Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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08/21/2001 | US6277723 Plasma damage protection cell using floating N/P/N and P/N/P structure |
08/21/2001 | US6277722 Method for forming poly metal gate |
08/21/2001 | US6277721 Salicide formation process |
08/21/2001 | US6277720 Silicon nitride dopant diffusion barrier in integrated circuits |
08/21/2001 | US6277719 Method for fabricating a low resistance Poly-Si/metal gate |
08/21/2001 | US6277718 Semiconductor device and method for fabricating the same |
08/21/2001 | US6277717 Fabrication method for a buried bit line |
08/21/2001 | US6277716 Method of reduce gate oxide damage by using a multi-step etch process with a predictable premature endpoint system |
08/21/2001 | US6277715 Production method for silicon epitaxial wafer |
08/21/2001 | US6277714 Metal-contact induced crystallization in semiconductor devices |
08/21/2001 | US6277713 Amorphous and polycrystalline growing method for gallium nitride based compound semiconductor |
08/21/2001 | US6277712 Multilayered wafer with thick sacrificial layer using porous silicon or porous silicon oxide and fabrication method thereof |
08/21/2001 | US6277711 Semiconductor matrix formation |
08/21/2001 | US6277710 Method of forming shallow trench isolation |
08/21/2001 | US6277709 Method of forming shallow trench isolation structure |
08/21/2001 | US6277708 Semiconductor structures for suppressing gate oxide plasma charging damage and methods for making the same |
08/21/2001 | US6277707 Method of manufacturing semiconductor device having a recessed gate structure |
08/21/2001 | US6277706 Method of manufacturing isolation trenches using silicon nitride liner |
08/21/2001 | US6277705 Method for fabricating an air-gap with a hard mask |
08/21/2001 | US6277704 Microelectronic device fabricating method, method of forming a pair of conductive device components of different base widths from a common deposited conductive layer |
08/21/2001 | US6277703 Method for manufacturing an SOI wafer |
08/21/2001 | US6277702 Capacitor of a semiconductor device and a method of fabricating the same |
08/21/2001 | US6277700 Anisotropically etching; process control |
08/21/2001 | US6277699 Method for forming a metal-oxide-semiconductor transistor |
08/21/2001 | US6277698 Method of manufacturing semiconductor devices having uniform, fully doped gate electrodes |
08/21/2001 | US6277697 Method to reduce inverse-narrow-width effect |
08/21/2001 | US6277695 Method of forming vertical planar DMOSFET with self-aligned contact |
08/21/2001 | US6277694 Fabrication method for a metal oxide semiconductor having a double diffused drain |
08/21/2001 | US6277693 Self-aligned process for forming source line of ETOX flash memory |
08/21/2001 | US6277692 Process for fabricating an EEPROM |
08/21/2001 | US6277691 Method to fabricate a robust and reliable memory device |
08/21/2001 | US6277690 Elimination of N+ implant from flash technologies by replacement with standard medium-doped-drain (Mdd) implant |
08/21/2001 | US6277689 Nonvolatile memory |
08/21/2001 | US6277688 Method of manufacturing a DRAM capacitor with increased electrode surface area |
08/21/2001 | US6277687 Method of forming a pair of capacitors having a common capacitor electrode, method of forming DRAM circuitry, integrated circuitry and DRAM circuitry |
08/21/2001 | US6277686 PIP capacitor for split-gate flash process |
08/21/2001 | US6277685 Method of forming a node contact hole on a semiconductor wafer |
08/21/2001 | US6277684 Method of fabricating a SOI structure semiconductor device |
08/21/2001 | US6277683 Method of forming a sidewall spacer and a salicide blocking shape, using only one silicon nitride layer |
08/21/2001 | US6277682 Source drain implant process for mixed voltage CMOS devices |
08/21/2001 | US6277681 Process to produce ultrathin crystalline silicon nitride on Si(111) for advanced gate dielectrics |
08/21/2001 | US6277680 Methods of forming SOI insulator layers, methods of forming transistor devices, and semiconductor devices and assemblies |
08/21/2001 | US6277679 Method of manufacturing thin film transistor |
08/21/2001 | US6277678 Methods of manufacturing thin film transistors using insulators containing water |
08/21/2001 | US6277677 Method of manufacturing a semiconductor device |
08/21/2001 | US6277676 Method of fabricating capacitors and devices in mixed-signal integrated circuit |
08/21/2001 | US6277675 Method of fabricating high voltage MOS device |
08/21/2001 | US6277672 BGA package for high density cavity-up wire bond device connections using a metal panel, thin film and build up multilayer technology |
08/21/2001 | US6277671 Methods of forming integrated circuit packages |
08/21/2001 | US6277670 Semiconductor chip package and fabrication method thereof |
08/21/2001 | US6277669 Wafer level packaging method and packages formed |
08/21/2001 | US6277667 Method for fabricating solar cells |
08/21/2001 | US6277666 Precisely defined microelectromechanical structures and associated fabrication methods |
08/21/2001 | US6277662 Silicon substrate and forming method thereof |
08/21/2001 | US6277661 Method for detecting sloped contact holes using a critical-dimension waveform |
08/21/2001 | US6277660 Method and apparatus for testing chips |
08/21/2001 | US6277659 Substrate removal using thermal analysis |
08/21/2001 | US6277657 Apparatus for fabricating semiconductor device and fabrication method therefor |
08/21/2001 | US6277656 Substrate removal as a function of acoustic analysis |
08/21/2001 | US6277546 Coating substrate with polymer; heating; imagewise exposure;development |
08/21/2001 | US6277543 Method for forming features using frequency doubling hybrid resist and device formed thereby |
08/21/2001 | US6277538 Photosensitive polymer having cyclic backbone and resist composition comprising the same |
08/21/2001 | US6277532 Charged-particle-beam microlithographic methods for correction of reticle distortions |
08/21/2001 | US6277531 Charged-particle-beam microlithography apparatus and methods including focal-point correction |
08/21/2001 | US6277530 Method for making partial full-wafer pattern for charged particle beam lithography |
08/21/2001 | US6277527 Photolithographic mask; first and second image segments |
08/21/2001 | US6277501 Silicon epitaxial wafer and method for manufacturing the same |
08/21/2001 | US6277442 Suplying liquid; evacuating excess |
08/21/2001 | US6277441 Method of forming coating film on a substrate |
08/21/2001 | US6277436 Dielectric metal titanate film has a dielectric constant k>40 and a second order voltage coefficient a.sub.2 <100 ppm/v2, and said metal titanate film contains at least 60 atom % titanium |
08/21/2001 | US6277263 Alkaline electrolytic copper bath is used to electroplate copper onto a barrier layer or enhance an ultra-thin copper seed layer which has been deposited on the barrier layer |
08/21/2001 | US6277260 Apparatus and method for plating wafers, substrates and other articles |
08/21/2001 | US6277253 External coating of tungsten or tantalum or other refractory metal on IMP coils |
08/21/2001 | US6277251 Adjusting the density of plasma contained in a chamber where semiconductor wafers are processed, and etching or depositing a metal layer on a substrate |
08/21/2001 | US6277249 Integrated process for copper via filling using a magnetron and target producing highly energetic ions |
08/21/2001 | US6277237 Chamber liner for semiconductor process chambers |
08/21/2001 | US6277236 Light sensitive chemical-mechanical polishing apparatus and method |
08/21/2001 | US6277234 Method and apparatus for removing work pieces adhered to a support |
08/21/2001 | US6277222 Electronic component connecting method |
08/21/2001 | US6277206 Moving solder-clogged collet into contact with preform of solder, melting solder clog and preform into a single melted mass, cooling melted mass to solidify it, moving collet away from cooled mass, leaving clog |
08/21/2001 | US6277205 Cleaning surface of photomask to be used as master in photolithography step in production of semiconductor device with hot mixture of sulfuric acid and hydrogen peroxide to decompose organic objects, removing sulfuric acid, drying |
08/21/2001 | US6277204 Methods for cleaning wafers used in integrated circuit devices |
08/21/2001 | US6277203 Applying surfactant solution to surface, scrubbing surface, spin-rinsing surface of substrate using de-ionized water to complete removal of contaminants from surface; surfactant solution can be mixed with chemical enhancer |
08/21/2001 | US6277201 CVD apparatus for forming thin films using liquid reaction material |
08/21/2001 | US6277200 For using bistertiarybutylaminesilane as a silicon source to react with an oxidizing agent to form a dielectric film on a substrate that includes silicon |
08/21/2001 | US6277199 Chamber design for modular manufacturing and flexible onsite servicing |
08/21/2001 | US6277198 Use of tapered shadow clamp ring to provide improved physical vapor deposition system |
08/21/2001 | US6277194 Method for in-situ cleaning of surfaces in a substrate processing chamber |
08/21/2001 | US6277193 Method for manufacturing semiconductor silicon epitaxial wafer and semiconductor device |
08/21/2001 | US6277173 System and method for discharging gas |
08/21/2001 | US6277169 Method for making silver-containing particles |
08/21/2001 | US6277014 Carrier head with a flexible membrane for chemical mechanical polishing |
08/21/2001 | US6277010 Carrier head with a flexible membrane for a chemical mechanical polishing system |
08/21/2001 | US6277009 Carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus |
08/21/2001 | US6277008 Polishing apparatus |
08/21/2001 | US6277001 Method of cutting a laminated workpiece |
08/21/2001 | US6276999 Apparatus, backing plate, backing film and method for chemical mechanical polishing |
08/21/2001 | US6276998 Padless substrate carrier |
08/21/2001 | US6276997 Use of chemical mechanical polishing and/or poly-vinyl-acetate scrubbing to restore quality of used semiconductor wafers |
08/21/2001 | US6276996 Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad |