Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2001
08/02/2001US20010010970 Dual - damascene dielectric structures
08/02/2001US20010010969 Semiconductor processing methods of forming contact openings, methods of forming electrical connections and interconnections, and integrated circuitry
08/02/2001US20010010968 Semiconductor method of making electrical connection between an electrically conductive line and a node location, and integrated circuitry
08/02/2001US20010010967 Method for supressing boron penetrating gate dielectric layer by pulsed nitrogen plasma doping
08/02/2001US20010010966 Semiconductor device and method of manufacturing the same
08/02/2001US20010010965 Method for fabricating semiconductor device including capacitor with improved bottom electrode
08/02/2001US20010010964 Method and structure for SOI wafers to avoid electrostatic discharge
08/02/2001US20010010963 Said dicing line is aligned with said pre-existing defect extending from said notch, prior to cutting the wafer, such that the dicing line overlaps the defect.
08/02/2001US20010010962 Method of fabricating field effect transistor
08/02/2001US20010010961 Method of forming contact holes of semiconductor device
08/02/2001US20010010960 Floating gate method and device
08/02/2001US20010010959 Method for fabricating semiconductor capacitor
08/02/2001US20010010958 Fabrication method to approach the conducting structure of a dram cell with straight forward bit line
08/02/2001US20010010957 Memory cell with vertical transistor and buried word and body lines
08/02/2001US20010010956 Method for manufacturing semiconductor memory device incorporating therein copacitor
08/02/2001US20010010955 High performance MIM (MIP) ic capacitor process
08/02/2001US20010010954 Method of forming an ESD protection device
08/02/2001US20010010953 Thin film transistor and method of fabricating the same
08/02/2001US20010010951 Apparatus for sealing a ball grid array package and circuit card interconnection
08/02/2001US20010010950 Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer system
08/02/2001US20010010949 Plastic molded type semiconductor device and fabrication process thereof
08/02/2001US20010010946 IC die power connection using canted coil spring
08/02/2001US20010010945 Semiconductor device and method of manufacturing the same
08/02/2001US20010010944 Apparatus and method for providing mechanically pre-formed conductive leads
08/02/2001US20010010942 Solid state image sensor device and method of fabricating the same
08/02/2001US20010010941 Recesses made on surface of sapphire substrate wherein nitride III-V (aluminum, gallium, indium) compound layer is grown improves crystal structure; lasers; light emitting diodes
08/02/2001US20010010940 Alignment method and semiconductor device
08/02/2001US20010010939 Method of detecting etching depth
08/02/2001US20010010938 Diode connected to a magnetic tunnel junction and self aligned with a metallic conductor and method of forming the same
08/02/2001US20010010937 Novel polysilicon load for 4T SRAM operating at cold temperatures
08/02/2001US20010010894 By which capacitance generated between multi-layered metal wirings in a semiconductor device can be minimized.
08/02/2001US20010010886 High accuracy circuit pattern transferring
08/02/2001US20010010885 Resist pattern and method of forming same, method of forming thin-film pattern, and method of manufacturing micro device
08/02/2001US20010010867 Solution containing metal alkoxides and organometallic compounds obtainable by hydrolyzing composite metal alkoxides with water alone or with catalyst
08/02/2001US20010010863 Stable thin film oxide standard
08/02/2001US20010010841 Forming a covering layer of a material different to a substance of the sample surface, forming a protective layer by spraying and irridiating the vicinity of cross-section to be observed with ion beam so as to open hole for observation
08/02/2001US20010010840 An electrically insulating thin-film-forming resin comprising an inorganic or organic electrically insulating resin having silicon atom-bonded hydrogen atom, a crosslinkable compound able to react with hydrogen atom and an organic solvent
08/02/2001US20010010837 Preparing an ultrafine particle dispersion liquid containing ultrafine metal particles, and dispersing the particles into an organic solvent, applying the dispersion on the substrate surface, drying and heating to join the metal or compound
08/02/2001US20010010759 Lamp unit for a photoirradiating heating device
08/02/2001US20010010743 Passive alignment using slanted wall pedestal
08/02/2001US20010010702 Beam homogenizer, laser irradiation apparatus, semiconductor device, and method of fabricating the semiconductor device
08/02/2001US20010010653 Semiconductor integrated circuit and method for adjusting characteristics of the same
08/02/2001US20010010651 Semiconductor integrated circuit
08/02/2001US20010010646 Nonvolatile semiconductor memory device
08/02/2001US20010010627 Semiconductor device and manufacturing method therefor
08/02/2001US20010010580 Exposure control apparatus and method
08/02/2001US20010010578 Scanning exposure photo-mask and method of scanning exposure and scanning exposure system
08/02/2001US20010010572 Vertical alignment liquid crystal display device having planarized substrate surface
08/02/2001US20010010567 Thin film transistor substrates for liquid crystal displays including passivation layer
08/02/2001US20010010566 Active matrix substrate, method for fabricating the substrate and liquid crystal display device
08/02/2001US20010010512 Color image display device, method of driving the same, and electronic equipment
08/02/2001US20010010480 Semiconductor integrated circuit and method for generating internal supply voltage in semiconductor integrated circuit
08/02/2001US20010010469 Semiconductor inspection apparatus and inspection method using the apparatus
08/02/2001US20010010462 Carrier identification system, carrier identification method and storage media
08/02/2001US20010010409 Use of oxide surface to facilitate gate break on a carrier substrate for a semiconductor device
08/02/2001US20010010406 Semiconductor device and method for manufacturing the same
08/02/2001US20010010405 Low angle, low energy physical vapor deposition of alloys
08/02/2001US20010010403 Forming submicron integrated-circuit wiring from gold, silver, copper, and other metals
08/02/2001US20010010402 Semiconductor device structure and method for manufacturing the same
08/02/2001US20010010401 Semiconductor device having a wiring layer of copper
08/02/2001US20010010398 Multi-cavity substrate structure for discrete devices
08/02/2001US20010010397 Semiconductor device and a method of manufacturing the same
08/02/2001US20010010396 Semiconductor device and semiconductor module using the same
08/02/2001US20010010393 Semiconductor device and semiconductor device mounting method thereof
08/02/2001US20010010392 Laser marking techniques
08/02/2001US20010010391 Semiconductor device and its manufacturing method
08/02/2001US20010010390 Semiconductor device and method of manufacturing the same
08/02/2001US20010010388 Bipolar transistor and method of fabricating the same
08/02/2001US20010010387 Methods of fabricating integrated circuit devices including distributed and isolated dummy conductive regions
08/02/2001US20010010386 Semiconductor device having protective layer on field oxide
08/02/2001US20010010384 Semiconductor device
08/02/2001US20010010383 Semiconductor device
08/02/2001US20010010382 Bipolar transistor compatible with CMOS utilizing tilted ion implanted base
08/02/2001US20010010381 Semiconductor device and method of fabricating the same
08/02/2001US20010010380 Field-effect transistor and manufacture thereof
08/02/2001US20010010378 Semiconductor device having conducting material film formed in trench, manufacturing method thereof and method of forming resist pattern used therein
08/02/2001US20010010377 Ferroelectric integrated circuit having low sensitivity to hydrogen exposure and method for fabricting same
08/02/2001US20010010376 Base current reversal SRAM memory cell and method
08/02/2001US20010010375 Gallium phosphide semiconductor configuration and production method
08/02/2001US20010010370 Active matrix substrate plate and manufacturing method therefor
08/02/2001US20010010362 Methods and devices for achieving alignment of a beam-propagation axis with a center of an aperture in a charged-particle-beam optical system
08/02/2001US20010010356 Through-the-substrate investigation of flip-chip IC's
08/02/2001US20010010324 Solder bump forming method and apparatus
08/02/2001US20010010322 Method of checking wirebond condition
08/02/2001US20010010309 System of controlling the temperature of a processing chamber
08/02/2001US20010010308 Method of measuring electromagnetic radiation
08/02/2001US20010010307 Thermal processing apparatus
08/02/2001US20010010306 Etching method and apparatus
08/02/2001US20010010305 Precision polishing method and apparatus of substrate
08/02/2001US20010010257 Gas injection system for plasma processing
08/02/2001US20010010256 Substrate support mechanism and substrate rotation device
08/02/2001US20010010255 Dry etching endpoint detection system
08/02/2001US20010010229 Stripping the patterned resist from the semiconductor structure; contacting carbon containing resist debris remaining on the semiconductor structure with ozone to reduc the amount of carbon debris thereon.
08/02/2001US20010010228 Method of protecting quartz hardware from etching during plasma-enhanced cleaning of a semiconductor processing chamber
08/02/2001US20010010207 Plasma process apparatus
08/02/2001US20010010204 Substrate transfer apparatus of substrate processing system
08/02/2001US20010010203 Molecular beam source and molecular beam epitaxy apparatus
08/02/2001US20010010126 Vacuum processing apparatus and operating method therefor
08/02/2001US20010010119 Apparatus and method for removing carrier film from a singulated die
08/02/2001US20010010112 Manufacturing method of semiconductor wafer, semiconductor manufacturing apparatus, and semiconductor device