| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 08/28/2001 | US6281126 Process for manufacturing semiconductor device |
| 08/28/2001 | US6281125 From vaporized (diene)ru(co)3 |
| 08/28/2001 | US6281124 Methods and systems for forming metal-containing films on substrates |
| 08/28/2001 | US6281123 Generating a plasma adjacent the layer from a component gas, the component gas consisting essentially of n2 and/or ar; and utilizing the plasma to remove the carbon from the layer. |
| 08/28/2001 | US6281122 Method for forming materials |
| 08/28/2001 | US6281121 Damascene metal interconnects using highly directional deposition of barrier and/or seed layers including (III) filling metal |
| 08/28/2001 | US6281119 Method for making contact with a semiconductor layer and semiconductor structure having a plurality of layers |
| 08/28/2001 | US6281118 Method of manufacturing semiconductor device |
| 08/28/2001 | US6281117 Method to form uniform silicide features |
| 08/28/2001 | US6281116 Method of manufacturing a semiconductor device |
| 08/28/2001 | US6281115 Sidewall protection for a via hole formed in a photosensitive, low dielectric constant layer |
| 08/28/2001 | US6281114 Planarization after metal chemical mechanical polishing in semiconductor wafer fabrication |
| 08/28/2001 | US6281113 Method for forming an interplayer insulating film and semiconductor device |
| 08/28/2001 | US6281112 Structure of interlayer insulator film and method for planarization of interlayer insulator film |
| 08/28/2001 | US6281111 Semiconductor apparatus and method for fabricating the same |
| 08/28/2001 | US6281110 Method for making an integrated circuit including deutrium annealing of metal interconnect layers |
| 08/28/2001 | US6281109 Advance metallization process |
| 08/28/2001 | US6281107 Semiconductor device and method for manufacturing the same |
| 08/28/2001 | US6281106 Method of solder bumping a circuit component |
| 08/28/2001 | US6281105 Unzippable polymer selected from the group consisting of poly-alpha-methylstyrene, polypropylene carbonate, polyethylene carbonate and polychloral dissolved in said solvent |
| 08/28/2001 | US6281104 Low temperature reflow method for filling high aspect ratio contacts |
| 08/28/2001 | US6281103 Method for fabricating gate semiconductor |
| 08/28/2001 | US6281102 Cobalt silicide structure for improving gate oxide integrity and method for fabricating same |
| 08/28/2001 | US6281101 Process of forming metal silicide interconnects |
| 08/28/2001 | US6281100 Semiconductor processing methods |
| 08/28/2001 | US6281099 Method for synthesizing single crystal AIN thin films of low resistivity n-type and low resistivity p-type |
| 08/28/2001 | US6281098 Process for Polycrystalline film silicon growth |
| 08/28/2001 | US6281097 Self-aligned selectively grown sige base (sssb) bipolar transistor including an epitaxial layer made of sige alloy as a base layer. |
| 08/28/2001 | US6281096 Chip scale packaging process |
| 08/28/2001 | US6281095 Process of manufacturing silicon-on-insulator chip having an isolation barrier for reliability |
| 08/28/2001 | US6281094 Method of fabricating semiconductor device capable of providing MOSFET which is improved in a threshold voltage thereof |
| 08/28/2001 | US6281093 Method to reduce trench cone formation in the fabrication of shallow trench isolations |
| 08/28/2001 | US6281092 Method for manufacturing a metal-to-metal capacitor utilizing only one masking step |
| 08/28/2001 | US6281091 Container capacitor structure and method of formation thereof |
| 08/28/2001 | US6281089 Method for fabricating an embedded flash memory cell |
| 08/28/2001 | US6281088 Method of manufacturing SRAM having enhanced cell ratio |
| 08/28/2001 | US6281087 Process for fabricating metal silicide layer by using ion metal plasma deposition |
| 08/28/2001 | US6281086 Semiconductor device having a low resistance gate conductor and method of fabrication the same |
| 08/28/2001 | US6281085 Method of manufacturing a semiconductor device |
| 08/28/2001 | US6281084 Disposable spacers for improved array gapfill in high density DRAMs |
| 08/28/2001 | US6281083 Methods of forming field effect transistor gates, and methods of forming integrated circuitry |
| 08/28/2001 | US6281082 Method to form MOS transistors with a common shallow trench isolation and interlevel dielectric gap fill |
| 08/28/2001 | US6281081 Method of preventing current leakage around a shallow trench isolation structure |
| 08/28/2001 | US6281080 Fabrication method in improving ESD ability and vertical BJT gain |
| 08/28/2001 | US6281079 MOS transistor in a single-transistor memory cell having a locally thickened gate oxide, and production process |
| 08/28/2001 | US6281078 Manufacturing process to eliminate ONO fence material in high density NAND-type flash memory devices |
| 08/28/2001 | US6281077 Method for manufacturing electronic devices comprising non-volatile memory cells and LV transistors with salicided junctions |
| 08/28/2001 | US6281076 Method for manufacturing nonvolatile memory device capable of preventing damage to side walls of stacked gate and active region |
| 08/28/2001 | US6281075 Method of controlling of floating gate oxide growth by use of an oxygen barrier |
| 08/28/2001 | US6281074 Method of manufacturing oxide layer |
| 08/28/2001 | US6281073 Method for fabricating dynamic random access memory cell |
| 08/28/2001 | US6281072 Multiple step methods for forming conformal layers |
| 08/28/2001 | US6281071 Method of producing semiconductor integrated circuit device having switching MISFET and capacitor element including wiring therefor and method of producing such wiring |
| 08/28/2001 | US6281070 Semiconductor processing methods of forming integrated circuitry memory devices, methods of forming capacitor containers, methods of making electrical connection to circuit nodes and related integrated circuitry |
| 08/28/2001 | US6281069 Method for forming deep trench capacitor under a shallow trench isolation structure |
| 08/28/2001 | US6281068 Method for buried plate formation in deep trench capacitors |
| 08/28/2001 | US6281067 Self-aligned silicide process for forming silicide layer over word lines in DRAM and transistors in logic circuit region |
| 08/28/2001 | US6281066 Method of manufacturing a capacitor in a memory device |
| 08/28/2001 | US6281065 Semiconductor device fabrication method |
| 08/28/2001 | US6281064 Method for providing dual work function doping and protective insulating cap |
| 08/28/2001 | US6281063 Method for manufacturing trench isolation |
| 08/28/2001 | US6281062 MOS semiconductor device with self-aligned punchthrough stops and method of fabrication |
| 08/28/2001 | US6281061 Method for fabricating an isolation trench applied in BiCMOS processes |
| 08/28/2001 | US6281060 Method of manufacturing a semiconductor device containing a BiCMOS circuit |
| 08/28/2001 | US6281058 Method of forming DRAM circuitry on a semiconductor substrate |
| 08/28/2001 | US6281057 Method of manufacturing a semiconductor device |
| 08/28/2001 | US6281056 Methods of forming SOI insulator layers, methods of forming transistor devices, and semiconductor devices and assemblies |
| 08/28/2001 | US6281055 Method of fabricating a thin film transistor |
| 08/28/2001 | US6281054 SOI device and method for fabricating the same |
| 08/28/2001 | US6281053 Thin film transistor with reduced hydrogen passivation process time |
| 08/28/2001 | US6281052 Method of manufacturing semiconductor device |
| 08/28/2001 | US6281051 Semiconductor device and manufacturing method thereof |
| 08/28/2001 | US6281050 Manufacturing method of a semiconductor device and a nonvolatile semiconductor storage device |
| 08/28/2001 | US6281049 Semiconductor device mask and method for forming the same |
| 08/28/2001 | US6281048 Method of making an electronic component, and an electronic component |
| 08/28/2001 | US6281047 Method of singulating a batch of integrated circuit package units constructed on a single matrix base |
| 08/28/2001 | US6281046 Method of forming an integrated circuit package at a wafer level |
| 08/28/2001 | US6281045 Semiconductor apparatus, manufacturing method thereof and electronic apparatus |
| 08/28/2001 | US6281041 Process to make a tall solder ball by placing a eutectic solder ball on top of a high lead solder ball |
| 08/28/2001 | US6281039 Hybrid device and a method of producing electrically active components by an assembly operation |
| 08/28/2001 | US6281038 Methods for forming assemblies |
| 08/28/2001 | US6281037 Method for the targeted production of N-type conductive areas in diamond layers by means of ion implantation |
| 08/28/2001 | US6281035 Ion-beam treatment to prepare surfaces of p-CdTe films |
| 08/28/2001 | US6281034 Solid-state imaging device and manufacturing method thereof and semiconductor device manufacturing method |
| 08/28/2001 | US6281032 Manufacturing method for nitride III-V compound semiconductor device using bonding |
| 08/28/2001 | US6281031 Method of severing a semiconductor wafer |
| 08/28/2001 | US6281027 Spatial averaging technique for ellipsometry and reflectometry |
| 08/28/2001 | US6281026 Semiconductor device and method for manufacturing the same |
| 08/28/2001 | US6281025 Substrate removal as a function of SIMS analysis |
| 08/28/2001 | US6281024 Semiconductor device inspection and analysis method and its apparatus and a method for manufacturing a semiconductor device |
| 08/28/2001 | US6281023 Completely encapsulated top electrode of a ferroelectric capacitor using a lead-enhanced encapsulation layer |
| 08/28/2001 | US6281022 Multi-phase lead germanate film deposition method |
| 08/28/2001 | US6280924 Planarization method using fluid composition including chelating agents |
| 08/28/2001 | US6280906 Method of imaging a mask pattern on a substrate by means of EUV radiation, and apparatus and mask for performing the method |
| 08/28/2001 | US6280898 Photoresists patterns |
| 08/28/2001 | US6280895 Silicon or germanium with light receiver layers |
| 08/28/2001 | US6280828 Flexible wiring board |
| 08/28/2001 | US6280799 Arranging electrode in containers with dispensers and applying a voltage |
| 08/28/2001 | US6280794 Method of forming dielectric material suitable for microelectronic circuits |
| 08/28/2001 | US6280790 Supporting a substrate, heating with radiation adding a purge fluid, reflection and purging |