Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2001
09/13/2001WO2001067181A1 Wafer alignment
09/13/2001WO2001067180A1 Method for forming resist pattern in reverse-tapered shape
09/13/2001WO2001067071A2 Evaluating a property of a multilayered structure
09/13/2001WO2001066834A2 Chemical vapor deposition process for fabricating layered superlattice materials
09/13/2001WO2001066832A2 Graded thin films
09/13/2001WO2001066821A1 Method for substrate thermal management
09/13/2001WO2001066819A2 Methods for preparing ruthenium metal films
09/13/2001WO2001066817A1 Wafer processing apparatus and method
09/13/2001WO2001066645A1 Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof
09/13/2001WO2001066272A1 Laser discharge chamber passivation by plasma
09/13/2001WO2001066260A2 Apparatus for the application of developing solution to a semiconductor wafer
09/13/2001WO2001031092A3 Method, chemistry, and apparatus for noble metal electroplating a on a microelectronic workpiece
09/13/2001WO2001011098A3 Copper deposit process
09/13/2001WO2001004940A8 Method for doping gallium nitride (gan) substrates and the resulting doped gan substrate
09/13/2001WO2000042231A8 Polycrystalline silicon germanium films for forming micro-electromechanical systems
09/13/2001US20010021992 Method of designing layout for integrated circuit
09/13/2001US20010021785 Indium source reagent compositions, and use thereof for deposition of indium-containing films on substrates and ion implantation of indium-doped shallow junction microelectronic structures
09/13/2001US20010021760 Polysilanes
09/13/2001US20010021628 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
09/13/2001US20010021625 Method and apparatus for cleaning polishing surface of polisher
09/13/2001US20010021623 Semiconductor device washing apparatus and a method of washing a semiconductor device
09/13/2001US20010021622 Method and apparatus for detecting a planarized outer layer of a semiconductor wafer with a confocal optical system
09/13/2001US20010021621 Method and apparatus for wireless transfer of chemical-mechanical planarization measurements
09/13/2001US20010021595 Sub-atmospheric pressure thermal chemical vapor deposition (SACVD) trench isolation method with attenuated surface sensitivity
09/13/2001US20010021594 Planarization using laser ablation
09/13/2001US20010021593 Chemical vapor deposition apparatus and chemical vapor deposition process
09/13/2001US20010021592 High density plasma chemical vapor deposition apparatus and gap filling method using the same
09/13/2001US20010021591 From reactants ozone, and triethoxyfluorosilane for example, forming an insulating material comprising silicon, oxygen and fluorine, and optionally doping with boron or phosphorus; fluorine gives material with higher density
09/13/2001US20010021590 Directly vaporizing an organosilicon compound and then introducing it to the reaction chamber of the plasma chemical vapor deposition apparatus; residence time of source gas is lengthened by reducing total flow of reaction gas
09/13/2001US20010021589 Forming a layer of suboxide material comprising hafnium, zirconium, lanthanum, scandium or cerium silicates on a semiconductor substrate and forming a structure on the suboxide; transistors
09/13/2001US20010021588 Nitridation for split gate multiple voltage devices
09/13/2001US20010021587 Method for etching metals using organohalide compounds
09/13/2001US20010021586 Method of manufacturing semiconductor device
09/13/2001US20010021585 Etching method and manufacturing method of a structure
09/13/2001US20010021583 Microelectronic device fabricating method, integrated circuit, and intermediate construction
09/13/2001US20010021582 Methods for manufacturing semiconductor chips, methods for manufacturing semiconductor devices, semiconductor chips, semiconductor devices, connection substrates and electronic devices
09/13/2001US20010021581 Patterning conductive lines in circuit structures
09/13/2001US20010021580 Semiconductor device of multi-layered wiring structure and method of manufacturing the same
09/13/2001US20010021579 Semiconductor processing method of forming a conductive line, and buried bit line memory circuitry
09/13/2001US20010021578 Interconnect structure of semiconductor device and method for manufacturing same
09/13/2001US20010021577 Method for forming sidewall spacers using frequency doubling hybrid resist and device formed thereby
09/13/2001US20010021576 Method of manufacturing self-aligned contact hole
09/13/2001US20010021575 High resolution dopant/impurity incorporation in semiconductors via a scanned atomic force probe
09/13/2001US20010021574 Method of manufacturing silicon epitaxial wafer
09/13/2001US20010021572 Method for producing a semiconductor device
09/13/2001US20010021571 Semiconductor wafer processing apparatus
09/13/2001US20010021569 Method and apparatus for manufacturing semiconductor device
09/13/2001US20010021568 Methods of forming polished material and methods of forming isolation regions
09/13/2001US20010021567 Method of forming device isolation structure
09/13/2001US20010021566 Anodic oxidization methods
09/13/2001US20010021565 Method of manufacturing a semiconductor capacitor having a hemispherical grain layer using a dry cleaning process
09/13/2001US20010021564 Method for fabricating dielectric capacitor
09/13/2001US20010021563 Method of fabricating triple polysilicon non-volatile memory cells
09/13/2001US20010021562 Semiconductor arrangement having capacitive structure and manufacture thereof
09/13/2001US20010021561 Non-volatile memory device and fabrication method thereof
09/13/2001US20010021559 Integrated circuit, components thereof and manufacturing method
09/13/2001US20010021558 Semiconductor integrated circuit device
09/13/2001US20010021557 Semiconductor device and method of manufacturing the same
09/13/2001US20010021556 Method for manufacturing electronic devices comprising non-volatile memory cells and LV transistors with salicided junctions
09/13/2001US20010021555 Process for the manufacturing of an electrically programmable non-volatile memory device
09/13/2001US20010021554 Method for fabricating a semiconductor component
09/13/2001US20010021553 Vertical DRAM cell with TFT over trench capacitor
09/13/2001US20010021552 Capacitor structures, DRAM cell structures, and integrated circuitry, and methods of forming capacitor structures, integrated circuitry and DRAM cell structures
09/13/2001US20010021551 Process for manufacturing semiconductor integrated circuit device
09/13/2001US20010021550 Plasma processing method and apparatus
09/13/2001US20010021549 Methods of enhancing data retention of a floating gate transistor, methods of forming floating gate transistors, and floating gate transistors
09/13/2001US20010021548 Alignment mark set and method of measuring alignment accuracy
09/13/2001US20010021547 Bonding materials
09/13/2001US20010021546 Mask, exposure method, line width measuring method, and method for manufacturing semiconductor devices
09/13/2001US20010021545 Method for eliminating transfer gate sacrificial oxide
09/13/2001US20010021544 Semiconductor device and manufacturing method thereof
09/13/2001US20010021542 Technique for underfilling stacked chips on a cavity MLC module
09/13/2001US20010021541 Wafer-level package and methods of fabricating
09/13/2001US20010021539 Process for formation of cap layer for semiconductor
09/13/2001US20010021538 Micromechanical component and process for its fabrication
09/13/2001US20010021537 Methods of manufacturing tunnel magnetoresistive element, thin-film magnetic head and memory element
09/13/2001US20010021490 Photomask having small pitch images of openings for fabricating openings in a semiconductor memory device and a photolithographic method for fabricating the same
09/13/2001US20010021489 Photoresist stripping solution and a method of stripping photoresists using the same
09/13/2001US20010021488 Cyclic urea
09/13/2001US20010021486 Substrate processing method and substrate processing apparatus
09/13/2001US20010021482 Acrylic polymer
09/13/2001US20010021479 Positive photoresist composition
09/13/2001US20010021477 Method of manufacturing a device by means of a mask phase-shifiting mask for use in said method
09/13/2001US20010021422 Discharge plasma generating method, discharge plasma generating apparatus, semiconductor device fabrication method, and semiconductor device fabrication apparatus
09/13/2001US20010021419 Method for applying photoresist to a base body surface
09/13/2001US20010021414 Vapor deposition; prevent peeling of film; pretreatment by passivation
09/13/2001US20010021409 Integrated circuits; polymer sealing
09/13/2001US20010021340 Method for automatically transferring wafers between wafer holders in a liquid environment
09/13/2001US20010021265 Non-lot based method for assembling integrated circuit devices
09/13/2001US20010021240 X-ray spectroscopic analyzer having sample surface observation mechanism
09/13/2001US20010021216 Configuration and method for measuring a temperature of a semiconductor disk
09/13/2001US20010021206 Laser repetition rate multiplier
09/13/2001US20010021138 Voltage generator for semiconductor device
09/13/2001US20010021133 Method for manufacturing non-volatile semiconductor memory and non-volatile semiconductor memory manufactured thereby
09/13/2001US20010021125 Magnetic thin film element, memory element using the same, and method for recording and reproducing using the memory element
09/13/2001US20010021123 Semiconductor memory device
09/13/2001US20010021122 ROM-embedded-DRAM
09/13/2001US20010021015 Method and apparatus for analyzing the state of generation of foreign particles in semiconductor fabrication process
09/13/2001US20010021014 Inspection apparatus and method
09/13/2001US20010021010 Exposure apparatus and exposure method