Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2001
08/30/2001WO2001063362A2 Resist materials for 157-nm lithography
08/30/2001WO2001063361A1 Device for homogeneous heating of an object
08/30/2001WO2001063358A1 Organic polymeric antireflective coatings deposited by chemical vapor deposition
08/30/2001WO2001063342A1 Ultraviolet polarization beam splitter for microlithography
08/30/2001WO2001063310A1 Integrated circuit with test interface
08/30/2001WO2001063307A1 Inspection apparatus and sensor
08/30/2001WO2001063266A2 System for imaging a cross-section of a substrate
08/30/2001WO2001063233A2 Device for detecting wave fronts
08/30/2001WO2001063024A1 Production of ceramic layers
08/30/2001WO2001063003A1 Device and method for carrying out plasma enhanced surface treatment of substrates in a vacuum
08/30/2001WO2001063002A1 Method for removing adsorbed molecules from a chamber
08/30/2001WO2001062686A1 Aluminum nitride sintered compact, ceramic substrate, ceramic heater and electrostatic chuck
08/30/2001WO2001062440A1 Polishing pad with a transparent portion
08/30/2001WO2001062436A1 Method and apparatus for polishing outer peripheral chamfered part of wafer
08/30/2001WO2001026137A3 Three dimensional device integration method and integrated device
08/30/2001WO2001011930A3 A cleaving process to fabricate multilayered substrates using low implantation doses
08/30/2001WO2001009980A3 Controlled compliance fine pitch interconnect
08/30/2001WO2000039837A8 Perforated plasma confinement ring in plasma reactors
08/30/2001US20010018757 Method of layouting semiconductor integrated circuit and apparatus for doing the same
08/30/2001US20010018756 Block based design methodology
08/30/2001US20010018662 Assistance method and apparatus
08/30/2001US20010018623 Method and system for management to manufacturing process for products nine
08/30/2001US20010018407 For semiconductor substrate surface comprising an organic carboxylic acid and a complexing agent having chelating ability; noncorrosive, does not cause adverse effect on planarization
08/30/2001US20010018322 Backing members and planarizing machines for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods of making and using such backing members
08/30/2001US20010018318 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
08/30/2001US20010018314 Methods of polishing materials, methods of slowing a rate of material removal of a polishing process, and methods of forming trench isolation regions
08/30/2001US20010018276 Lamp annealing apparatus and method of manufacturing semiconductor device
08/30/2001US20010018275 Method of using SACVD deposition and corresponding deposition reactor
08/30/2001US20010018274 Method for fabricating semiconductor device
08/30/2001US20010018273 Method of fabricating copper interconnecting line
08/30/2001US20010018272 Plasma treatment apparatus and method
08/30/2001US20010018271 Method for manufacturing a semiconductor wafer
08/30/2001US20010018270 Comprising silica abrasive and polycarboxylic acid to polish substrate of tantulum-containing metal film formed on dielectric film; accuracy
08/30/2001US20010018269 Method for PECVD deposition of selected material films
08/30/2001US20010018268 Method for PECVD deposition of selected material films
08/30/2001US20010018267 Single-substrate-heat-processing apparatus and method for performing reformation and crystallization
08/30/2001US20010018266 Method for electroless plating a contact pad
08/30/2001US20010018265 Method of manufacturing interconnect
08/30/2001US20010018264 Semiconductor integrated circuit device and method of manufacturing the same
08/30/2001US20010018263 Bump-forming method using two plates and electronic device
08/30/2001US20010018262 Process for forming a diffusion-barrier-material nitride film
08/30/2001US20010018261 Method and apparatus for filling a gap between spaced layers of a semiconductor
08/30/2001US20010018259 Method for fabricating conductive line pattern for semiconductor device
08/30/2001US20010018258 Method for fabricating semiconductor device
08/30/2001US20010018257 Aluminum conductive layer; forming titanium nitride layer; oxidation of titanium nitride layer, or depositing oxide layer of silicon dioxide
08/30/2001US20010018256 Method of patterning organic polymer film and method for fabricating semiconductor device
08/30/2001US20010018255 MOS transistor for high-speed and high-performance operation and manufacturing method thereof
08/30/2001US20010018254 Semiconductor device manufacturing method and semiconductor device manufacturing by the same method
08/30/2001US20010018253 Semiconductor device and manufacturing method thereof
08/30/2001US20010018252 Method for fabricating semiconductor device by using etching polymer
08/30/2001US20010018251 Semiconductor processing methods of forming integrated circuitry
08/30/2001US20010018250 Process for the fabrication of an integrated circuit comprising MOS transistors for low voltage, EPROM cells and MOS transistors for high voltage
08/30/2001US20010018249 Semiconductor device with low resistivity film embedded and manufacturing method for the same
08/30/2001US20010018248 Method for fabricating semiconductor device
08/30/2001US20010018247 Process of manufacturing a dynamic random access memory device
08/30/2001US20010018246 Methods of forming conductive lines, methods of forming insulative spacers over conductive line sidewalls, methods of forming memory circuitry, and memory circuitry
08/30/2001US20010018245 Method for manufacturing semiconductor devices
08/30/2001US20010018244 Capacitor for semiconductor device and method for manufacturing the same
08/30/2001US20010018243 Method for fabricating a semiconductor device
08/30/2001US20010018242 Method for regenerating semiconductor wafers
08/30/2001US20010018241 Transistor and method for fabricating the same
08/30/2001US20010018240 Method of fabricating thin film transistor
08/30/2001US20010018239 Laser annealing method and laser annealing device
08/30/2001US20010018237 Method for fabricating a nonvolatile dram memory cell
08/30/2001US20010018236 Methods for producing packaged integrated circuit devices & packaged integrated circuit devices produced thereby
08/30/2001US20010018234 Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components
08/30/2001US20010018233 Method of manufacturing semiconductor device
08/30/2001US20010018232 Process for manufacturing a semiconductor arrangement
08/30/2001US20010018231 Bumpless flip chip assembly with strips and via-fill
08/30/2001US20010018230 Flip chip C4 extension structure and process
08/30/2001US20010018229 Semiconductor device and method for fabricating same
08/30/2001US20010018228 Connecting material and mounting method which uses same
08/30/2001US20010018227 Process for producing a semiconductor device
08/30/2001US20010018225 Tape carrier type semiconductor device, method for manufacturing the same, and flexible substrate
08/30/2001US20010018224 Semiconductor device and manufacturing method thereof
08/30/2001US20010018222 Silicon tip anodized by ultravolet radiation; resulting oxide layer removed using hydrogen halide; results in sharpened tip
08/30/2001US20010018221 Method of manufacturing ferroelectric memory device
08/30/2001US20010018168 Resist development method
08/30/2001US20010018167 Method of and apparatus for developing exposed photoresist to prevent impurity from being attached to wafer surface
08/30/2001US20010018166 Organic solvent developer
08/30/2001US20010018165 Protective coating for silicon nitride spacer
08/30/2001US20010018161 Resist compositions
08/30/2001US20010018160 Novolak resin containing naphthoqiononediazidosulfonyl group; phenolic compound
08/30/2001US20010018153 Photolithography
08/30/2001US20010018137 Ultra-low resistivity tantalum films and methods for their deposition
08/30/2001US20010018132 Heating to crystallize
08/30/2001US20010018129 Hardness, noncracking
08/30/2001US20010018124 Using hot melt adhesive
08/30/2001US20010018109 Molding apparatus and molding method for flexible substrate based package
08/30/2001US20010017939 Position detecting method, position detecting apparatus, exposure method, exposure apparatus and making method thereof, computer readable recording medium and device manufacturing method
08/30/2001US20010017878 Method of inspecting pattern and inspecting instrument
08/30/2001US20010017874 Semiconductor light emitting device and method for producing the same
08/30/2001US20010017808 Non-volatile memory cell having bilayered floating gate and fabricating method thereof
08/30/2001US20010017807 Semiconductor memory device allowing static-charge tolerance test between bit lines
08/30/2001US20010017802 Semiconductor device and semiconductor device testing method
08/30/2001US20010017800 Cell array region of a NOR-type mask ROM device and fabricating method therefor
08/30/2001US20010017798 Semiconductor integrated circuit device and data processor device
08/30/2001US20010017795 Integrated dynamic memory cell having a small area of extent, and a method for its production
08/30/2001US20010017789 Nonvolatile semiconductor memory device having a data reprogram mode
08/30/2001US20010017786 Integrated optoelectronic device with an avalanche photodetector and method of making the same using commercial CMOS processes