| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 08/30/2001 | US20010017763 Cooling device for a high-power semiconductor module |
| 08/30/2001 | US20010017757 Method for fabrication of ceramic tantalum nitride and imporoved structures based thereon |
| 08/30/2001 | US20010017755 Semiconductor integrated circuit provided with input protection device, assembly circuit board of the semiconductor integrated circuit, and method of removing the input protection function |
| 08/30/2001 | US20010017754 Semiconductor integrated device |
| 08/30/2001 | US20010017739 Multi-beam lithography apparatus with mutually different beam limiting apertures |
| 08/30/2001 | US20010017695 Method and apparatus for evaluating semiconductor film, and method for producing the semiconductor film |
| 08/30/2001 | US20010017692 Illumination optical apparatus and exposure apparatus |
| 08/30/2001 | US20010017691 Exposure apparatus |
| 08/30/2001 | US20010017683 Electro-optical device |
| 08/30/2001 | US20010017568 Signal processing semiconductor integrated circuit device |
| 08/30/2001 | US20010017552 Semiconductor device and semiconductor device testing method |
| 08/30/2001 | US20010017551 An electronic device workpiece processing intermediate member |
| 08/30/2001 | US20010017549 Probe and method for examining electrical characteristics of devices |
| 08/30/2001 | US20010017547 Tape-like member transfer system |
| 08/30/2001 | US20010017546 Antifuse repair circuit |
| 08/30/2001 | US20010017524 Plasma processing system |
| 08/30/2001 | US20010017488 Circuit for automatically inverting electrical lines connected to a device upon detection of a miswired condition to allow for operation of device even if miswired |
| 08/30/2001 | US20010017426 Semiconductor integrated circuit device and manufacturing method thereof |
| 08/30/2001 | US20010017425 Mounting structure of semiconductor device and mounting method thereof |
| 08/30/2001 | US20010017424 Methods for making copper and other metal interconnections in integrated circuits |
| 08/30/2001 | US20010017423 Semiconductor device having sidewall spacers manifesting a self-aligned contact hole |
| 08/30/2001 | US20010017422 Semiconductor device with copper-based wiring lines and method of fabricating the same |
| 08/30/2001 | US20010017421 Semiconductor element with metal layer |
| 08/30/2001 | US20010017419 Method for forming a bit line for a semiconductor device |
| 08/30/2001 | US20010017417 Semiconductor device with a condductive metal layer engaging not less than fifty percent of a source\drain region |
| 08/30/2001 | US20010017416 Device having metal interconnects with reduced or eliminated metal recess in vias |
| 08/30/2001 | US20010017415 Semiconductor device and manufacturing method thereof |
| 08/30/2001 | US20010017414 Flip chip with integrated mask and underfill |
| 08/30/2001 | US20010017413 Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components |
| 08/30/2001 | US20010017412 Semiconductor device |
| 08/30/2001 | US20010017411 Semiconductor chip and semiconductor device having the chip |
| 08/30/2001 | US20010017406 Stacked structure of stackable semiconductor packages and method of stacking same |
| 08/30/2001 | US20010017405 Solid-state image pickup device and a method of manufacturing the same |
| 08/30/2001 | US20010017403 Push-up pin of a semiconductor element pushing-up device, a semiconductor element pushing-up device, and a method for separating a semiconductor element in a semiconductor element pushing-up device |
| 08/30/2001 | US20010017402 Semiconductor device and method of manufacturing the same |
| 08/30/2001 | US20010017401 Method and apparatus for endpointing planarization of a microelectronic substrate |
| 08/30/2001 | US20010017400 Semiconductor device |
| 08/30/2001 | US20010017399 Bipolar transistor and manufacturing method thereof |
| 08/30/2001 | US20010017397 Thin-film resistor and method of fabrication |
| 08/30/2001 | US20010017396 High resistance integrated circuit resistor |
| 08/30/2001 | US20010017395 Inductors, semiconductor devices, and methods of manufacturing semiconductor devices |
| 08/30/2001 | US20010017394 Semiconductor device and method for manufacturing the same |
| 08/30/2001 | US20010017393 Diode and method for manufacturing the same |
| 08/30/2001 | US20010017392 Vertical transport MOSFETs and method for making the same |
| 08/30/2001 | US20010017391 Method of fabricating semiconductor device |
| 08/30/2001 | US20010017390 Non-uniform gate/dielectric field effect transistor |
| 08/30/2001 | US20010017389 Semiconductor device and method of manufacturing such a device |
| 08/30/2001 | US20010017388 Semiconductor device and method of manufacturing same |
| 08/30/2001 | US20010017387 Method of fabricating buried source to shrink chip size in memory array |
| 08/30/2001 | US20010017386 Memory configuration and method for reading a state from and storing a state in a ferroelectric transistor |
| 08/30/2001 | US20010017385 Semiconductor device |
| 08/30/2001 | US20010017384 Method of forming a buried bitline in a vertical DRAM device |
| 08/30/2001 | US20010017379 High voltage transistor using P+ buried layer |
| 08/30/2001 | US20010017378 Semiconductor device |
| 08/30/2001 | US20010017374 Semi-insulating silicon carbide without vanadium domination |
| 08/30/2001 | US20010017373 Diamond interconnection substrate and a manufacturing method therefor |
| 08/30/2001 | US20010017372 Display device and method for fabricating the same |
| 08/30/2001 | US20010017371 Display device such as electro-optic element and thin film transistor and display device manufacturing method |
| 08/30/2001 | US20010017370 Nitride based transistors on semi-insulating silicon carbide substrates |
| 08/30/2001 | US20010017367 Fieldless CMOS image sensor |
| 08/30/2001 | US20010017296 Fluid heating apparatus |
| 08/30/2001 | US20010017294 Method and equipment for manufacturing semiconductor device |
| 08/30/2001 | US20010017286 Low rate removal etch process in the manufacture of semiconductor integrated devices using a dielectric film deposition chamber |
| 08/30/2001 | US20010017285 Method of manufacturing semiconductor device having ferro-dielectric material film |
| 08/30/2001 | US20010017265 Molecular recognition type chemical CCD |
| 08/30/2001 | US20010017258 Wafer plating apparatus |
| 08/30/2001 | US20010017221 Wiring boards, semiconductor devices and their production processes |
| 08/30/2001 | US20010017205 Method of substrate temperature control and method of assessing substrate temperature controllability |
| 08/30/2001 | US20010017192 Cluster tool for fabricating semiconductor device |
| 08/30/2001 | US20010017191 Apparatus for removing a coating film |
| 08/30/2001 | US20010017190 Apparatus of processing a sample surface and method thereof |
| 08/30/2001 | US20010017189 Sheet removing apparatus and method |
| 08/30/2001 | US20010017182 Method of preventing roping phenomenon of bonding paste for bonding die on lead frame |
| 08/30/2001 | US20010017153 Solar cell and method of fabricating the same |
| 08/30/2001 | US20010017148 Wet processing device |
| 08/30/2001 | US20010017146 Thermocapillary dryer |
| 08/30/2001 | US20010017143 Spraying an aqueous solution while simultaneously contacting the wafer with ozone to oxidize contaminants, and rinsing with water |
| 08/30/2001 | US20010017105 Wafer plating apparatus |
| 08/30/2001 | US20010017099 Method of manufacturing semiconductor substrate |
| 08/30/2001 | US20010017080 Apparatus for controlling polymerized teos build-up in vacuum pump lines |
| 08/30/2001 | US20010017058 Micromechanical component and method for producing the micromechanical component |
| 08/30/2001 | US20010017035 Cooling device and cooling method |
| 08/30/2001 | US20010016990 Vacuum processing apparatus and operating method therefor |
| 08/30/2001 | DE19958803C1 Verfahren und Vorrichtung zum Handhaben von Halbleitersubstraten bei der Prozessierung und/oder Bearbeitung Method and apparatus for handling semiconductor substrates during the processing and / or handling |
| 08/30/2001 | DE10109506A1 Method for connecting integrated circuit test head to automatic handling device, with improved pipe connection, allowing low temperature testing of ICs by supply of carbon dioxide vapor to test head |
| 08/30/2001 | DE10108845A1 Transportsystem für elektronische Bauelemente und Verfahren zum Transportieren von elektronischen Bauelementen Transport system for electronic devices and methods for transporting electronic components |
| 08/30/2001 | DE10106860A1 Magnetic Tunnel Junction element has third magnetic layer on opposite side of second magnetic layer from first forming closed magnetic circuit in common with second magnetic layer |
| 08/30/2001 | DE10061741A1 Method and device for making available consecutive identification and for recognizing etched characters in components like silicon and ceramic substrates assigns an alphanumeric character ID to substrates or wafers. |
| 08/30/2001 | DE10049831A1 Photoresist-Strippermittel und Verfahren zum Strippen von Photoresistaufträgen unter Verwendung des Mittels Photoresist stripper means and methods for stripping photoresist orders using the agent |
| 08/30/2001 | DE10008545A1 Monolithic integrated semiconducting component has first region with additional contact to higher concentration region so Ohmic contact exists and is connected to Schottky diode(s) |
| 08/30/2001 | DE10008386A1 Method for connecting substrates of a vertical, integrated circuit structure partitions a top substrate into a first subpart with a metallizing structure and a second silicon subpart with a circuit structure. |
| 08/30/2001 | DE10008273A1 Assembly of small components produced by separation from semi-finished part onto bearer involves applying adhesive material to semi-finished part for adhesion to bearer after separation |
| 08/30/2001 | DE10008203A1 Manufacturing electronic semiconducting components involves attaching semiconducting body to conductive substrate, making electrical connections, encapsulating body, dividing substrate |
| 08/30/2001 | DE10005619A1 Integrierter Halbleiterspeicher mit Speicherzellen mit ferroelektrischem Speichereffekt Integrated semiconductor memory having memory cells with ferroelectric memory effect |
| 08/30/2001 | CA2400157A1 Organic polymeric antireflective coatings deposited by chemical vapor deposition |
| 08/30/2001 | CA2399895A1 E-beam/microwave gas jet pecvd method and apparatus for depositing and/or surface modification of thin film materials |
| 08/29/2001 | EP1128662A1 Active pixel sensor with photo diode discharge |
| 08/29/2001 | EP1128534A2 High voltage generating circuit improved in parasitic capacitance of voltage-dividing resistance |
| 08/29/2001 | EP1128443A1 Field-effect semiconductor device |
| 08/29/2001 | EP1128441A2 Semiconductor devices comprising a SOI bipolar transistor and corresponding manufacturing methods |