Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2001
08/23/2001US20010015495 Process for forming cone shaped solder for chip interconnection
08/23/2001US20010015494 Integrated circuit wiring with low rc time delay
08/23/2001US20010015493 Chip on board with heat sink attachment
08/23/2001US20010015492 Packaged die on pcb with heat sink encapsulant
08/23/2001US20010015489 Semiconductor device and its manufacturing method
08/23/2001US20010015488 Method of constructing stacked packages
08/23/2001US20010015483 Spherical shaped semiconductor device, a flexible printed wiring substrate, and mounting method thereof
08/23/2001US20010015482 Semiconductor device and method for manufacturing the same
08/23/2001US20010015481 Semiconductor integrated circuit device and method of manufacturing the same
08/23/2001US20010015476 Semiconductor device
08/23/2001US20010015475 Semiconductor devices
08/23/2001US20010015474 Method of manufacturing a double-heterojunction bipolar transistor on III-V material
08/23/2001US20010015472 Semiconductor device using fuse/anti-fuse system and method of manufacturing the same
08/23/2001US20010015470 Trench isolated bipolar transistor structure integrated with CMOS technology
08/23/2001US20010015466 Semiconductor device and method for producing same
08/23/2001US20010015465 Method for forming a transistor for a semiconductior device
08/23/2001US20010015464 Semiconductor integrated circuit design method and computer-readable recording medium
08/23/2001US20010015463 Semiconductor device and method of manufacturing the same
08/23/2001US20010015462 Manufacturing a transistor
08/23/2001US20010015460 Semiconductor device and method for fabricating the same
08/23/2001US20010015458 Semiconductor device having high breakdown voltage
08/23/2001US20010015456 Method of forming a composite interpoly gate dielectric
08/23/2001US20010015455 Method for shrinking array dimensions of split gate flash memory device using multilayer etching to define cell and source line and device manufactured thereby
08/23/2001US20010015454 Nonvolatile semiconductor memory device and manufacturing method thereof
08/23/2001US20010015453 Capacitor forming methods
08/23/2001US20010015452 Semiconductor device having contact hole and method of manufacturing the same
08/23/2001US20010015451 Semiconductor memory device
08/23/2001US20010015450 Semiconductor integrated circuit and semiconductor integrated circuit device
08/23/2001US20010015448 Ferroelectric capacitor and semiconductor device
08/23/2001US20010015447 Semiconductor integrated circuit device, design method for the same and computer-readable recording medium where I/O cell library is recorded
08/23/2001US20010015441 Semiconductor device and a method of manufacturing the same
08/23/2001US20010015440 Thin film transistor
08/23/2001US20010015438 Low temperature thin film transistor fabrication
08/23/2001US20010015437 GaN field-effect transistor, inverter device, and production processes therefor
08/23/2001US20010015436 Semiconductor device and method of manufacturing the same
08/23/2001US20010015434 Apparatus of manufacturing a thin film transistor array panel for a liquid crystal display
08/23/2001US20010015431 Semiconductor device for surface-shape recognition
08/23/2001US20010015430 Method of producing a ferroelectric semiconductor memory
08/23/2001US20010015429 High integration density vertical capacitor structure and fabrication process
08/23/2001US20010015428 Solid-state image sensor and manufacturing method therefor
08/23/2001US20010015412 Electron beam measurement method and electron beam irradiation processing device
08/23/2001US20010015410 Inspection apparatus and method
08/23/2001US20010015382 Tamper-preventing, contact-type, smart cards
08/23/2001US20010015372 Apparatus for transferring micro-balls
08/23/2001US20010015345 Planarized copper cleaning for reduced defects
08/23/2001US20010015344 Staggered in-situ deposition and etching of a dielectric layer for HDP-CVD
08/23/2001US20010015343 Method and installation for etching a substrate
08/23/2001US20010015327 Surface package type semiconductor package and method of producing semiconductor memory
08/23/2001US20010015285 Semiconductor device
08/23/2001US20010015262 Apparatus and method for plasma treatment
08/23/2001US20010015261 Processing method and apparatus for removing oxide film
08/23/2001US20010015256 Display device and method of manufacturing the same
08/23/2001US20010015219 Collapsible play structures
08/23/2001US20010015215 Reduced water consumption
08/23/2001US20010015212 Method of reducing water spotting and oxide growth on a semiconductor structure
08/23/2001US20010015211 Pair of parallel megasonic transducers that generate parallel columns of megasonic waves across a cleaning container; for semiconductoe wafers cleaning
08/23/2001US20010015210 Wet etching apparatus and method
08/23/2001US20010015176 Reactor for processing a microelectronic workpiece
08/23/2001US20010015175 Plasma processing system and apparatus and a sample processing method
08/23/2001US20010015174 Method and apparatus for manufacturing semiconductor device
08/23/2001US20010015173 Method for forming a thin film of a composite metal compound and apparatus for carrying out the method
08/23/2001US20010015171 Treatment apparatus
08/23/2001US20010015170 SiC device and method for manufacturing the same
08/23/2001US20010015168 Optimized silicon wafer gettering for advanced semiconductor devices
08/23/2001US20010015133 Cooling mechanism trap separates the gases, stores them in a temporary storage mechanism until it reaches a concentration at which an efficient recovery is possible and packs them in a cylinder
08/23/2001US20010015074 Consecutive deposition system
08/23/2001US20010015053 A method of packing a semiconductor manufacturing apparatus to be carried into a clean room
08/23/2001US20010015046 Trench isolation method
08/23/2001US20010015012 Structure of conductive bump in wiring board
08/23/2001US20010015010 Method of manufacturing bump-component mounted body and device for manufacturing the same
08/23/2001US20010015009 Method of fabricating semiconductor package
08/23/2001EP1145284A3 Method and device for drying photoresist coatings
08/23/2001DE19948560A1 Klebstoffolie zum Implantieren von elektrischen Modulen in einen Kartenkörper und Verfahren zu deren Herstellung Adhesive film for implanting electrical modules in a card body and process for their preparation
08/23/2001DE10107337A1 Haftkleberfolie zum Wafer-Kleben Adhesive film for wafer bonding
08/23/2001DE10103312A1 Layoutentwurfsverfahren Layout design method
08/23/2001DE10049350A1 Abdeckungs-Ablösesystem und Steuerungsverfahren für eine Abdeckungs-Ablöse-Lösung Cover-release system and control method for a cover-release solution
08/23/2001DE10007248A1 Wet chemical cleaning and etching of disc-shaped individual substrates or wafers involves acquiring substrate in holder, rotating and simultaneously spraying with chemical on both sides
08/23/2001DE10006528A1 Fuse arrangement used in a semiconductor device has a strip-like metal layer with a restriction arranged on a semiconductor body which is thermally insulated below the restriction
08/23/2001DE10006523A1 Implantationsmaske für Hochenergieionenimplantation Implantation mask for high energy ion implantation
08/23/2001DE10006446A1 Verkapselung für ein elektrisches Bauelement und Verfahren zur Herstellung Encapsulation of an electrical component and method for preparing
08/23/2001CA2400201A1 Process monitoring system for lithography lasers
08/22/2001EP1126752A2 Chip scale packaging on CTE matched printed wiring boards
08/22/2001EP1126606A2 Active inductor
08/22/2001EP1126558A2 ZEE electrical interconnect
08/22/2001EP1126532A2 Method of forming tunnel oxide film
08/22/2001EP1126531A2 Magnetoresistance effect device, and magnetoresistance effect type head, memory device, and amplifying device using the same
08/22/2001EP1126527A1 High-voltage semiconductor device
08/22/2001EP1126523A2 Soi-type semiconductor device with variable threshold voltages
08/22/2001EP1126521A1 Method of manufacturing electrical contacts of an elelctrical device
08/22/2001EP1126520A2 IC device and method of manufacturing the same
08/22/2001EP1126519A2 Structure and method for bond pads of copper-metallized intergrated circuits
08/22/2001EP1126518A2 Process for fabricating a semiconductor device
08/22/2001EP1126517A2 Method for flip-chip assembly of semiconductor devices using adhesives
08/22/2001EP1126516A2 Electronic component, method of sealing electronic component with resin, and apparatus therefor
08/22/2001EP1126515A1 Method of manufacturing a III-V material double heterojunction bipolar transistor
08/22/2001EP1126514A2 Etching method
08/22/2001EP1126513A1 Process for planarization and recess etching of polysilicon in an overfilled trench
08/22/2001EP1126512A2 Wafer plating method and apparatus
08/22/2001EP1126511A1 Plasma film forming method
08/22/2001EP1126509A1 Method for carry in and installation of semiconductor manufacturing apparatus and substitute for apparatus