| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 07/31/2001 | US6268255 Method of forming a semiconductor device with metal silicide regions |
| 07/31/2001 | US6268254 Method and device for improved salicide resistance on polysilicon gates |
| 07/31/2001 | US6268253 Forming a removable spacer of uniform width on sidewalls of a gate of a field effect transistor during a differential rapid thermal anneal process |
| 07/31/2001 | US6268252 Method of forming self-aligned contact pads on electrically conductive lines |
| 07/31/2001 | US6268251 Method of forming MOS/CMOS devices with dual or triple gate oxide |
| 07/31/2001 | US6268250 Efficient fabrication process for dual well type structures |
| 07/31/2001 | US6268249 Semiconductor device and method of fabricating the same |
| 07/31/2001 | US6268248 Method of fabricating a source line in flash memory having STI structures |
| 07/31/2001 | US6268247 Memory cell of the EEPROM type having its threshold set by implantation, and fabrication method |
| 07/31/2001 | US6268246 Method for fabricating a memory cell |
| 07/31/2001 | US6268245 Method for forming a DRAM cell with a ragged polysilicon crown-shaped capacitor |
| 07/31/2001 | US6268244 Method of fabricating capacitors of a memory cell array |
| 07/31/2001 | US6268243 Method for fabricating dynamic random access memory cells |
| 07/31/2001 | US6268241 Method of forming a self-aligned silicide structure in integrated circuit fabrication |
| 07/31/2001 | US6268240 Static semiconductor memory device capable of enhancing access speed |
| 07/31/2001 | US6268236 Method of manufacturing a semiconductor device having a package structure, and semiconductor device manufactured thereby |
| 07/31/2001 | US6268229 Emitting electrons |
| 07/31/2001 | US6268226 Reactive ion etch loading measurement technique |
| 07/31/2001 | US6268224 Method and apparatus for detecting an ion-implanted polishing endpoint layer within a semiconductor wafer |
| 07/31/2001 | US6268115 Surfactants, wetting agents |
| 07/31/2001 | US6268114 Metallurgy, patterning, heating |
| 07/31/2001 | US6268108 Composition for forming antireflective coating film and method for forming resist pattern using same |
| 07/31/2001 | US6268106 Low molecular weight polymer |
| 07/31/2001 | US6268093 Optical exposure system |
| 07/31/2001 | US6268090 Process for manufacturing semiconductor device and exposure mask |
| 07/31/2001 | US6268068 Multilayer thin film |
| 07/31/2001 | US6268061 Crystal structure |
| 07/31/2001 | US6268030 Silicon wafer carrier |
| 07/31/2001 | US6267909 Useful for thinning, polishing and planarizing integrated circuitry deposited on semiconductor wafers which have metal conducting film deposits on surfaces |
| 07/31/2001 | US6267862 Creating voltage difference between electrical conductor and wafer; uniformity |
| 07/31/2001 | US6267853 Electro-chemical deposition system |
| 07/31/2001 | US6267851 Tilted sputtering target with shield to block contaminants |
| 07/31/2001 | US6267840 Low pressure stagnation flow reactor with a flow barrier |
| 07/31/2001 | US6267839 Electrostatic chuck with improved RF power distribution |
| 07/31/2001 | US6267821 Substrate clamp design for minimizing substrate to clamp sticking during thermal processing of thermally flowable layers |
| 07/31/2001 | US6267820 Clog resistant injection valve |
| 07/31/2001 | US6267817 Methods of forming semiconductor wafers, methods of treating semiconductor wafers to alleviate slip generation, ingots of semiconductive material, and wafers of semiconductive material |
| 07/31/2001 | US6267816 Method for single crystal growth |
| 07/31/2001 | US6267659 Stacked polish pad |
| 07/31/2001 | US6267656 Carrier head for a chemical mechanical polishing apparatus |
| 07/31/2001 | US6267650 Apparatus and methods for substantial planarization of solder bumps |
| 07/31/2001 | US6267648 Apparatus and method for chamfering wafer |
| 07/31/2001 | US6267647 Grinding machines and polishing machines |
| 07/31/2001 | US6267646 Polishing machine |
| 07/31/2001 | US6267644 Fixed abrasive finishing element having aids finishing method |
| 07/31/2001 | US6267642 Sensing the presence of a wafer |
| 07/31/2001 | US6267641 Method of manufacturing a semiconductor component and chemical-mechanical polishing system therefor |
| 07/31/2001 | US6267577 Transfer molding apparatus for manufacturing semiconductor devices |
| 07/31/2001 | US6267549 Dual independent robot blades with minimal offset |
| 07/31/2001 | US6267545 Semiconductor processing platform architecture having processing module isolation capabilities |
| 07/31/2001 | US6267516 Developing apparatus and developing nozzle |
| 07/31/2001 | US6267479 Semiconductor device, and method for manufacturing the same |
| 07/31/2001 | US6267423 End effector for semiconductor wafer transfer device and method of moving a wafer with an end effector |
| 07/31/2001 | US6267290 Control of size and heat affected zone for fine pitch wire bonding |
| 07/31/2001 | US6267287 Apparatus and method of clamping semiconductor devices using sliding finger supports |
| 07/31/2001 | US6267282 Method and apparatus for handling laser bars |
| 07/31/2001 | US6267245 Cushioned wafer container |
| 07/31/2001 | US6267178 Built-up heat exchanger |
| 07/31/2001 | US6267167 Method and apparatus for application of adhesive tape to semiconductor devices |
| 07/31/2001 | US6267158 Sealed container, storage apparatus, electronic part conveyance system, and method of storage and conveyance of electronic parts |
| 07/31/2001 | US6267142 Fluid delivery stablization for wafer preparation systems |
| 07/31/2001 | US6267126 Apparatus for rinsing |
| 07/31/2001 | US6267125 Apparatus and method for processing the surface of a workpiece with ozone |
| 07/31/2001 | US6267123 Pod and method of cleaning it |
| 07/31/2001 | US6267122 Providing a wafer to be cleaned, said wafer with exposed metal regions and applying a solution consisting essentially of water plus ammonium hydroxide to wafer while simultaneously applying ultrasonic energy to solution |
| 07/31/2001 | US6267121 Process to season and determine condition of a high density plasma etcher |
| 07/31/2001 | US6267076 Gas phase planarization process for semiconductor wafers |
| 07/31/2001 | US6267075 Apparatus for cleaning items using gas plasma |
| 07/31/2001 | US6266978 Irradiating highly homogeneous synthetic quartz glass containing 20 sodium (na) with ultraviolet radiation |
| 07/31/2001 | US6266891 Method of and apparatus for bonding component |
| 07/31/2001 | US6266872 Method for making a connection component for a semiconductor chip package |
| 07/27/2001 | CA2332739A1 Process for formation of cap layer for semiconductor |
| 07/27/2001 | CA2304548A1 Free floating shield and semiconductor processing system |
| 07/26/2001 | WO2001054217A2 Fuel cell and power chip technology |
| 07/26/2001 | WO2001054204A1 A semiconductor device |
| 07/26/2001 | WO2001054203A2 Direct printing of thin-film conductors using metal-chelate inks |
| 07/26/2001 | WO2001054202A1 Strained-silicon metal oxide semiconductor field effect transistors |
| 07/26/2001 | WO2001054201A1 Method for reducing junction capacitance using a halo implant photomask |
| 07/26/2001 | WO2001054200A1 Lanthanum oxide-based gate dielectrics for integrated circuit field effect transistors and methods of fabricating same |
| 07/26/2001 | WO2001054194A1 Personalized hardware |
| 07/26/2001 | WO2001054192A1 Process for providing seed layers for aluminium, copper, gold and silver metallurgy |
| 07/26/2001 | WO2001054191A1 Damascene structure and method for forming a damascene structure |
| 07/26/2001 | WO2001054190A1 Dielectric formation to seal porosity of etched low dielectric constant materials |
| 07/26/2001 | WO2001054189A1 Method of joining components |
| 07/26/2001 | WO2001054188A1 Electrostatic chuck member and method of producing the same |
| 07/26/2001 | WO2001054187A1 Wafer transfer control apparatus and method for transferring wafer |
| 07/26/2001 | WO2001054186A1 Failure analysis method using emission microscope and system thereof and production method for semiconductor device |
| 07/26/2001 | WO2001054185A1 Maskless process for self-aligned contacts |
| 07/26/2001 | WO2001054184A1 Method for removing residues with reduced etching of oxide |
| 07/26/2001 | WO2001054183A2 Method to prevent oxygen out-diffusion from basrtio3 containing micro-electronic device |
| 07/26/2001 | WO2001054182A1 Control of transistor performance through adjustment of spacer oxide profile with a wet etch |
| 07/26/2001 | WO2001054181A2 Process and apparatus for cleaning silicon wafers |
| 07/26/2001 | WO2001054180A1 Method and detergent for cleansing semiconductor device substrate having transition metal or transition metal compound on surface |
| 07/26/2001 | WO2001054178A1 Semiconductor wafer manufacturing process |
| 07/26/2001 | WO2001054177A1 Tungsten gate electrode method and device |
| 07/26/2001 | WO2001054176A1 Wafer bonding techniques to minimize built-in stress of silicon microstructures and micro-mirrors |
| 07/26/2001 | WO2001054175A1 Low threading dislocation density relaxed mismatched epilayers without high temperature growth |
| 07/26/2001 | WO2001054174A1 Silicon on insulator circuit structure with buried semiconductor interconnect structure and method for forming same |
| 07/26/2001 | WO2001054173A1 A method for manufacturing an opto-electronic quantum well component, and an opto-electronic quantum well component |
| 07/26/2001 | WO2001054172A1 Metal oxynitride capacitor barrier layer |