Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2001
07/10/2001US6256873 Method for making smart cards using isotropic thermoset adhesive materials
07/10/2001US6256825 Removal of particulate contamination in loadlocks
07/10/2001CA2203489C Circuit in cmos technology for high speed driving of optical sources
07/06/2001CA2328266A1 Corrosion and erosion resistant thin film diamond coating and applications therefor
07/05/2001WO2001049087A1 Method of generating euv radiation, method of manufacturing a device by means of said radiation, euv radiation source unit, and lithographic projection apparatus provided with such a radiation source unit
07/05/2001WO2001049086A1 Method of generating extremely short-wave radiation, method of manufacturing a device by means of said radiation, extremely short-wave radiation source unit and lithographic projection apparatus provided with such a radiation source unit
07/05/2001WO2001049085A1 Method of generating extremely short-wave radiation, method of manufacturing a device by means of said radiation, extremely short-wave radiation source unit and lithographic projection apparatus provided with such a radiation source unit
07/05/2001WO2001048870A2 Interconnect for microelectronic structures with enhanced spring characteristics
07/05/2001WO2001048829A1 Bipolar transistor with upper heterojunction collector and method for making same
07/05/2001WO2001048825A1 Method for manufacturing bonded wafer
07/05/2001WO2001048824A1 High-voltage capacitor voltage divider circuit having a high-voltage silicon-on-insulator (soi) capacitor
07/05/2001WO2001048823A1 An integrated circuit with metal programmable logic having enhanced reliability
07/05/2001WO2001048822A2 Thin-film transistor circuitry
07/05/2001WO2001048819A2 Interconnect structure and method of fabrication therefor
07/05/2001WO2001048816A1 Heat sink material and method of manufacturing the heat sink material
07/05/2001WO2001048815A1 Stress isolated integrated circuit and manufacturing method thereof
07/05/2001WO2001048814A1 Method of manufacturing a semiconductor device comprising semiconductor elements formed in a top layer of a silicon wafer situated on a buried insulating layer
07/05/2001WO2001048813A1 Method and device for preventing oxidation on substrate surface
07/05/2001WO2001048812A2 Method and system for efficiently computing a number of integrated circuit dies
07/05/2001WO2001048811A2 A method for efficiently computing a number of integrated circuit dies
07/05/2001WO2001048810A1 Inspecting device for crystal defect of silicon wafer and method for detecting crystal defect of the same
07/05/2001WO2001048809A1 Junction field-effect transistor and method of manufacture thereof
07/05/2001WO2001048808A1 An insitu post etch process to remove remaining photoresist and residual sidewall passivation
07/05/2001WO2001048807A1 Abrasives for chemical mechanical polishing
07/05/2001WO2001048806A1 Method of forming low-dielectric-constant film, and semiconductor substrate with low-dielectric-constant film
07/05/2001WO2001048805A1 Method for curing spin-on dielectric films utilizing electron beam radiation
07/05/2001WO2001048804A1 In situ post-etch photoresist and polymer stripping and dielectric etch chamber cleaning
07/05/2001WO2001048803A1 Etching solution, etching method, and semiconductor silicon wafer
07/05/2001WO2001048801A1 Method and apparatus for monitoring polishing state, polishing device, process wafer, semiconductor device, and method of manufacturing semiconductor device
07/05/2001WO2001048800A1 Semiconductor wafer processing apparatus and processing method
07/05/2001WO2001048799A1 Method for producing group iii nitride compound semiconductor and group iii nitride compound semiconductor device
07/05/2001WO2001048798A1 Method for producing group iii nitride compound semiconductor and group iii nitride compound semiconductor device
07/05/2001WO2001048797A1 Production method for semiconductor device
07/05/2001WO2001048796A1 Semiconductor device and method for manufacturing a passivation layer on a semiconductor device
07/05/2001WO2001048795A2 Fluorine based plasma etch method for anisotropic etching of high open area silicon structures
07/05/2001WO2001048794A2 Enhanced etching/smoothing of dielectric surfaces
07/05/2001WO2001048793A2 Method for converting features in an integrated circuit design and apparatus for doing the same
07/05/2001WO2001048787A1 Multi-electron -beam lithography apparatus with mutually different beam limiting apertures
07/05/2001WO2001048555A1 Thinner for rinsing photoresist and method of treating photoresist layer
07/05/2001WO2001048553A1 A method for maximizing integrated circuit die production
07/05/2001WO2001048547A1 Tft array substrate, method of manufacture thereof, and lcd with tft array substrate
07/05/2001WO2001048493A2 Low power scan flipflop
07/05/2001WO2001048416A1 Light curtain system for establishing a protective light curtain, tool and system for processing objects and method for loading/unloading a tool
07/05/2001WO2001048275A1 Plating device and plating method
07/05/2001WO2001048274A1 Apparatus for plating substrate, method for plating substrate, electrolytic processing method, and apparatus thereof
07/05/2001WO2001048076A2 A method to fabricate thin insulating films
07/05/2001WO2001047831A1 Carbon-containing aluminum nitride sintered compact, and ceramic substrate for use in apparatus for manufacturing and inspecting semiconductor
07/05/2001WO2001047720A1 Thermal mass transfer donor element with light-to-heat conversion layer
07/05/2001WO2001047664A1 Wafer polishing method and wafer polishing device
07/05/2001WO2001047660A1 Hardening flux, soldering resist, semiconductor package reinforced by hardening flux, semiconductor device and method of producing semiconductor package and semiconductor device
07/05/2001WO2001047659A1 Energy-efficient, laser-based method and system for processing target material
07/05/2001WO2001040864A8 Photoresist dispense method by compensation for substrate reflectivity
07/05/2001WO2001020252A8 Method and apparatus for performing optical measurements of layers and surface properties
07/05/2001WO2001011673A3 Method for etching oxide films containing bismuth
07/05/2001WO2001009930A3 Thin film capacitors on silicon germanium substrate and process for making the same
07/05/2001WO2001006545B1 ENHANCED n TYPE SILICON MATERIAL FOR EPITAXIAL WAFER SUBSTRATE AND METHOD OF MAKING SAME
07/05/2001WO2001004377A8 Seal means and its application in deposition reactor
07/05/2001WO2001001449A3 Semiconductor device manufacturing using low energy high tilt angle ion implantation
07/05/2001WO2000079581A3 Improving mosfet performance by employing an improved method for forming halo implants
07/05/2001WO2000077831A3 Methods for regulating surface sensitivity of insulating films in semiconductor devices
07/05/2001WO2000075967A3 Method for fabrication of a low resistivity mosfet gate with thick metal silicide on polysilicon
07/05/2001WO2000067301A3 Method of making shallow junction semiconductor devices
07/05/2001WO2000067291A3 Microfabricated template for multiple charged particle beam calibrations and shielded charged particle beam lithography
07/05/2001WO2000054312A8 Ic-compatible parylene mems technology and its application in integrated sensors
07/05/2001WO2000004579A9 Process for mapping metal contaminant concentration on a silicon wafer surface
07/05/2001WO2000003169A3 Manifold system of removable components for distribution of fluids
07/05/2001US20010007145 Electronic parts placement method and a computer readable medium having an electronic parts placement program
07/05/2001US20010007144 Hold violation improvement method, semiconductor integrated circuit, and program for executing hold violation improvement method by computer
07/05/2001US20010007143 Circuit simulation device for predicting the dispersion of circuit characteristics and the electric characteristics
07/05/2001US20010007092 Method in an integrated circuit (IC) manufacturing process for indentifying and redirecting IC's mis-processed during their manufacture
07/05/2001US20010007091 Integrated circuit provided with means for calibrating an electronic module and method for calibrating an electronic module of an integrated circuit
07/05/2001US20010007085 Method and system for supervising reference wafers on semiconductor device production line and recording medium
07/05/2001US20010007084 Automatic wire bonder and method for implementing thereof
07/05/2001US20010006936 Removing photoresist residue; does not corrode or attack titanium or other metallurgy, oxide or nitride layers on the substrate
07/05/2001US20010006874 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
07/05/2001US20010006873 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
07/05/2001US20010006872 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
07/05/2001US20010006871 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
07/05/2001US20010006870 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
07/05/2001US20010006853 Thin uniform oxide film
07/05/2001US20010006852 Integrated circuit
07/05/2001US20010006850 Forming photoresist pattern; etching
07/05/2001US20010006849 Methods and apparatus for producing semiconductor devices
07/05/2001US20010006848 Integrated circuit
07/05/2001US20010006847 Connectors in flash memory
07/05/2001US20010006846 Method and structure for bonding layers in a semiconductor device
07/05/2001US20010006845 Method and apparatus for producing group-III nitrides
07/05/2001US20010006844 Method for fabricating single electron transistor
07/05/2001US20010006843 Method for forming a gate insulating film for semiconductor devices
07/05/2001US20010006841 Process for forming a metal interconnect
07/05/2001US20010006840 Method for growing a compound semiconductor, quantum well structure using the same, and compound semiconductor device including the same
07/05/2001US20010006839 Forming a trench mask pattern on semiconductor; etching; overcoating with dielectric
07/05/2001US20010006838 Methods of forming ruthenium film by changing process conditions during chemical vapor deposition and ruthenium films formed thereby
07/05/2001US20010006837 Forming carbon over active matrix; patterning
07/05/2001US20010006836 Cycles of oxidation, etching
07/05/2001US20010006835 Method for manufacturing aluminum oxide film for use in a semiconductor device
07/05/2001US20010006834 Semiconductor device with high- and low-density regions of transistor elements on single semiconductor substrate, and method of manufacturing such semiconductor device
07/05/2001US20010006833 Forming tantalum, titanium mixed oxide
07/05/2001US20010006832 Method for fabricating polycide dual gate in semiconductor device
07/05/2001US20010006831 Manufacture of semiconductor material and devices using that materia