Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2001
09/04/2001US6284561 Method of forming a metal plate of a fingerprint sensor chip on a semiconductor wafer
09/04/2001US6284560 Method for producing co-planar surface structures
09/04/2001US6284557 Optical sensor by using tunneling diode
09/04/2001US6284554 Process for manufacturing a flip-chip integrated circuit
09/04/2001US6284553 Location dependent automatic defect classification
09/04/2001US6284552 Method and apparatus for evaluating surface roughness of an epitaxial growth layer, method and apparatus for measuring reflectance of an epitaxial growth layer, and manufacturing method of semiconductor device
09/04/2001US6284551 Capacitor and method for fabricating the same
09/04/2001US6284440 As developing solution
09/04/2001US6284439 Selecting an enhanced positive photoresist and depositing onto substrate; exposing selected portions of positive photoresist layer to light, wherein the exposed portions are soluble in aqueous base; developing exposed portions
09/04/2001US6284438 Providing semiconductor substrate; forming material film to be patterned on semiconductor substrate; forming a photoresist film on the material film by coating photoresist; patterning photoresist film reducing size of opening by thermal flow
09/04/2001US6284430 Positive-working chemical-amplification photoresist composition and method for forming a resist pattern using the same
09/04/2001US6284419 Methods of reducing proximity effects in lithographic processes
09/04/2001US6284415 Charged-particle-beam transfer masks and methods of making
09/04/2001US6284414 Preparing mask substrate having light-shielding film pattern over including integrated circuit pattern and alignment mark; forming resist film; aligning position of phase-shifting pattern; electron beam exposure to form phase-shifting pattern
09/04/2001US6284413 Selecting reticle primitives containing patterns corresponding to portions of a layer to be created by semicustom reticle; exposing to create image; employing semicustom reticle to create an image of patterns on integrated circuit
09/04/2001US6284384 For electronics
09/04/2001US6284317 Providing surface comprising units having silion-hydrogen bonds; exposing to organometallic reagent; forming a silicon-carbon bond at a temperature of less than about 25.degree. c. and free of an external energy source
09/04/2001US6284316 Chemical vapor deposition of titanium
09/04/2001US6284173 Method for vacuum encapsulation of semiconductor chip packages
09/04/2001US6284151 Ferric nitrate-alumina based slurry containing ferric nonahydrate, water and nitric acid; corrosion resistance
09/04/2001US6284149 High-density plasma etching of carbon-based low-k materials in a integrated circuit
09/04/2001US6284148 Method for anisotropic etching of silicon
09/04/2001US6284146 Etching gas mixture for transition metal thin film and method for etching transition metal thin film using the same
09/04/2001US6284114 Immersing electrodes in particulate bath;controlling electrical conditions; generating bubbles to make polishing pad
09/04/2001US6284110 Method and apparatus for radio frequency isolation of liquid heat transfer medium supply and discharge lines
09/04/2001US6284106 Method of producing flat panels
09/04/2001US6284093 Shield or ring surrounding semiconductor workpiece in plasma chamber
09/04/2001US6284091 Unique chemical mechanical planarization approach which utilizes magnetic slurry for polish and magnetic fields for process control
09/04/2001US6284086 Apparatus and method for attaching a microelectronic device to a carrier using a photo initiated anisotropic conductive adhesive
09/04/2001US6284080 Barrier metallization in ceramic substrate for implantable medical devices
09/04/2001US6284079 Method and structure to reduce low force pin pull failures in ceramic substrates
09/04/2001US6284055 Using an aqueous rinse solution which is de-oxygenated by passing it with a carrier gas through an osmotic membrane degasifier
09/04/2001US6284052 In-situ method of cleaning a metal-organic chemical vapor deposition chamber
09/04/2001US6284051 Cooled window
09/04/2001US6284050 UV exposure for improving properties and adhesion of dielectric polymer films formed by chemical vapor deposition
09/04/2001US6284049 Processing apparatus for fabricating LSI devices
09/04/2001US6284048 Method of processing wafers with low mass support
09/04/2001US6284044 Film forming method and film forming apparatus
09/04/2001US6284043 Solution treatment apparatus
09/04/2001US6284042 Such as gallium, aluminum, indium, and boron which is one of iii-v compound semiconductor materials and applicable to light-emitting, cladding, or conductive layers of semiconductor light-emitting elements or devices
09/04/2001US6284041 Process for growing a silicon single crystal
09/04/2001US6284039 Epitaxial silicon wafers substantially free of grown-in defects
09/04/2001US6284020 Removing circulated atmosphere-borne chemicals using gaseous impurity-trapping filter in hermetically sealed box; storage and transfer use in semiconductor wafers processing, devices in a clean room
09/04/2001US6284013 Semiconductor thin film applications; ozone-containing gas conversion into ruthenium tetraoxide, blowing chlorine gas into sodium hydroxide solution; absorbing in acid, evaporating, salting out and sintering in hydrogen atmosphere
09/04/2001US6284006 Incorporates transport mechanism allowing range of motion inside open or sealed chamber; integrated circuits, flat panel displays, thin film heads, transistors, diodes, semiconductors; avoids damaging, and/or contaminating
09/04/2001US6283840 Cleaning and slurry distribution system assembly for use in chemical mechanical polishing apparatus
09/04/2001US6283835 Method and apparatus for manufacturing a semiconductor integrated circuit
09/04/2001US6283828 Wafer polishing apparatus
09/04/2001US6283827 Non-contacting support for a wafer
09/04/2001US6283822 Polishing apparatus
09/04/2001US6283746 Method for purging furnace to decrease particle pollution in baking process
09/04/2001US6283703 Automatic conveying apparatus for JEDEC carrier members
09/04/2001US6283701 Pneumatically actuated flexure gripper for wafer handling robots
09/04/2001US6283695 Tray conveying apparatus and method
09/04/2001US6283693 Method and apparatus for semiconductor chip handling
09/04/2001US6283692 Apparatus for storing and moving a cassette
09/04/2001US6283359 Method for enhancing fatigue life of ball grid arrays
09/04/2001US6283357 Fabrication of clad hollow cathode magnetron sputter targets
09/04/2001US6283355 End effector for substrate handling
09/04/2001US6283273 Substrate processing apparatus
09/04/2001US6283175 Enveloping device and vertical heat-treating apparatus for semiconductor process system
09/04/2001US6283155 System of modular substrates for enabling the distribution of process fluids through removable components
09/04/2001US6283143 System and method for providing an integrated gas stick
09/04/2001US6283134 Apparatus for removing photo-resist
09/04/2001US6283131 In-situ strip process for polysilicon etching in deep sub-micron technology
09/04/2001US6283130 Plasma cleaning method and placement area protector used in the method
09/04/2001US6283113 Strip separation tool
09/04/2001US6283111 Wire saw cutting method and apparatus therefor
09/04/2001US6283066 Continuous gas saturation system and method
09/04/2001US6283060 Plasma CVD apparatus
09/04/2001US6283041 Table support apparatus and exposure apparatus
09/04/2001US6282781 Resin package fabrication process
09/04/2001US6282780 Bump forming method and its forming apparatus.
09/04/2001CA2237018C Method for making a circuit structure having a flip-mounted matrix of devices
09/03/2001CA2299991A1 A memory cell for embedded memories
08/2001
08/30/2001WO2001063991A1 Multilayer printed wiring board and method for producing multilayer printed wiring board
08/30/2001WO2001063983A2 Thermal management system
08/30/2001WO2001063981A1 High frequency plasma source
08/30/2001WO2001063972A1 Ceramic substrate and its production method
08/30/2001WO2001063971A1 Ceramic substrate
08/30/2001WO2001063905A2 Frame shutter pixel with an isolated storage node
08/30/2001WO2001063864A2 Chromeless alternating phase-shift reticle for producing semiconductor device features
08/30/2001WO2001063669A1 Microwave electric elements using porous silicon dioxide layer and forming method of same
08/30/2001WO2001063668A2 Method of forming lead-free solder alloys by electrochemical deposition process
08/30/2001WO2001063663A1 Enhanced planarity isolation structure and method
08/30/2001WO2001063661A1 Method of manufacturing semiconductor integrated circuit having multilayer wiring structure
08/30/2001WO2001063659A1 Method for fabrication and structure for high aspect ratio vias
08/30/2001WO2001063658A1 Method for producing a ferroelectric layer
08/30/2001WO2001063657A1 Two etchant etch method
08/30/2001WO2001063656A1 Method for wafer processing
08/30/2001WO2001063655A1 Chemical-mechanical polishing device, damascene wiring forming device, and damascene wiring forming method
08/30/2001WO2001063654A2 Methods of forming a plurality of semiconductor layers using trench arrays
08/30/2001WO2001063652A1 Semiconductor component and method for the production thereof
08/30/2001WO2001063651A2 Wafer processing system
08/30/2001WO2001063650A1 Method for crystalline growth in epitaxial heterostructures based on gallium nitride
08/30/2001WO2001063649A1 Apparatus and method for processing electronic components
08/30/2001WO2001063644A2 Method for producing bipolar transistors in a bicmos process
08/30/2001WO2001063642A1 Multi-zone rf electrode for capacitive plasma sources
08/30/2001WO2001063365A1 Method of reducing defects
08/30/2001WO2001063363A2 Photoacid generators and photoresists comprising same