| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 08/16/2001 | US20010013627 Integrated photovoltaic switch with integrated power device |
| 08/16/2001 | US20010013626 Semiconductor device |
| 08/16/2001 | US20010013624 Semiconductor device and process for producing the same |
| 08/16/2001 | US20010013623 Simplified method of patterning polysilicon gate in a semiconductor device |
| 08/16/2001 | US20010013622 Field effect transistor, control method for controling such a field effect transistor and a frequency mixer means including such a field effect transistor |
| 08/16/2001 | US20010013621 Memory Device |
| 08/16/2001 | US20010013620 Semiconductor device and method for producing a semiconductor device |
| 08/16/2001 | US20010013619 Capacitors and dram arrays |
| 08/16/2001 | US20010013618 Semiconductor device and method of fabricating the same |
| 08/16/2001 | US20010013617 Semiconductor device and method of manufacturing the same |
| 08/16/2001 | US20010013616 Integrated circuit device with composite oxide dielectric |
| 08/16/2001 | US20010013615 Integrated circuit fabrication |
| 08/16/2001 | US20010013614 Iridium oxide diffusion barrier between local interconnect layer and thin film of layered superlattice material |
| 08/16/2001 | US20010013611 Semiconductor integrated circuit device and method of manufacturing the same |
| 08/16/2001 | US20010013608 Semiconductor device, its manufacturing method and substrate for manufacturing a semiconductor device |
| 08/16/2001 | US20010013607 Fabrication method for a thin film semiconductor device, the thin film semiconductor device itself, liquid crystal display, and electronic device |
| 08/16/2001 | US20010013606 Apparatus for mapping scratches in an oxide film |
| 08/16/2001 | US20010013604 Compound semiconductor device and process for fabricating the same |
| 08/16/2001 | US20010013602 Apparatus for forming electrode of chip-like electronic part |
| 08/16/2001 | US20010013601 Semiconductor device and method for manufacturing thereof |
| 08/16/2001 | US20010013600 Semiconductor device with high-temperature-stable gate electrode for sub-micron applications and fabrication thereof |
| 08/16/2001 | US20010013599 Method of manufacturing mask read-only memory cell |
| 08/16/2001 | US20010013598 Semiconductor memory device having memory cell area and peripheral circuit area |
| 08/16/2001 | US20010013580 Cooling of voice coil motors in lithographic projection apparatus |
| 08/16/2001 | US20010013578 Ion implantation equipment and implantation method thereof |
| 08/16/2001 | US20010013577 X-ray image sensor and method for fabricating the same |
| 08/16/2001 | US20010013555 Liquid processing apparatus and method |
| 08/16/2001 | US20010013536 Process system and process method for mounting leadframes |
| 08/16/2001 | US20010013532 Apparatus for positioning a thin plate |
| 08/16/2001 | US20010013531 Apparatus and method of clamping semiconductor devices using sliding finger supports |
| 08/16/2001 | US20010013515 Heat and cooling treatment apparatus and substrate processing system |
| 08/16/2001 | US20010013507 Method for CMP of low dielectric constant polymer layers |
| 08/16/2001 | US20010013506 Chemical mechanical polishing; microelectronics; semiconductors; eliminating short circuiting |
| 08/16/2001 | US20010013502 For removing remaining resist layer film after etching without swelling the insulation film (acrylic or polyimide resin); semiconductors; liquid crystal displays |
| 08/16/2001 | US20010013472 Forming copper film on insulation layer; immersion in solution of plating promoter; removing promoter from copper film leaving it on side walls and bottoms of via holes; electroplating to fill holes; improvement over planarization |
| 08/16/2001 | US20010013424 Electronic component, method of sealing electronic component with resin, and apparatus therefor |
| 08/16/2001 | US20010013423 Flip chip attach on flexible circuit carrier using chip with metallic cap on solder |
| 08/16/2001 | US20010013421 Leaded semiconductor device package for use in nonsoldering assembling |
| 08/16/2001 | US20010013393 Low molecular weight polyester of a linear aliphatic diol and a dicarboxylic acid reacted with a diisocyanate; high crystallinity; high oxygen and moisture barrier properties |
| 08/16/2001 | US20010013392 Assembly process for flip chip package having a low stress chip and resulting structure |
| 08/16/2001 | US20010013371 Gas panel |
| 08/16/2001 | US20010013363 Apparatus and method for feeding gases for use in semiconductor manufacturing |
| 08/16/2001 | US20010013355 Fast single-article megasonic cleaning process for single-sided or dual-sided cleaning |
| 08/16/2001 | US20010013340 Silicon support members for wafer processing fixtures |
| 08/16/2001 | US20010013316 Conveyorized vacuum injection system |
| 08/16/2001 | US20010013313 Apparatus for fabricating semiconductor structures and method of forming the structures |
| 08/16/2001 | US20010013311 Epitaxial compound structure and device comprising same |
| 08/16/2001 | US20010013172 Process for producing an electrical component having a plurality of soldered-on plug contacts |
| 08/16/2001 | US20010013161 Substrate processing apparatus and substrate processing method |
| 08/16/2001 | EP1124310A2 Two-dimensional electric motor, exposure apparatus and semiconductor fabrication method |
| 08/16/2001 | EP1124270A2 Method for producing piezoelectric films with rotating magnetron sputtering system |
| 08/16/2001 | EP1124269A2 Method for producing devices having piezoelectric films |
| 08/16/2001 | EP1124264A2 Method of manufacturing transparent conducting structures and use of transparent conducting oxide layers to pattern transparent conducting regions |
| 08/16/2001 | EP1124262A2 Multilayer dielectric stack and method |
| 08/16/2001 | EP1124260A2 Semiconductor device with reverse conducting faculty |
| 08/16/2001 | EP1124259A2 Cooling device for a high power semiconductor module |
| 08/16/2001 | EP1124258A2 Reduction of orientation dependent oxidation for vertical sidewalls of semiconductor substrates |
| 08/16/2001 | EP1124257A2 Phosphorous doped copper film |
| 08/16/2001 | EP1124256A1 Ceramic substrate |
| 08/16/2001 | EP1124254A2 Easy to remove hard mask layer for semiconductor device fabrication |
| 08/16/2001 | EP1124253A1 Process for etching trenches in a semiconductor material |
| 08/16/2001 | EP1124252A2 Apparatus and process for processing substrates |
| 08/16/2001 | EP1124170A1 Reference voltage generation circuit including a start-up circuit |
| 08/16/2001 | EP1124078A2 Active anti-vibration apparatus and exposure apparatus |
| 08/16/2001 | EP1123991A2 Low dielectric constant materials and processes |
| 08/16/2001 | EP1123753A2 Mesoporous ceramic films having reduced dielectric constants |
| 08/16/2001 | EP1123639A2 Wafer level burn-in and test thermal chuck and method |
| 08/16/2001 | EP1123563A1 Techniques for triple and quadruple damascene fabrication |
| 08/16/2001 | EP1123562A1 Layer processing |
| 08/16/2001 | EP1123561A1 Method and system to control the concentration of dissolved gas in a liquid |
| 08/16/2001 | EP1123560A2 Method for producing a wafer support in a high-temperature cvd reactor |
| 08/16/2001 | EP1123556A1 Fuse circuit having zero power draw for partially blown condition |
| 08/16/2001 | EP1123512A1 High density printed circuit board |
| 08/16/2001 | EP1123423A1 High rate silicon deposition method at low pressures |
| 08/16/2001 | EP1123348A2 Impact-resistant epoxide resin compositions |
| 08/16/2001 | EP1123166A1 Method of removing organic materials from substrates |
| 08/16/2001 | EP0980305A4 Method and apparatus for molding plastic packages |
| 08/16/2001 | EP0953207B1 Method for doping metallic connecting wire |
| 08/16/2001 | EP0946985B1 Memory cell arrangement and process for manufacturing the same |
| 08/16/2001 | EP0892991B1 Semiconductor component with adjustable current amplification based on avalanche breakdown controlled by tunnel current |
| 08/16/2001 | EP0852066B1 Process for generating the source regions of a flash-eeprom storage cell field |
| 08/16/2001 | DE10106006A1 SJ-Halbleiterbauelement und Verfahren zu dessen Herstellung SJ-semiconductor device and process for its preparation |
| 08/16/2001 | DE10105920A1 Semiconducting component has anisotropically conductive film connecting semiconducting element to circuit board, film substrate of insulating resin with mutually insulated conducting tracks |
| 08/16/2001 | DE10105876A1 Anschlußstruktur und zugehöriges Herstellungsverfahren Terminal structure and manufacturing method thereof |
| 08/16/2001 | DE10104274A1 Contact structure used for e.g. MOSFETs, IGBTs and thyristors has a thin conducting separating layer applied to the exposed surfaces of the side wall spacer elements, and a relatively thick aluminum layer |
| 08/16/2001 | DE10101090A1 Verfahren des Schneidens von CSP-Substraten Process of cutting of CSP substrates |
| 08/16/2001 | DE10101067A1 Program execution system of semiconductor test device, has programs in processor which are written in exclusive and general purpose programming languages based on hardware for semiconductor examination |
| 08/16/2001 | DE10061769A1 Halbleiterspeicherbaustein A semiconductor memory device |
| 08/16/2001 | DE10060900A1 Surface state measuring device for semiconductor substrate manufacture has control unit which controls position and angle of irradiation of infrared rays to semiconductor wafer |
| 08/16/2001 | DE10055648A1 Siliziumwafer mit gesteuerter Störstellenverteilung, Verfahren zur Herstellung desselben und Czochralski-Ziehapparate zur Herstellung von Einkristall-Siliziumrohlingen Silicon wafer with a controlled impurity, method for producing the same and Czochralski pulling apparatus for producing single crystal silicon ingots |
| 08/16/2001 | DE10046911A1 Photo mask for manufacturing semiconductors has monitoring marking with coarse, high density and cross patterns on substrate for assuring dimensions of actual pattern and coincidence |
| 08/16/2001 | DE10036961A1 Testing semiconducting wafers involves electrically testing each chip on each wafer to identify sub-area with most wafers with more defective chips in sub-area than in surrounding area |
| 08/16/2001 | DE10008532C1 Method and device for removing the hood of a processing chamber detaches the hood from a support protruding at the side over the hood and fixed with a clamping ring and a tension mechanism for resetting the hood. |
| 08/16/2001 | DE10006447A1 Miniaturized component has system bearer and crystalline substrate surfaces at defined angle, adhesive fully or partly filling space between distance structures, substrate and system bearer |
| 08/16/2001 | DE10006215A1 Kühlvorrichtung für ein Hochleistungs-Halbleitermodul A cooling apparatus for a high-power semiconductor module |
| 08/16/2001 | DE10006108A1 Process for the epitaxial growth of single crystalline aluminum nitride layers on silicon substrates comprises preparing substrate to form terrace layer, vaporizing an aluminum layer |
| 08/16/2001 | DE10005564A1 Verfahren zur Herstellung definierter polykristalliner Silizium-Bereiche in einer amorphen Siliziumschicht A process for preparing polycrystalline silicon of defined regions in an amorphous silicon layer |
| 08/16/2001 | DE10005484A1 Forming thin coating for manufacturing semiconducting components involves applying coating to material resistant to melting temperature or cover of material to coating before melting |
| 08/16/2001 | DE10005442A1 Bipolartransistor Bipolar transistor |
| 08/16/2001 | DE10005368A1 Electrical contact on semiconductor materials comprises binary or ternary metal alloy having melting point which matches process temperature |