Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2001
08/23/2001US20010016469 Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad
08/23/2001US20010016468 Lapping method and method for manufacturing lapping particles for use in the lapping method
08/23/2001US20010016462 Laminated support
08/23/2001US20010016429 Deposition of tungsten nitride by plasma enhanced chemical vapor deposition
08/23/2001US20010016428 In-situ silicon nitride and silicon based oxide deposition with graded interface for damascene application
08/23/2001US20010016427 Treatment solution supply method and treatment solution supply unit
08/23/2001US20010016426 Titanium dioxide layer serving as a mask and its removed method
08/23/2001US20010016425 Semiconductor processing methods, methods of forming hemispherical grain polysilicon, methods of forming capacitors, and methods of forming wordlines
08/23/2001US20010016423 Semiconductor substrate and method of manufacturing same
08/23/2001US20010016422 Dry etching method and method of manufacturing semiconductor device
08/23/2001US20010016421 Bipolar transistor structure
08/23/2001US20010016419 Integration of low-k SiOF for damascene structure
08/23/2001US20010016418 Method for forming interconnection of semiconductor device
08/23/2001US20010016417 High pressure anneals of integrated circuit structures
08/23/2001US20010016416 Method for fabricating contact plug
08/23/2001US20010016415 Method of improving copper pad adhesion
08/23/2001US20010016414 Use of PE-SiON or PE-Oxide for contact or via photo and for defect reduction with oxide and w chemical-mechanical polish
08/23/2001US20010016413 Semiconductor device and method of manufacturing a semiconductor device with reduced contact failures
08/23/2001US20010016412 Interconnect structure with air gap compatible with unlanded vias
08/23/2001US20010016411 Microprocessor having air as a dielectric and encapsulated lines
08/23/2001US20010016410 Method of forming contacts
08/23/2001US20010016409 High-q inductive elements
08/23/2001US20010016408 Mask repattern process
08/23/2001US20010016407 Integrated circuit having conductive paths of different heights formed from the same layer structure and method for forming the same
08/23/2001US20010016406 Semiconductor processing methods of forming contact openings, methods of forming memory circuitry, methods of forming electrical connections, and methods of forming dynamic random access memory (DRAM) circuitry
08/23/2001US20010016405 Unique via patterning scheme which utilizes hard mask cap for low dielectric constant materials
08/23/2001US20010016403 Semiconductor substrate with semi-insulating polysilicon gettering site layer and process of fabrication thereof
08/23/2001US20010016402 Smoothing method for cleaved films made using thermal treatment
08/23/2001US20010016401 Method of fabricating an SOI wafer and SOI wafer fabricated by the method
08/23/2001US20010016400 Method of making wafer level chip scale package
08/23/2001US20010016399 Method for forming a bonded substrate containing a planar intrinsic gettering zone and substrate formed by said method
08/23/2001US20010016398 Method for expanding trenches by an anisotropic wet etch
08/23/2001US20010016397 Method for forming device isolation film for semiconductor device
08/23/2001US20010016396 Thin-film resistor and method of fabrication
08/23/2001US20010016395 Structure of a capacitor
08/23/2001US20010016394 Manufacturing method of semiconductor device having tantalum oxide film
08/23/2001US20010016393 Mosfet having doped regions with different impurity concentration
08/23/2001US20010016392 Method of manufacturing a semiconductor device
08/23/2001US20010016391 Method for fabricating a merged integrated circuit device
08/23/2001US20010016390 Manufacturing process for non-volatile floating gate memory cells integrated on a semiconductor substrate and comprised in a cell matrix with an associated control circuitry
08/23/2001US20010016389 Channel implant through gate polysilicon
08/23/2001US20010016388 Method for fabricating semiconductor device
08/23/2001US20010016386 Method for reduced gate aspect ratio to improve gap-fill after spacer etch
08/23/2001US20010016385 Thin film transistors having a novel GOLD (Gate-Overlapped LDD (Lightly Doped Drain)) structure.
08/23/2001US20010016384 Semiconductor device and process for fabrication thereof
08/23/2001US20010016383 Method for fabricating complementary metal oxide semiconductor (CMOS) devices on a mixed bulk and silicon-on-insulator (SOI) substrate
08/23/2001US20010016382 Method of manufacturing a capacitor in a semiconductor device
08/23/2001US20010016381 Memory cell, memory device and method of fabricating the same
08/23/2001US20010016380 Semiconductor device and method of fabricating the same
08/23/2001US20010016379 Process for manufacturing non-volatile memory cells integrated on a semiconductor substrate
08/23/2001US20010016377 Semiconductor device and its manufacturing method capable of reducing low frequency noise
08/23/2001US20010016376 Method for fabricating semiconductor device
08/23/2001US20010016375 Method of manufacturing a polycrystalline silicon layer
08/23/2001US20010016372 Mounting method and apparatus of bare chips
08/23/2001US20010016370 Low cost decal material used for packaging
08/23/2001US20010016369 Chip scale surface mount package for semiconductor device and process of fabricating the same
08/23/2001US20010016368 Molding apparatus for use in manufacture of resin shielding semiconductor device, a lead frame for the device, and a method of using the apparatus
08/23/2001US20010016367 Process for fabricating single crystal resonant devices that are compatible with integrated circuit processing
08/23/2001US20010016365 Check abnormal contact and via holes by electroplating method
08/23/2001US20010016364 Film processing system
08/23/2001US20010016363 Method for monitoring the shape of the processed surfaces of semiconductor devices and equipment for manufacturing the semiconductor devices
08/23/2001US20010016362 Semiconductor and method of fabricating
08/23/2001US20010016307 Processing method for substrate
08/23/2001US20010016302 Microelectronics
08/23/2001US20010016299 Absorbs a very low percentage of incident charged particles and hence does not experience excessive temperature increases due to bombardment by and absorption of incident charged particles
08/23/2001US20010016298 Chemically amplified positive resist composition
08/23/2001US20010016295 Method of compensating for pattern dimension variation caused by re-scattered electron beam in electron beam lithography
08/23/2001US20010016294 Methods and devices for measuring and adjusting illumination uniformity obtained from a charged-particle illumination-optical system
08/23/2001US20010016292 Electron beam mask, production method thereof, and exposure method
08/23/2001US20010016257 Semiconductor wafer processing tapes
08/23/2001US20010016229 Ferroelectric thin films and solutions: compositions and processing
08/23/2001US20010016226 Chemically treating the surface to affect dielectric constant by reacting with a gaseous chemical compound to modify the surface preferentially compared to the bulk portion of the object; for capacitors
08/23/2001US20010016225 Coating film forming apparatus and coating film forming method
08/23/2001US20010016157 Optimal trajectory robot motion
08/23/2001US20010016121 Developing method and developing apparatus
08/23/2001US20010016062 Bonding apparatus and bonding method
08/23/2001US20010016061 Method for analyzing circuit pattern defects and a system thereof
08/23/2001US20010015922 Semiconductor device with an integrated CMOS circuit with MOS transistors having silicon-germanium (Si1-xGex) gate electrodes, and method of manufacturing same
08/23/2001US20010015920 Flash eprom memory cell having increased capacitive coupling and method of manufacture thereof
08/23/2001US20010015912 Data line disturbance free memory block divided flash memory and microcomputer having flash memory therein
08/23/2001US20010015884 Thin film multilayer capacitor and mounting method therefor
08/23/2001US20010015881 Semiconductor integrated circuit device
08/23/2001US20010015854 Apparatus and method for laser radiation
08/23/2001US20010015811 Test structure for metal CMP process control
08/23/2001US20010015801 Polishing pad surface condition evaluation method and an apparatus thereof and a method of producing a semiconductor device
08/23/2001US20010015800 Dual peak wavelength tube, illuminator for inspection, inspecting apparatus, and method thereof
08/23/2001US20010015799 Stage apparatus, exposure apparatus, and device production method
08/23/2001US20010015798 Exposure apparatus
08/23/2001US20010015795 Exposure method, exposure apparatus, method for producing exposure apparatus, and method for producing device
08/23/2001US20010015781 Liquid crystal display device, wiring substrate, and methods for fabricating the same
08/23/2001US20010015776 TFT active matrix liquid crystal display devices
08/23/2001US20010015676 Wireless communication system
08/23/2001US20010015672 Electronic charge pump device
08/23/2001US20010015669 Output circuit, input circuit and input/output circuit
08/23/2001US20010015655 Removable electrical interconnect apparatuses and removable engagement probes
08/23/2001US20010015653 Integrated circuit with test interface
08/23/2001US20010015652 Probe card assembly and kit, and methods of making same
08/23/2001US20010015650 Probe card for testing semiconductor integrated circuit and method of manufacturing the same
08/23/2001US20010015499 Semiconductor device and method for fabricating the same
08/23/2001US20010015498 Semiconductor device and method of fabricating the same