Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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09/07/2001 | WO2001065608A2 Trench gate dmos field-effect transistor and method of making the same |
09/07/2001 | WO2001065606A2 Field effect transistor configuration having a high latch-up strength and method for the production thereof |
09/07/2001 | WO2001065603A1 Heat-conducting adhesive compound and a method for producing a heat-conducting adhesive compound |
09/07/2001 | WO2001065602A1 Wiring board, semiconductor device, and method of manufacturing wiring board |
09/07/2001 | WO2001065601A2 Device for packing electronic components using injection moulding technology |
09/07/2001 | WO2001065600A2 Nanoscale patterning for the formation of extensive wires |
09/07/2001 | WO2001065599A2 Nitride layer forming methods |
09/07/2001 | WO2001065598A1 Electrical connection between two surfaces of a substrate and method for producing same |
09/07/2001 | WO2001065597A1 Semiconductor device and method of fabrication |
09/07/2001 | WO2001065596A2 Method for controlling uniformity of treatment of a surface of material for microelectronics with an electrically charged particle beam and equipment therefor |
09/07/2001 | WO2001065595A2 A method of forming an opening or cavity in a substrate for receiving an electronic component |
09/07/2001 | WO2001065594A2 A method of producing a schottky varicap diode |
09/07/2001 | WO2001065593A1 Dense-plasma etching of inp-based materials using chlorine and nitrogen |
09/07/2001 | WO2001065592A2 Method and device for producing group iii-n, group iii-v-n and metal-nitrogen component structures on si substrates |
09/07/2001 | WO2001065565A1 An improved high density memory cell |
09/07/2001 | WO2001065317A2 Method for evaluation of reticle image using aerial image simulator |
09/07/2001 | WO2001065316A1 Method of manufacturing a device by means of a mask and phase-shifting mask for use in said method |
09/07/2001 | WO2001065315A2 Method and apparatus for mixed-mode optical proximity correction |
09/07/2001 | WO2001065224A1 Method and apparatus for measuring the temperature of a semiconductor substrate by means of a resonant circuit |
09/07/2001 | WO2001064975A2 Method and device for growing large-volume oriented monocrystals |
09/07/2001 | WO2001064391A2 Planarization system with a wafer transfer corridor and multiple polishing modules |
09/07/2001 | WO2001064389A2 Vertical counter balanced test head manipulator |
09/07/2001 | WO2001064314A1 Air management system and method for chemical containment and contamination reduction in a semiconductor manufacturing facility |
09/07/2001 | WO2001029890A3 Method relating to anodic bonding |
09/07/2001 | WO2001006568A3 Trench-gate field-effect transistors and their manufacture |
09/07/2001 | WO2001001247A3 Semiconductor parallel tester |
09/07/2001 | WO2000077832A3 Metal oxide thin films for high dielectric constant applications |
09/07/2001 | WO2000073905A3 Test interface for electronic circuits |
09/07/2001 | WO2000072359A3 Source-down power transistor |
09/07/2001 | WO2000025365A3 Power semiconductor devices having improved high frequency switching and breakdown characteristics |
09/07/2001 | EP1145325A3 Trench-gate field-effect transistors and their manufacture |
09/07/2001 | CA2401025A1 An improved high density memory cell |
09/07/2001 | CA2400765A1 Dense-plasma etching of inp-based materials using chlorine and nitrogen |
09/07/2001 | CA2353490A1 Method and apparatus for low energy electron enhanced etching of substrates in an ac or dc plasma environment |
09/06/2001 | US20010020195 Process monitoring system for lithography lasers |
09/06/2001 | US20010020081 Heat and solvent resistance |
09/06/2001 | US20010020065 Vinyl 4-t-butoxycarbonyloxybenzal-vinyl alcohol-vinyl acetate copolymer, vinyl 4-t-butoxycarbonyloxybenzal-vinyl 4-hydroxybenzal-vinyl alcohol-vinyl acetate and preparation methods thereof |
09/06/2001 | US20010019934 Polishing apparatus including holder and polishing head with rotational axis of polishing head offset from rotational axis of holder and method of using |
09/06/2001 | US20010019910 Integrated circuit with electrical connection points that can be severed by the action of enegry |
09/06/2001 | US20010019905 Lead configurations |
09/06/2001 | US20010019903 Inductively coupled plasma CVD |
09/06/2001 | US20010019902 Wet-oxidation apparatus and wet-oxidation method |
09/06/2001 | US20010019901 Process of manufacturing semiconductor device |
09/06/2001 | US20010019900 Semiconductor manufacturing method and semiconductor manufacturing apparatus |
09/06/2001 | US20010019899 Semiconductor processing apparatuses, and methods of forming antireflective coating materials over substrates |
09/06/2001 | US20010019898 Integrated circuit with borderless contacts |
09/06/2001 | US20010019897 High etch rate method for plasma etching silicon nitride |
09/06/2001 | US20010019896 Chemical vapor deposition apparatus for manufacturing semiconductor devices, its driving method and method of optimizing recipe of cleaning process for process chamber |
09/06/2001 | US20010019895 Methods, apparatuses, and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes |
09/06/2001 | US20010019894 Pre-heat step (or chamber) implemented in pr dry ash machines to effectively eliminate pr extrusion (bubble) after alloy |
09/06/2001 | US20010019893 Integrated circuit having self-aligned CVD-tungsten/titanium contact plugs strapped with metal interconnect and method of manufacture |
09/06/2001 | US20010019892 Process for fabricating a semiconductor device |
09/06/2001 | US20010019891 Method of forming copper interconnections and thin films using chemical vapor deposition with catalyst |
09/06/2001 | US20010019890 Process for manufacturing semiconductor device |
09/06/2001 | US20010019889 Method for PECVD deposition of selected material films |
09/06/2001 | US20010019888 Metal deposit process |
09/06/2001 | US20010019887 Chemical mechanical polishing of polysilicon plug using a silicon nitride stop layer |
09/06/2001 | US20010019886 Borderless contact to diffusion with respect to gate conductor and methods for fabricating |
09/06/2001 | US20010019885 Methods for patterning metal layers for use with forming semiconductor devices |
09/06/2001 | US20010019884 Microstructure liner having improved adhesion |
09/06/2001 | US20010019883 Method for forming an inter-metal dielectric layer |
09/06/2001 | US20010019882 Method of making electrical interconnection for attachment to a substrate |
09/06/2001 | US20010019881 Plasma processing apparatus and method |
09/06/2001 | US20010019880 Method of producing alignment marks |
09/06/2001 | US20010019878 Method for producing a semiconductor device |
09/06/2001 | US20010019877 Method of forming silicon-contained crystal thin film |
09/06/2001 | US20010019876 Methods of forming materials between conductive electrical components, and insulating materials |
09/06/2001 | US20010019875 Electrode structure of capacitor for semiconductor memory device and fabrication method thereof |
09/06/2001 | US20010019874 Capacitor for integrated circuit and its fabrication method |
09/06/2001 | US20010019873 Self aligned symmetric intrinsic process and device |
09/06/2001 | US20010019872 Transistor and method |
09/06/2001 | US20010019871 Semiconductor device having SOI structure and method of fabricating the same |
09/06/2001 | US20010019870 Semiconductor processing methods of forming integrated circuitry, forming conductive lines, forming a conductive grid, forming a conductive network, forming an electrical interconnection to a node location forming an electrical interconnection with a transistor source/drain region, and integrated circuitry |
09/06/2001 | US20010019869 Asymmetrical MOS channel structure with drain extension |
09/06/2001 | US20010019868 Field effect transistor assemblies, integrated circuitry, and methods of forming field effect transistors and integrated circuitry |
09/06/2001 | US20010019867 Non-volatile semiconductor memory and fabricating method therefor |
09/06/2001 | US20010019866 Method of forming a contact hole in a semiconductor substrate using oxide spacers on the sidewalls of the contact hole |
09/06/2001 | US20010019865 Metallization outside protective overcoat for improved capacitors and inductors |
09/06/2001 | US20010019864 Semiconductor device and method for fabricating the same |
09/06/2001 | US20010019863 Method of forming a polycrystalline silicon layer |
09/06/2001 | US20010019862 Semiconductor device and its fabrication |
09/06/2001 | US20010019860 Semiconductor device and method for manufacturing the same |
09/06/2001 | US20010019859 Semiconductor device and fabrication method thereof |
09/06/2001 | US20010019858 Semiconductor device and method of manufacturing the same |
09/06/2001 | US20010019857 Semiconductor device and process for producing the same |
09/06/2001 | US20010019856 Semiconductor device and method for manufacturing the same |
09/06/2001 | US20010019855 Method for manufacturing integrated circuits and semiconductor wafer which has integrated circuits |
09/06/2001 | US20010019854 Low-pin-count chip package and manufacturing method thereof |
09/06/2001 | US20010019852 Semiconductor device, method of making the same, circuit board, flexible substrate, and method of making substrate |
09/06/2001 | US20010019851 Reduced leakage trench isolation |
09/06/2001 | US20010019850 Reduced leakage trench isolation |
09/06/2001 | US20010019847 Method of forming thin copper film |
09/06/2001 | US20010019812 Charged-particle-beam microlithography apparatus and methods for exposing a segmented reticle |
09/06/2001 | US20010019807 Semiconductor substrate |
09/06/2001 | US20010019803 Buffer layer |
09/06/2001 | US20010019802 Forming light shield on substrate |
09/06/2001 | US20010019766 A substrate with an intermediate layer superimposed on it and a pressure sensitive adhesive layer superimposed on the intermediate layer |
09/06/2001 | US20010019765 Radiation-curable heat-peelable pressure-sensitive adhesive sheet and process for producing cut pieces with the same |
09/06/2001 | US20010019750 Vapor deposition; molecular beam epitaxial |
09/06/2001 | US20010019744 Process for plating metal coatings |