Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2001
08/07/2001US6270618 Plasma processing apparatus
08/07/2001US6270617 RF plasma reactor with hybrid conductor and multi-radius dome ceiling
08/07/2001US6270613 Process of forming electrode of chip electronic part
08/07/2001US6270587 Epitaxial wafer having a gallium nitride epitaxial layer deposited on semiconductor substrate and method for preparing the same
08/07/2001US6270585 Device and process for treating substrates in a fluid container
08/07/2001US6270584 Apparatus for drying and cleaning objects using controlled aerosols and gases
08/07/2001US6270583 Closed type semiconductor wet thermal oxidation apparatus
08/07/2001US6270582 Single wafer load lock chamber for pre-processing and post-processing wafers in a vacuum processing system
08/07/2001US6270581 Wet-oxidation apparatus and wet-oxidation method
08/07/2001US6270580 Modified material deposition sequence for reduced detect densities in semiconductor manufacturing
08/07/2001US6270579 Nozzle arm movement for resist development
08/07/2001US6270576 Used for blue and green optoelectronic devices
08/07/2001US6270574 Method of growing a buffer layer using molecular beam epitaxy
08/07/2001US6270573 Growing silicon carbide thin film via molecular beam epitaxy (mbe) on hexagonal crystal using an off-cut inclined surface prevents occurrence of twin; substrate crystal layers each have different stacked crystal systems; semiconductors
08/07/2001US6270572 Method for manufacturing thin film using atomic layer deposition
08/07/2001US6270568 Method for fabricating a semiconductor structure with reduced leakage current density
08/07/2001US6270397 Chemical mechanical polishing device with a pressure mechanism
08/07/2001US6270396 Conditioning apparatus and conditioning method
08/07/2001US6270395 Oxidizing polishing slurries for low dielectric constant materials
08/07/2001US6270393 Abrading a semiconductor integrated circuit using a slurry comprising an aluminum grain, an inorganic salt, a water-soluble chelating agent, and an abrasive oil; no microscratches; thin film magnetic head
08/07/2001US6270392 Polishing apparatus and method with constant polishing pressure
08/07/2001US6270353 Low cost shallow trench isolation using non-conformal dielectric material
08/07/2001US6270307 Method for aligning wafers in a cassette
08/07/2001US6270306 Wafer aligner in center of front end frame of vacuum system
08/07/2001US6270246 Apparatus and method for precise mixing, delivery and transfer of chemicals
08/07/2001US6270002 Ball arrangement method and ball arrangement apparatus
08/07/2001US6270000 Wire bonding method
08/07/2001US6269999 Semiconductor chip mounting method utilizing ultrasonic vibrations
08/07/2001US6269998 Process for manufacturing electronic circuits
08/07/2001US6269975 Chemical delivery systems and methods of delivery
08/07/2001US6269826 Collapsible play structures
08/07/2001US6269822 Installation for wet-treating substrates
08/07/2001US6269742 Method and stencil for extruding material on a substrate
08/07/2001US6269723 Method and apparatus for enhancement of a punch guide/receptor tool in a dambar removal system
08/07/2001US6269699 Determination of actual defect size in cathode sputter targets subjected to ultrasonic inspection
08/07/2001US6269552 Method of drying substrates and drying apparatus
08/07/2001US6269548 Spin processing apparatus
08/07/2001US6269510 Post CMP clean brush with torque monitor
08/07/2001CA2203468C A cerium oxide-metal/metalloid oxide mixture
08/02/2001WO2001056119A2 Line-narrowing module for tunable laser
08/02/2001WO2001056088A1 Light emitting diode and semiconductor laser
08/02/2001WO2001056087A1 Memory cell structure integrated on semiconductor
08/02/2001WO2001056085A1 Semiconductor wafer and method for producing the same
08/02/2001WO2001056080A1 Method and laminate for fabricating an integrated circuit
08/02/2001WO2001056079A2 A method for transferring and stacking of semiconductor devices
08/02/2001WO2001056078A1 Method of fabricating copper interconnections using a sacrificial dielectric layer
08/02/2001WO2001056077A1 Method of fabricating copper interconnections in semiconductor devices
08/02/2001WO2001056076A1 An integrated circuit with shallow trench isolation and fabrication process
08/02/2001WO2001056075A1 Nitridation barriers for nitridated tunnel oxide for circuitry for flash memory technology and for locos/sti isolation
08/02/2001WO2001056074A1 Wafer chuck, exposure system, and method of manufacturing semiconductor device
08/02/2001WO2001056073A1 Wafer container and dusting prevention method thereof and method for containing wafer
08/02/2001WO2001056072A1 Method for monitoring a manufacturing process
08/02/2001WO2001056071A1 Method for producing silicon epitaxial wafer
08/02/2001WO2001056070A1 Planarization process to achieve improved uniformity across semiconductor wafers
08/02/2001WO2001056069A1 A METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE OF SiC
08/02/2001WO2001056068A1 Monitor, method of monitoring, polishing device, and method of manufacturing semiconductor wafer
08/02/2001WO2001056065A2 Unreactive gas anneal and low temperature pretreatment of layered superlattice materials
08/02/2001WO2001056064A1 Device for thermal treatment of substrates
08/02/2001WO2001056063A2 Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners
08/02/2001WO2001055952A2 Method and system for collecting and transmitting chemical information
08/02/2001WO2001055836A1 Random number generator
08/02/2001WO2001055767A2 Microlithographic reduction projection catadioptric objective
08/02/2001WO2001055737A2 Analysis of cd-sem signal to detect scummed/closed contact holes and lines
08/02/2001WO2001055704A1 System for transferring fluid samples through a sensor array
08/02/2001WO2001055703A1 Method of preparing a sensor array
08/02/2001WO2001055702A1 Portable sensor array system
08/02/2001WO2001055701A1 System and method for the analysis of bodily fluids
08/02/2001WO2001055479A1 Apparatus and method for epitaxially processing a substrate
08/02/2001WO2001055478A2 Method and device for depositing a precursor on a substrate, said precursor being present in liquid form
08/02/2001WO2001055243A1 Solvent-free thermosetting resin composition, process for producing the same, and product therefrom
08/02/2001WO2001054880A2 Conveyorized vacuum injection system
08/02/2001WO2001054862A1 System and method for controlled polishing and planarization of semiconductor wafers
08/02/2001WO2001054853A2 Method and apparatus for repair of defects in materials with short laser pulses
08/02/2001WO2001054831A1 Method and apparatus for cleaning workpieces with uniform relative velocity
08/02/2001WO2001032793A3 Use of cesium hydroxide in a dielectric cmp slurry
08/02/2001WO2001018870A3 Charge compensating semiconductor device and method for the production thereof
08/02/2001WO2001018869A3 Semiconductor element for high blocking voltages during a simultaneously low closing resistance and method for the production thereof
08/02/2001WO2001017016A3 Capacitor-over-bit line memory circuitry
08/02/2001WO2001009662A3 Scanning interferometric near-field confocal microscopy
08/02/2001WO2001008221A9 High frequency module
08/02/2001WO2001004944B1 Method and apparatus for simultaneously cleaning and annealing a workpiece
08/02/2001WO2000079298A3 Magnetic systems with irreversible characteristics and a method of manufacturing and repairing and operating such systems
08/02/2001WO2000060644A3 A method of manufacturing a trench gated vdmos
08/02/2001WO2000058999B1 Semiconductor structures having a strain compensated layer and method of fabrication
08/02/2001WO2000042621A3 Epitaxial thin films
08/02/2001WO2000033356A9 Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
08/02/2001US20010011362 Semiconductor layout design method and apparatus
08/02/2001US20010011198 Method and apparatus for automatically generating schedules for wafer processing within a multichamber semiconductor wafer processing tool
08/02/2001US20010011003 Structure of polishing head of polishing apparatus
08/02/2001US20010011002 Wafer processing machine
08/02/2001US20010011000 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device
08/02/2001US20010010999 Wafer polishing apparatus
08/02/2001US20010010997 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device
08/02/2001US20010010996 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device
08/02/2001US20010010976 Method and system for reducing ARC layer removal bamd providing a capping layer for the ARC layer
08/02/2001US20010010975 Feeding oxidation species containing a low concentration of water, which is generated from hydrogen and oxygen by the catalytic action, to the main surface of or in the vicinity of a semiconductor wafer
08/02/2001US20010010974 Method for fabricating an electronic device
08/02/2001US20010010973 Method for producing a structure with narrow pores
08/02/2001US20010010972 Methods, apparatuses, and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes
08/02/2001US20010010971 Silicide pattern structures and methods of fabricating the same