Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2001
08/14/2001US6274417 Method of forming a semiconductor device
08/14/2001US6274416 Method for fabricating a semiconductor device including a latch-up preventing conductive layer
08/14/2001US6274415 Self-aligned Vt implant
08/14/2001US6274414 Laser anneal method of a semiconductor layer
08/14/2001US6274413 Method for fabricating a polysilicon thin film transistor
08/14/2001US6274412 Material and method for printing high conductivity electrical conductors and other components on thin film transistor arrays
08/14/2001US6274411 Method for manufacturing electronic devices, comprising non-salicided non-volatile memory cells, non-salicided HV transistors, and LV transistors with salicided junctions with few masks
08/14/2001US6274410 Method of programming a semiconductor memory
08/14/2001US6274409 Method for making a semiconductor device
08/14/2001US6274408 Method for producing a plastic molded semiconductor package
08/14/2001US6274407 Method and article for attaching high-operating-temperature electronic component
08/14/2001US6274406 Semiconductor device and a method of manufacturing the same
08/14/2001US6274405 Semiconductor device, method of making the same, circuit board, and film carrier tape
08/14/2001US6274404 Multilayered wiring structure and method of manufacturing the same
08/14/2001US6274403 Process for producing heteropitaxial diamond layers on Si-substrates
08/14/2001US6274402 Method of fabricating a silicon solar cell
08/14/2001US6274401 Method of manufacturing a CCD sensor with a deep well
08/14/2001US6274400 Tri-layer process for forming TFT matrix of LCD with reduced masking steps
08/14/2001US6274399 Method of strain engineering and impurity control in III-V nitride semiconductor films and optoelectronic devices
08/14/2001US6274397 Method to preserve the testing chip for package's quality
08/14/2001US6274394 Method and system for determining the fail patterns of fabricated wafers in automated wafer acceptance test
08/14/2001US6274393 Method for measuring submicron images
08/14/2001US6274389 Sealing space between carrier substrate and circuit board with reaction product of epoxy resin, curing agent and plasticizer
08/14/2001US6274388 Annealing of a crystalline perovskite ferroelectric cell
08/14/2001US6274291 Method of reducing defects in I/C card and resulting card
08/14/2001US6274290 Raster scan gaussian beam writing strategy and method for pattern generation
08/14/2001US6274287 Positive resist compositions comprising a hydroxyphenyl ketone
08/14/2001US6274280 Multilayer attenuating phase-shift masks
08/14/2001US6274253 Processing methods for providing metal-comprising materials within high aspect ratio openings
08/14/2001US6274245 Foil for use in filing substrate recesses
08/14/2001US6274234 Very long and highly stable atomic wires, method for making these wires, application in nano-electronics
08/14/2001US6274214 Microelectronic package module with temporary lid
08/14/2001US6274198 Providing semiconductor mask with aperture for defining area of substrate to be covered by material, forming pyramidal shaped features with sidewalls; mounting spheres; positioning mask; depositing material through aperture
08/14/2001US6274059 Method to remove metals in a scrubber
08/14/2001US6274058 Remote plasma cleaning method for processing chambers
08/14/2001US6274024 Apparatus and method for plating wafers, substrates and other articles
08/14/2001US6274023 Configuring the fluid dynamics and electrostatics of a plating process in order to provide improved uniformity in plating deposition, improved plating rates, and improved step coverage of via holes.
08/14/2001US6274013 Electrode semiconductor workpiece holder
08/14/2001US6274008 Sputtering, magnetron producing a large volume of plasma, preferably a high-density plasma, long travel path allows large fraction of the sputtered atoms to be ionized so their energy can be controlled by substrate biasing. simultaneous
08/14/2001US6274007 Sputtering a silicon surface by a uniform flow of nitrogen molecular ions in an ultra-high vacuum so as to form a periodic wave-like relief,
08/14/2001US6273962 Method to reduce the particles in load-lock chamber
08/14/2001US6273961 Method for cleaning semiconductor processing equipment by reducing particles
08/14/2001US6273959 Method of cleaning semiconductor device
08/14/2001US6273958 Substrate support for plasma processing
08/14/2001US6273957 Vaporizing device for CVD source materials and CVD apparatus employing the same
08/14/2001US6273956 Synchronous multiplexed near zero overhead architecture for vacuum processes
08/14/2001US6273954 System for manufacturing a semiconductor device
08/14/2001US6273951 Precursor mixtures for use in preparing layers on substrates
08/14/2001US6273950 SiC device and method for manufacturing the same
08/14/2001US6273946 Method for production of multi-layered epitaxially grown crystal and apparatus therefor
08/14/2001US6273944 Silicon wafer for hydrogen heat treatment and method for manufacturing the same
08/14/2001US6273806 Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
08/14/2001US6273804 Apparatus for polishing wafers
08/14/2001US6273803 Carriers and polishing apparatus
08/14/2001US6273802 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device
08/14/2001US6273798 Pre-conditioning polishing pads for chemical-mechanical polishing
08/14/2001US6273794 Apparatus and method for grinding a semiconductor wafer surface
08/14/2001US6273791 Method of producing semiconductor wafer
08/14/2001US6273786 Tungsten chemical-mechanical polishing process using a fixed abrasive polishing pad and a tungsten layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad
08/14/2001US6273700 Mold structure used in method of molding circuitry
08/14/2001US6273664 Coupling system for the transfer of a confined planar object from a containment pod to an object processing unit
08/14/2001US6273543 Aqueous developable high performance curable polymers
08/14/2001US6273484 Wafer holding device
08/14/2001US6273344 Dispensing nozzle device
08/14/2001US6273328 Solder bump forming method and apparatus
08/14/2001US6273275 Cassette for loading glass substrates
08/14/2001US6273261 Identification structure of a substrate storage container and method of identifying a substrate storage container
08/14/2001US6273129 Device for distributing a working gas and installation for supplying a working gas that is equipped with such a device
08/14/2001US6273110 Automated semiconductor processing system
08/14/2001US6273108 Apparatus and method for processing the surface of a workpiece with ozone
08/14/2001US6273107 Positive flow, positive displacement rinse tank
08/14/2001US6273104 Processing fluid is supplied to a surface of the substrate while supplying inert gas into a space between the substrate and a blocking plate; no turbulence is created at the surface of substrate preventing pollutant adherence
08/14/2001US6273101 Method for post chemical-mechanical planarization cleaning of semiconductor wafers
08/14/2001US6273099 Forming marks on a silicon wafer, immersing the wafer in a cleaning solution of ammonium hydroxide, hydrogen peroxide, and water agitated by megasonic energy, transfering to quick dump rinse tank filled of deionized water, and drying wafer
08/14/2001US6273098 Extension of the useful life of a chemical bath used to process a substrate
08/14/2001US6273023 Plasma processing apparatus capable of reliably, electrostatically attracting and holding and thus fixing semiconductor wafer
08/14/2001US6273022 Distributed inductively-coupled plasma source
08/14/2001US6272768 Apparatus for treating an object using ultra-violet light
08/14/2001US6272763 Staging apparatus and method, and method for manufacturing the staging apparatus, and exposing apparatus using the staging apparatus
08/14/2001US6272736 Method for forming a thin-film resistor
08/14/2001US6272712 Brush box containment apparatus
08/14/2001CA2228507C Optoelectronic material, device using the same, and method for manufacturing optoelectronic material
08/11/2001WO2001084608A1 Production method of iii nitride compound semiconductor substrate and semiconductor device
08/09/2001WO2001057935A1 Light-emitting thyristor matrix array and driver circuit
08/09/2001WO2001057931A1 Field effect transistor and method for the production of a charge carrier injected field effect transistor
08/09/2001WO2001057929A1 Group iii nitride based fets and hemts with reduced trapping and method for producing the same
08/09/2001WO2001057928A1 High power capacitors from thin layers of metal powder or metal sponge particles
08/09/2001WO2001057927A1 Silicon nanoparticle field effect transistor and transistor memory device
08/09/2001WO2001057926A1 Mos field effect transistor arrangement
08/09/2001WO2001057925A1 Protection device for schottky diodes
08/09/2001WO2001057924A1 Semiconductor component with contacts provided on the lower side thereof, and method for producing the same
08/09/2001WO2001057923A1 Method for producing electrical connections in particular for an electronic device
08/09/2001WO2001057922A1 Method and apparatus for singulation of electronic devices
08/09/2001WO2001057921A1 Etching solution and method
08/09/2001WO2001057920A1 Process for wafer level treatment to reduce stiction and passivate micromachined surfaces and compounds used therefor
08/09/2001WO2001057919A1 Polishing composite for use in lsi manufacture and method of manufacturing lsi
08/09/2001WO2001057918A1 Method for forming thin layers of silicon and germanium compounds
08/09/2001WO2001057916A2 Bipolar transistor
08/09/2001WO2001057914A2 Process of manufacturing a semiconductor device including a buried channel field effect transistor
08/09/2001WO2001057911A1 Method for carrying out a plasma etching process