| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 08/21/2001 | US6276992 Method of forming a groove in a surface of a mother substrate |
| 08/21/2001 | US6276913 Mold for resin sealing |
| 08/21/2001 | US6276892 Wafer handling apparatus |
| 08/21/2001 | US6276731 Wafer carrying fork |
| 08/21/2001 | US6276599 Method and apparatus for forming solder bumps |
| 08/21/2001 | US6276596 Low temperature solder column attach by injection molded solder and structure formed |
| 08/21/2001 | US6276594 Method for positioning the bond head in a wire bonding machine |
| 08/21/2001 | US6276592 Process for the production of a holding device for semiconductor disks and holding device produced by this process |
| 08/21/2001 | US6276590 Conductive ball attaching apparatus and method |
| 08/21/2001 | US6276552 Sealed container latch system |
| 08/21/2001 | US6276379 Anti-microbubble deposition apparatus |
| 08/21/2001 | US6276378 Apparatus for cleaning both sides of substrate |
| 08/21/2001 | US6276372 Process using hydroxylamine-gallic acid composition |
| 08/21/2001 | US6276371 Positioning a sonic energy source along a flat bottom of a fluid container; supporting a wafer in vertical orientation by pair of supports on either side of wafer; directing sonic energy in line with wafer to its edge; rotating wafer |
| 08/21/2001 | US6276370 Sonic cleaning with an interference signal |
| 08/21/2001 | US6276295 Thermal reflow method employing microwave energy |
| 08/21/2001 | US6276184 Process and apparatus for manufacturing semiconductor devices |
| 08/21/2001 | US6276072 Method and apparatus for heating and cooling substrates |
| 08/21/2001 | CA2198588C Formation of a metalorganic compound for growing epitaxial semiconductor layers |
| 08/21/2001 | CA2191846C Triple zone mascara brush |
| 08/21/2001 | CA2064486C Method of preparing semiconductor wafer with good intrinsic gettering |
| 08/21/2001 | CA2041730C Stabilization of the interface between aluminum and titanium nitride |
| 08/21/2001 | CA2034017C Scanning device for optically scanning a surface along a line |
| 08/21/2001 | CA2032763C Prevention of via poisoning by glow discharge induced desorption |
| 08/16/2001 | WO2001060133A1 Methods and apparatus for operating high energy accelerator in low energy mode |
| 08/16/2001 | WO2001059894A1 Electric discharge laser with active wavelength chirp correction |
| 08/16/2001 | WO2001059893A1 Fast wavelength correction technique for a laser |
| 08/16/2001 | WO2001059850A2 Structures and methods for improved capacitor cells |
| 08/16/2001 | WO2001059849A1 THIN-FILM TRANSISTOR COMPRISING GATE ELECTRODE OF MoW ALLOY |
| 08/16/2001 | WO2001059848A2 Mos-gated semiconductor device having alternating conductivity type semiconductor regions and methods of making the same |
| 08/16/2001 | WO2001059846A1 Semiconductor device with voltage divider for increased reverse blocking voltage |
| 08/16/2001 | WO2001059845A2 Bipolar transistor |
| 08/16/2001 | WO2001059843A1 An improved capacitor in semiconductor chips |
| 08/16/2001 | WO2001059842A1 Vertical conduction flip-chip device with bump contacts on single surface |
| 08/16/2001 | WO2001059841A1 Three-dimensional interconnection method and electronic device obtained by same |
| 08/16/2001 | WO2001059839A1 Mounting structure for semiconductor chip, semiconductor device, and method of manufacturing semiconductor device |
| 08/16/2001 | WO2001059838A1 Passive alignment using slanted wall pedestal |
| 08/16/2001 | WO2001059837A1 Integrated circuit |
| 08/16/2001 | WO2001059836A1 Communicating device |
| 08/16/2001 | WO2001059835A1 Semiconductor devices |
| 08/16/2001 | WO2001059834A1 Self-aligned dual damascene etch using a polymer |
| 08/16/2001 | WO2001059833A1 Ceramic board for semiconductor production and inspection devices |
| 08/16/2001 | WO2001059832A2 Evaluation of etching processes in semiconductors |
| 08/16/2001 | WO2001059831A2 Method and apparatus for preparing semiconductor wafers for measurement |
| 08/16/2001 | WO2001059830A1 Thickness measuring apparatus, thickness measuring method, and wet etching apparatus and wet etching method utilizing them |
| 08/16/2001 | WO2001059828A2 Building component with constant distorsion-free bonding, and method for bonding |
| 08/16/2001 | WO2001059827A1 Encapsulation for an electrical component and method for producing the same |
| 08/16/2001 | WO2001059826A1 Silicon boat with protective film, method of manufacture thereof, and silicon wafer heat-treated using silicon boat |
| 08/16/2001 | WO2001059825A1 Method for removing photoresist and residues from semiconductor device surfaces |
| 08/16/2001 | WO2001059824A1 Formation of alloyed ohmic contacts on semi-conductor materials |
| 08/16/2001 | WO2001059823A1 Lamp anneal device and substrate of display device |
| 08/16/2001 | WO2001059822A1 A process for forming a semiconductor structure |
| 08/16/2001 | WO2001059821A1 A process for forming a semiconductor structure |
| 08/16/2001 | WO2001059820A1 Semiconductor structure |
| 08/16/2001 | WO2001059819A1 Methods of fabricating gallium nitride semiconductor layers on substrates including non-gallium nitride posts, and gallium nitride semiconductor structures fabricated thereby |
| 08/16/2001 | WO2001059818A1 Method for producing defined polycrystalline silicon areas in an amorphous silicon layer |
| 08/16/2001 | WO2001059817A1 Method for treating a diamond surface and corresponding diamond surface |
| 08/16/2001 | WO2001059816A1 Hot plate unit |
| 08/16/2001 | WO2001059815A2 Method and apparatus for processing a microelectronic workpiece at an elevated temperature |
| 08/16/2001 | WO2001059814A2 Semiconductor structure |
| 08/16/2001 | WO2001059804A2 Device and method for coupling two circuit components which have different impedances |
| 08/16/2001 | WO2001059789A1 Semiconductor integrated circuit device |
| 08/16/2001 | WO2001059629A1 Supporting multiple fpga configuration modes using dedicated on-chip processor |
| 08/16/2001 | WO2001059525A1 Method and apparatus for controlling photoresist baking processes |
| 08/16/2001 | WO2001059523A1 Stamp for use in a lithographic process, method of manufacturing a stamp, and method of manufacturing a patterned layer on a substrate |
| 08/16/2001 | WO2001059502A1 Reflection/refraction optical system |
| 08/16/2001 | WO2001059187A1 Production device for high-quality silicon single crystal |
| 08/16/2001 | WO2001059177A1 Exhaust pipe with reactive by-product adhesion preventing means and method of preventing the adhesion |
| 08/16/2001 | WO2001058828A1 Ceramic substrate for semiconductor production/inspection device |
| 08/16/2001 | WO2001058765A2 Method and apparatus of immobilizing solder spheres |
| 08/16/2001 | WO2001058643A1 Modified plating solution for plating and planarization and process utilizing same |
| 08/16/2001 | WO2001013410A9 Wafer holder assembly |
| 08/16/2001 | WO2001011666A3 Method of etching a wafer layer using multiple layers of the same photoresistant material and structure formed thereby |
| 08/16/2001 | WO2000013852A8 Apparatuses and methods for polishing semiconductor wafers |
| 08/16/2001 | US20010014965 Automatic global routing device for efficiently determining optimum wiring route on integrated circuit and global routing method therefor |
| 08/16/2001 | US20010014964 Method of changing logic circuit portion into gated clock portion and recording medium storing a program for carrying out the method |
| 08/16/2001 | US20010014574 Polishing apparatus |
| 08/16/2001 | US20010014572 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device |
| 08/16/2001 | US20010014570 Process for producing a semiconductor wafer with polished edge |
| 08/16/2001 | US20010014556 Packaging and interconnection of contact structure |
| 08/16/2001 | US20010014544 Semiconductor producing apparatus and producing method for epitaxial wafer using same |
| 08/16/2001 | US20010014543 Semiconductor wafer including a dot mark of a peculiar shape and method of forming the dot mark |
| 08/16/2001 | US20010014542 Method and apparatus for manufacturing a semiconductor device |
| 08/16/2001 | US20010014541 Method of sealing an epitaxial silicon layer on a substrate |
| 08/16/2001 | US20010014540 Inserting poultry litter into extruder, pushing through constrictions under pressure, grinding, heating through friction and pressure for predetermined time, forcing through tube having predetermined diameter, pelletizing |
| 08/16/2001 | US20010014539 Planarization method using fluid composition including chelating agents |
| 08/16/2001 | US20010014538 Leadless plastic chip carrier with etch back pad singulation and die attach pad array |
| 08/16/2001 | US20010014537 Method and apparatus for planarization of a substrate |
| 08/16/2001 | US20010014536 Substrate processing method and apparatus |
| 08/16/2001 | US20010014535 Electro-optical device and method for manufacturing the same |
| 08/16/2001 | US20010014534 Contains urea or a urea derivative and hydroxy aromatic compound as essential components; corrosion resistance |
| 08/16/2001 | US20010014533 Method of fabricating salicide |
| 08/16/2001 | US20010014532 Method of forming a silicide interconnect over a silicon comprising substrate and method of forming a stack of refractory metal nitride over refractory metal silicide over silicon |
| 08/16/2001 | US20010014531 Multilayer alignment keys and alignment method using the same |
| 08/16/2001 | US20010014530 Method for manufacturing a semiconductor device |
| 08/16/2001 | US20010014529 Forming intermetal dielectric layer over substrate containing copper line, forming patterned photoresist layer over dielectric layer, etching dielectric layer to form trench and contact opening, depositing copper |
| 08/16/2001 | US20010014528 Method of manufacturing unlanded via plug |
| 08/16/2001 | US20010014527 Method and system for providing electrical insulation for local interconnect in a logic circuit |
| 08/16/2001 | US20010014526 Semi-sacrificial diamond for air dielectric formation |
| 08/16/2001 | US20010014525 Process for forming trenches and contacts during the formation of a semiconductor memory device |