Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2001
07/04/2001EP1113502A1 Method of manufacturing thin-film transistor
07/04/2001EP1113500A1 Process for manufacturing non-volatile memory cells
07/04/2001EP1113498A2 Voltage variable capacitor with improved c-v linearity
07/04/2001EP1113493A1 Process of fabrication of a ferroelectric semiconductor memory
07/04/2001EP1113492A1 Method for manufacturimg a SOI wafer
07/04/2001EP1113491A1 Transfer arm
07/04/2001EP1113490A2 Resin sealing method for semiconductors and release film used therefor
07/04/2001EP1113489A2 Film forming method and semiconductor device
07/04/2001EP1113488A2 Method of manufacturing a structured metal oxide containing layer
07/04/2001EP1113487A1 Method for plating a film on a semiconductor device
07/04/2001EP1113486A2 Method of doping a semiconductor
07/04/2001EP1113485A2 Method for producing a semiconductor device
07/04/2001EP1113484A2 Iridium and iridium oxide electrodes used in ferroelectric capacitors
07/04/2001EP1113452A2 Internal protection circuit and method for on chip programmable poly fuses
07/04/2001EP1113451A2 Nonvolatile semiconductor memory device
07/04/2001EP1113337A2 Optical arrangement
07/04/2001EP1113336A2 Optical arrangement
07/04/2001EP1113334A1 Sulfonium salt compound, resist composition comprising the same and pattern forming method using the composition
07/04/2001EP1113282A2 System for testing a plurality of semiconductor chips
07/04/2001EP1113280A2 Semiconductor integrated circuit having self-diagnosis test function and test method thereof
07/04/2001EP1113262A2 Inspection apparatus and method
07/04/2001EP1113214A1 Light curtain system for establishing a protective light curtain, tool and system for processing objects and method for loading/unloading a tool
07/04/2001EP1113093A1 Plating jig and device for semiconductor wafer
07/04/2001EP1113089A1 MOCVD of lead zirconate titanate films
07/04/2001EP1113088A1 Method and apparatus for coating by plasma sputtering
07/04/2001EP1113087A2 Film formation apparatus and method for forming a film
07/04/2001EP1112816A2 Polishing pad and method of manufacture
07/04/2001EP1112674A1 Laminates for encapsulating devices
07/04/2001EP1112672A1 Low-impedance high-density deposited-on-laminate structures having reduced stress
07/04/2001EP1112594A1 Vertical bipolar transistor and method for the production thereof
07/04/2001EP1112593A2 Layered dielectric on silicon carbide semiconductor structures
07/04/2001EP1112592A1 Semiconductor device and method of manufacturing same
07/04/2001EP1112591A1 Method and apparatus for wet-etching semiconductor wafers
07/04/2001EP1112590A1 Method for patterning a layer of a low dielectric constant material
07/04/2001EP1112589A1 Semiconductor arrangement having capacitive structure and manufacture thereof
07/04/2001EP1112587A1 Device and method for etching a substrate by means of an inductively coupled plasma
07/04/2001EP1112578A1 Apparatus for generating focused electromagnetic radiation
07/04/2001EP1112576A1 Electrically erasable nonvolatile memory
07/04/2001EP1112575A1 Magnetoresistive element and use of same as storage element in a storage system
07/04/2001EP1112550A1 An automated wafer defect inspection system and a process of performing such inspection
07/04/2001EP1112221A1 Robotic gripping device for gripping an object having a handle on an upper surface
07/04/2001EP1112220A1 Robots for microelectronic workpiece handling
07/04/2001EP1112159A1 Method for producing a hybrid frame or hybrid housing and corresponding hybrid frame or hybrid housing
07/04/2001EP1112145A1 Polishing pad for a semiconductor substrate
07/04/2001EP1112125A2 Metallization structures for microelectronic applications and process for forming the structures
07/04/2001EP1100630A4 Process and apparatus for treating a workpiece such as a semiconductor wafer
07/04/2001EP1062682A4 Selective silicon oxide etchant formulation including fluoride salt, chelating agent and glycol solvent
07/04/2001EP0935520B1 Encapsulating device and method for closing a device for encapsulating electronic components
07/04/2001EP0804802B1 A method of producing an ohmic contact for a semiconductor device
07/04/2001CN2437696Y Bath for selection plating production line of IC lead frame
07/04/2001CN1302456A Ferroelectric field effect transistor having compositionally graded ferroelectric material and method of making the same
07/04/2001CN1302455A Laminated integrated circuit package
07/04/2001CN1302454A Process for preparation of epitaxial wafers for resistivity measurements
07/04/2001CN1302453A Method and apparatus for treating semi-conductor substrate
07/04/2001CN1302452A Organic removal process
07/04/2001CN1302327A Acidic composition containing fluoride for removal of photoresists and etch residues
07/04/2001CN1302254A Low K dielectric inorganic/organic hybrid films and method of making
07/04/2001CN1302173A Film forming equipment and method
07/04/2001CN1302088A Semiconductor device with multi-grid insulation layer and its producing method
07/04/2001CN1302087A Non-easy loss semiconductor storage device and its producing method
07/04/2001CN1302086A Semiconductor device with capacitor and its producing method
07/04/2001CN1302085A Rowed transistor in semiconductor
07/04/2001CN1302084A Forming method for resin diaphragm and resin diaphragm forming device using said method
07/04/2001CN1302082A Method for forming semiconductor layer
07/04/2001CN1302081A Electronic beam mask and method for producing mask and exposing method
07/04/2001CN1302080A Method for producing semiconductor structure with metal oxide interface between silicons
07/04/2001CN1301992A Leveling method
07/04/2001CN1301880A Self ionizing plasma for sputter copper
07/04/2001CN1301797A Organic polymer with anti-reflective coating layer and its preparing method
07/04/2001CN1301778A Organic anti-reflective paint polymer and its preparing method
07/04/2001CN1068064C Conducting wire frame and method for producing same
07/03/2001US6256604 Memory integrated with logic on a semiconductor chip and method of designing the same
07/03/2001US6256555 Robot arm with specimen edge gripping end effector
07/03/2001US6256549 Integrated manufacturing solutions
07/03/2001US6256371 X-ray illumination device, x-ray illumination method, and an x-ray exposing device and device manufacturing method using the same
07/03/2001US6256247 Differential sense amplifiers for resistive cross point memory cell arrays
07/03/2001US6256228 Method for erasing nonvolatile semiconductor storage device capable of preventing erroneous reading
07/03/2001US6256227 Non-volatile semiconductor memory having column sub-selector layout pattern adaptable to miniaturization of memory cell
07/03/2001US6256225 Construction and application for non-volatile reprogrammable switches
07/03/2001US6256224 Write circuit for large MRAM arrays
07/03/2001US6256222 Magnetoresistance effect device, and magnetoresistaance effect type head, memory device, and amplifying device using the same
07/03/2001US6256207 Chip-sized semiconductor device and process for making same
07/03/2001US6256187 Electrostatic chuck device
07/03/2001US6256186 Electrostatic chucks
07/03/2001US6256100 Method and device for measuring the thickness of thin films near a sample's edge and in a damascene-type structure
07/03/2001US6256085 Exposure apparatus
07/03/2001US6256077 Thin film transistor array panel for a liquid crystal display and a method for manufacturing the same using four photolithography steps
07/03/2001US6255895 Circuit for generating a reference voltage trimmed by an anti-fuse programming
07/03/2001US6255881 High tunability CMOS delay element
07/03/2001US6255809 Method for measuring capacitance of passive device region
07/03/2001US6255742 Semiconductor package incorporating heat dispersion plate inside resin molding
07/03/2001US6255740 Semiconductor device having a lead portion with outer connecting terminals
07/03/2001US6255739 Semiconductor device
07/03/2001US6255737 Semiconductor device and method of making the same, circuit board, and electronic instrument
07/03/2001US6255736 Three-dimensional MCM, method for manufacturing the same, and storage medium storing data for the method
07/03/2001US6255734 Passivated copper line semiconductor device structure
07/03/2001US6255732 Semiconductor device and process for producing the same
07/03/2001US6255731 SOI bonding structure
07/03/2001US6255729 Multi chip package (MCP) applicable to failure analysis mode
07/03/2001US6255727 Contact structure formed by microfabrication process