Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2001
08/09/2001WO2001057909A1 Object carrier for a particle-optical apparatus
08/09/2001WO2001057908A2 A method and apparatus for implanting semiconductor wafer substrates
08/09/2001WO2001057740A2 Calibration software tool and method
08/09/2001WO2001057598A1 Reticle stocking and sorting management system
08/09/2001WO2001057597A1 Polymeric compound for photoresist and resin composition for photoresist
08/09/2001WO2001057588A1 Insulated-gate transistor for liquid crystal display and method for fabricating the same
08/09/2001WO2001057150A1 Polishing composition
08/09/2001WO2001057112A1 Adhesive polyimide resin and adhesive laminate
08/09/2001WO2001056744A1 Endpoint monitoring with polishing rate change
08/09/2001WO2001056739A1 Grinding pin for grinding machines comprising resin bonded selections of rough grit and fine grit
08/09/2001WO2001056713A1 Device and method for washing substrate end face
08/09/2001WO2001047659A8 Energy-efficient, laser-based method and system for processing target material
08/09/2001WO2001004930A3 Thermal processing chamber for heating and cooling wafer-like objects
08/09/2001WO2001004929A3 A method of forming a film in a chamber
08/09/2001WO2000079356A3 Robot pre-positioning in a wafer processing system
08/09/2001WO2000071921A3 Burrless castellation via process and product for plastic chip carrier
08/09/2001WO2000071787A3 Semi-insulating silicon carbide without vanadium domination
08/09/2001WO2000052750A3 Method for producing a body area for a vertical mos transistor array with reduced specific starting resistor
08/09/2001WO1999054694A9 Method and apparatus for monitoring plasma processing operations
08/09/2001US20010012971 Method and apparatus for automatically performing cleaning processes in a semiconductor wafer processing system
08/09/2001US20010012970 System, process, apparatus and program for controlling special lot carrying in semiconductor carrying facility
08/09/2001US20010012868 A low-molecular-weight polyester formed from a single species of linear aliphatic diol and a single species of dicarboxylic acid with a single species of diisocyanate; impervious to oxygen and moisture; food and drug packaging
08/09/2001US20010012751 System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques
08/09/2001US20010012704 Interconnect assemblies and methods
08/09/2001US20010012702 Method of crystallizing silicon film and method of manufacturing thin film transistor liquid crystal display (tft- lcd using the same
08/09/2001US20010012701 Method of forming a silicon nitride thin film
08/09/2001US20010012700 Semiconductor processing methods of chemical vapor depositing sio2 on a substrate
08/09/2001US20010012699 Base thermal SiO2 film 1a is exposed to any gas selected from silicon,germanium or stanium halides
08/09/2001US20010012698 Metal oxide thin films for high dielectric constant application
08/09/2001US20010012697 Apparatus for manufacturing a semiconductor device in a CVD reactive chamber
08/09/2001US20010012695 Bit line and manufacturing method thereof
08/09/2001US20010012694 Plasma etching method using low ionization potential gas
08/09/2001US20010012693 Method for forming a silicide region on a silicon body
08/09/2001US20010012691 Method for forming an integrated circuit interconnect using a dual poly process
08/09/2001US20010012690 Optimized metal etch process to enable the use of aluminum plugs
08/09/2001US20010012689 Interconnect structure with silicon containing alicyclic polymers and low-k dieletric materials and method of making same with single and dual damascene techniques
08/09/2001US20010012688 Process for forming miniature contact holes in semiconductor device without short-circuit
08/09/2001US20010012687 Gap filling process in integrated circuits using low dielectric constant materials
08/09/2001US20010012686 Semiconductor device and fabricating method thereof
08/09/2001US20010012685 In situ plasma pre-deposition wafer treatment in chemical vapor deposition technology for semiconductor integrated circuit applications
08/09/2001US20010012684 Method of forming interconnect
08/09/2001US20010012683 Method of partially plating substrate for electronic devices
08/09/2001US20010012680 Method of depositing a thermoplastic polymer in semiconductor fabrication
08/09/2001US20010012679 Method of activating compound semiconductor layer to p-type compound semiconductor layer
08/09/2001US20010012678 Method for the formation of semiconductor layer
08/09/2001US20010012677 Semiconductor element forming process having a step of separating film structure from substrate
08/09/2001US20010012676 Isolation Region forming methods
08/09/2001US20010012675 Forming silicon spacers on the sidewall trench regions, oxidazing to form a first oxide layer, filling trench regions with a second oxide, removing portions of first and second oxide layers which exceed trench regions
08/09/2001US20010012674 Apparatus for improving alignment for metal masking
08/09/2001US20010012673 Mos transistor having self-aligned well bias area and method of fabricating the same
08/09/2001US20010012672 Method of forming CMOS integrated circuitry
08/09/2001US20010012671 Semiconductor device and a method of manufacturing the same
08/09/2001US20010012670 Semiconductor device and method manufacturing same
08/09/2001US20010012669 Method of manufacturing of semiconductor device having low leakage current
08/09/2001US20010012668 Method for forming a fet
08/09/2001US20010012667 Clustered system and method for formation of integrated circuit devices
08/09/2001US20010012666 Electrostatic discharge protection for salicided devices
08/09/2001US20010012665 Semiconductor device and method for fabricating the same
08/09/2001US20010012664 Semiconductor processing methods of forming transistors, semiconductor processing methods of forming dynamic random access memory circuitry, and related integrated circuitry
08/09/2001US20010012663 Single feature size mos technology power device
08/09/2001US20010012662 A new structure to fabricate split-gate with self-aligned source and self-aligned floating gate to control gate
08/09/2001US20010012661 Method to fabricate a flash memory cell with a planar stacked gate
08/09/2001US20010012660 Methods of forming a capacitor
08/09/2001US20010012659 Method of manufacturing semiconductor device having capacitor
08/09/2001US20010012658 Method for producing a semiconductor memory device
08/09/2001US20010012657 Methods of electrically contacting to conductive plugs, methods of forming contact openings, and methods of forming dynamic random access memory circuitry
08/09/2001US20010012656 Method of forming dram trench capacitor with metal layer over hemispherical grain polysilicon
08/09/2001US20010012655 Bipolar transistor
08/09/2001US20010012654 High density mos technology power device
08/09/2001US20010012653 Method for fabricating mos transistors
08/09/2001US20010012652 Microwave monolithic integrated circuit and fabrication process thereof
08/09/2001US20010012651 Laser illumination apparatus
08/09/2001US20010012650 Method of manufacturing thin film transistor
08/09/2001US20010012649 Semiconductor substrate processing method
08/09/2001US20010012648 Thin film transistor and method of fabricating the same
08/09/2001US20010012646 Semiconductor chip module and method for manufacturing the same
08/09/2001US20010012645 Semiconductor devices and the manufacturing method
08/09/2001US20010012644 Method for mounting a semiconductor chip on a substrate, and semiconductor device adapted for mounting on a substrate
08/09/2001US20010012643 Package having very thin semiconductor chip, multichip module assembled by the package, and method for manufacturing the same
08/09/2001US20010012642 Oxidizing a surface of a polymeric film, treating modified polymeric film with a polyamine coupling agent, and contacting a polymeric material for adhesion to polymeric film
08/09/2001US20010012641 Semiconductor processing methods of forming encapsulant over semiconductive dies, and methods of forming die packages
08/09/2001US20010012639 Methods of semiconductor Processing
08/09/2001US20010012604 Single-substrate-heat-treating apparatus for semiconductor process system
08/09/2001US20010012601 Surface treatment agent for resist pattern, and patterning process
08/09/2001US20010012598 High conformality antireflective coating compositions
08/09/2001US20010012592 The plasma polymerized organosilicon film having an upper stratum overlying a lower stratum wherein the upper stratum is more photosensitive to ultraviolet radiation than is the lower stratum
08/09/2001US20010012547 Raw material for production of GaAs crystals
08/09/2001US20010012544 Method for producing liquid crystal display and method for cleaning substrate
08/09/2001US20010012526 Package stack via bottom leaded plastic (BLP) packaging
08/09/2001US20010012483 Multiple-shaft power transmission apparatus and wafer transport arm link
08/09/2001US20010012481 Wafer handling system
08/09/2001US20010012457 Semiconductor wafer manufacturing method and apparatus for an improved heat exchanger for a photoresist developer
08/09/2001US20010012456 Developing method and developing apparatus
08/09/2001US20010012408 CMOS digital optical navigation chip
08/09/2001US20010012393 Visual inspection apparatus
08/09/2001US20010012392 Method and apparatus for inspecting wafers
08/09/2001US20010012391 Pattern inspection method and apparatus
08/09/2001US20010012311 Method for determining life of laser light source
08/09/2001US20010012231 Memory circuit/logic circuit integrated device capable of reducing term of works
08/09/2001US20010012229 Semiconductor memory device