitor and method for the manufacture thereof
07/05/2001US20010006240 Method of forming titanium silicide and titanium by chemical vapor deposition and resulting apparatus
07/05/2001US20010006239 Semiconductor device having a capacitor and method for the manufacture thereof
07/05/2001US20010006238 Image sensor incorporating therein a capacitor structure and method for the manufacture thereof
07/05/2001US20010006234 Semiconductor device and method of manufacturing the same
07/05/2001US20010006225 A slurry used for chemical mechanical polishing of a substrate having a copper-containing film at the surface, which contains and abrasive, an oxidizer, and adhesive-inhibitor preventing adhesion of polishing product to
07/05/2001US20010006224 A slurry for chemical mechanical polishing of a substrate containing tantalum or tantalum nitride comprising a silica polishing grain and an inorganic salt to prevent dishing and erosion
07/05/2001US20010006217 Method of generating extremely short-wave radiation, and extremely short-wave radiation source unit
07/05/2001US20010006216 Misalignment inspection method, charge beam exposure method, and substrate for pattern observation
07/05/2001US20010006188 Process and apparatus to remove closely spaced chips on a multi-chip module
07/05/2001US20010006185 Rework and underfill nozzle for electronic components
07/05/2001US20010006172 Electrically heated substrate with multiple ceramic parts each having different volume resitivities
07/05/2001US20010006169 Method for improving ash rate uniformity in photoresist ashing process equipment
07/05/2001US20010006167 Providing an oxide layer on a surface of a substrate, exposing oxide layer to a liquid comprising a halide-containing gas
07/05/2001US20010006166 Supplying a mixture of etching gas and an acid neutralizing gas into a vacuum chamber in which a water soluble material of sidewall polymer rails left behind on aluminum/copper line from reactive ion etching, removing it with deionized water
07/05/2001US20010006148 Interference layer system
07/05/2001US20010006119 Circuit board-providing article, circuit board, semiconductor device and process for the production of the same
07/05/2001US20010006118 Non-contact type IC card and process for manufacturing same
07/05/2001US20010006096 Comprising central vacuum chamber, substrate processing chambers arranged about sides of central vacuum chamber, queuing station disposed on side of central chamber vacuum locks, arm assembly for receiving and distributing substrates
07/05/2001US20010006095 Apparatus for treating a wafer
07/05/2001US20010006094 Vacuum processing apparatus for semiconductor process
07/05/2001US20010006072 Ultrasonic processing device and electronic parts fabrication method using the same
07/05/2001US20010006071 Heating a second fluid and flowing it through secondary containment line having primary containment line positioning therein, the seconday fluid surrounding primary containment line, flowing first fluid through first continment line
07/05/2001US20010006070 Surface-treated shower head for use in a substrate processing chamber
07/05/2001US20010006043 A vertical barrel, concentric cylinder design for a cold wall reactor cell which can be converted to a hot wall cell for cleaning the interior of the reactor
07/05/2001US20010006041 Method and apparatus for application of spray adhesive to a leadframe for chip bonding
07/05/2001US20010006039 A silicon wafer substrate is hydrogen-annealed to remove impurities and defects, then, an impurity buried layer is formed in an upper surface of silicon wafer substrate, which increases the number of contaminant attractor in upper surface
07/05/2001US20010006031 Chemical meachanical polishing slurry for polishing copper metal or alloy film formed on tantalum or tantalum nitride film comprising an oxidizer, an organic acid and an alkanolamine
07/05/2001US20010005944 Reduced particle contamination manufacturing and packaging for reticles
07/05/2001US20010005936 Electrically conductive paste and method of forming circuit
07/05/2001US20010005935 Assembling a stacked die package
07/05/2001DE4494299C1 and connecting a contact element onto a substrate
07/05/2001DE19962677A1 Anordnung zum Testen einer Vielzahl von Halbleiterchips An arrangement for testing a plurality of semiconductor chips
07/05/2001DE19961840C1 Verfahren zur Herstellung eines regelmäßigen Mehrschichtsaufbaus für insbesondere elektrische Doppelschichtkondensatoren und Vorrichtung dafür A process for producing a periodic multilayer structure in particular for electric double layer capacitors and apparatus therefor
07/05/2001DE19961779A1 Integrierte dynamische Speicherzelle mit geringer Ausbreitungsfläche und Verfahren zu deren Herstellung Integrated dynamic memory cell with a low expansion surface and methods for their preparation
07/05/2001DE19961106A1 Device for holding a plane plate comprises a bearing surface whose diameter corresponds to the plate diameter, and a holding ring whose vertical protrusion corresponds to the plate thickness
07/05/2001DE19961104A1 Verfahren und Vorrichtung zur Überwachung von Ätzkammern Method and device for monitoring etch chambers
07/05/2001DE19961103A1 Dielektrische Füllung von elektrischen Verdrahtungsebenen Dielectric filling of electrical wiring levels
07/05/2001DE19961085A1 Production of a storage electrode of a deep trench capacitor comprises forming a doped layer above an exposed substrate which has been structured and then thermally treating
07/05/2001DE19960823A1 Semiconductor wafer has a rear side and a front side with an epitaxial layer having a specified maximum density of scattered light centers
07/05/2001DE19960249A1 Verfahren zur Herstellung eines Halbleiterbausteins A process for producing a semiconductor device
07/05/2001DE19960241A1 Vorrichtung und Verfahren zum Behandeln von Substraten Apparatus and method for processing substrates
07/05/2001DE19958907A1 Production of electrodes used in production of stacked capacitor in DRAMs comprises forming a molded support structure in or on substrate, enlarging surface of structure; and forming electrodes using support structure
07/05/2001DE19958906A1 Herstellung von integrierten Schaltungen Manufacture of integrated circuits
07/05/2001DE19958062A1 Verfahren zur Herstellung eines Bipolartransistors und Verfahren zur Herstellung einer integrierten Schaltungsanordnung mit einem solchen Bipolartransistor A method of manufacturing a bipolar transistor and method for fabricating an integrated circuit arrangement having such a bipolar transistor
07/05/2001DE19957542A1 Alternierende Phasenmaske Alternating phase mask
07/05/2001DE10065703A1 Column-transistor in semiconductor device, such as a memory device, has gate electrode of column transistor bent in the active zone of the column transistor so as to increase the width of the transistor
07/05/2001DE10063609A1 Substrate transfer device e.g. for transference of printed substrates by a movable gripper, is provided with contact-free pickup for holding the substrate without touching its surface
07/05/2001DE10062199A1 Substratprozessvorrichtung und Substratprozessverfahren Substrate processing apparatus and substrate process method
07/05/2001DE10060927A1 Befestigungsvorrichtung für einen Laderaumanker Fastening device for a loading space anchor
07/05/2001DE10059511A1 Behälter zum Aufbewahren einer Schleifscheibe A container for storing a grinding wheel
07/05/2001DE10055446A1 Insulated gate bipolar transistor manufacturing method used for electric power converter, involves forming buffer layer by proton irradiation from back side of substrate
07/05/2001DE10039185A1 Semiconductor device with electrical fuse for memory circuit, makes thin insulating film available on surface of active zone for functioning as electrical fuse
07/05/2001DE10029938A1 Optical system for projection exposure device, includes optical element which consists of magnesium fluoride, as main constituent
07/05/2001CA2398525A1 Method for fabricating group iii nitride compound semiconductors and group iii nitride compound semiconductor devices
07/04/2001EP1113712A2 Process for manufacturing conductive lines
07/04/2001EP1113505A2 Semiconductor device and manufacturing method thereof