| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 09/20/2001 | US20010022293 Plasma processing equipment and plasma processing method using the same |
| 09/20/2001 | US20010022292 Method of manufacturing a ferroelectric capacitor configuration |
| 09/20/2001 | US20010022271 Electron trap formed by magnetron field of sputter source increases ratio of heavy to light metal deposition along surface of substrate, counteracting demixing |
| 09/20/2001 | US20010022236 Substrate for power semiconductor modules with through-plating of solder and method for its production |
| 09/20/2001 | US20010022216 Reticle adapter for a reactive ion etch system |
| 09/20/2001 | US20010022215 Apparatus and method for improving uniformity in batch processing of semiconductor wafers |
| 09/20/2001 | US20010022188 Utilizing robot which carries semiconductor wafers to processing bays; clean rooms; compact |
| 09/20/2001 | US20010022186 Method of removing particles and a liquid from a surface of substrate |
| 09/20/2001 | US20010022158 Apparatus and method for improving plasma distribution and performance in an inductively coupled plasma |
| 09/20/2001 | US20010022157 Inductive-coupled plasma apparatus employing shield and method for manufacturing the shield |
| 09/20/2001 | US20010022154 Method and apparatus for single crystal gallium nitride (GAN) bulk synthesis |
| 09/20/2001 | US20010022148 Metal compound solution and thin film formation using the same |
| 09/20/2001 | US20010022094 Silicon surface oxidation device and method of fabricating optical waveguide substrate by the device |
| 09/20/2001 | US20010022008 Wafer scrubbing brush core |
| 09/20/2001 | DE10112783A1 Semiconductor arrangement with resistance includes resistive section with conductivity of second type extending through semiconductor thickness |
| 09/20/2001 | DE10112463A1 Superjunction semiconductor structure includes two layers of pn junctions in area contact, junctions in the first layer being closer together than those in the second |
| 09/20/2001 | DE10111710A1 Befestigungsverfahren für elektrische Bauteile Attachment methods for electrical components |
| 09/20/2001 | DE10110151A1 Wiring board e.g. for mobile communications device or computer, has insulating pattern formed on substrate, intersecting wiring pattern to define electrode |
| 09/20/2001 | DE10059883A1 Semiconductor die and wire bonder holding curved substrate flat and level at processing station, includes plate with resting surface and suction units |
| 09/20/2001 | DE10054593A1 Production of an aluminum nitride thin layer comprises adding hydrogen to the thin layer before it is treated with a plasma |
| 09/20/2001 | DE10021098C1 Production of conducting pathways on an integrated chip comprises applying a stacked dielectric layer, carrying out photolithography, etching, applying conducting material and removing, and applying an insulating layer |
| 09/20/2001 | DE10011889A1 Speicherzelle mit Graben und Verfahren zu ihrer Herstellung Memory cell with trench and processes for their preparation |
| 09/20/2001 | DE10011886A1 Verfahren zur Herstellung einer Leiterstruktur für einen integrierten Schaltkreis A method of manufacturing a conductor structure for an integrated circuit |
| 09/20/2001 | DE10011672A1 Integrierte DRAM-Speicherzelle sowie DRAM-Speicher Integrated DRAM memory cell as well as DRAM memory |
| 09/20/2001 | DE10010288C1 Ferroelectric capacitor device manufacturing method - has ferroelectric layer of varying thickness applied to electrode structure with different height levels |
| 09/20/2001 | DE10009762A1 Production of storage capacitor comprises applying cerium oxide layer to first electrode layer, applying amorphous dielectric layer, heating and applying second electrode layer on dielectric layer |
| 09/20/2001 | CA2440992A1 Ultra-high resolution imaging devices |
| 09/20/2001 | CA2402150A1 Method and implementing device for a chemical reaction |
| 09/19/2001 | EP1134896A2 Programmable logic array integrated circuits |
| 09/19/2001 | EP1134858A1 Buried mesa semiconductor device |
| 09/19/2001 | EP1134811A1 Transistor and semiconductor device |
| 09/19/2001 | EP1134810A2 Field effect transistor |
| 09/19/2001 | EP1134809A2 Ultra high speed heterojunction bipolar transistor having a cantilivered base |
| 09/19/2001 | EP1134808A1 Method for producing bonded wafer and bonded wafer |
| 09/19/2001 | EP1134806A2 Stress reducing lead-frame for plastic encapsulation |
| 09/19/2001 | EP1134805A2 Solder bump fabrication methods and structure including a titanium barrier layer |
| 09/19/2001 | EP1134804A2 Thermally enhanced semiconductor carrier |
| 09/19/2001 | EP1134803A1 Semiconductor device and method for fabricating the same |
| 09/19/2001 | EP1134802A2 Method of forming conducting diffusion barriers |
| 09/19/2001 | EP1134801A2 Method of fabrication and testing of electronic circuit structures in a semiconducting substrate |
| 09/19/2001 | EP1134800A2 Semiconductor device baking method |
| 09/19/2001 | EP1134799A1 Reduced thermal process for forming a nanocrystalline silicon layer within a thin oxide layer |
| 09/19/2001 | EP1134798A1 Semiconductor device, method for making the same and method for making electrical contacts on a semiconductor substrate |
| 09/19/2001 | EP1134797A2 Bipolar transistor having recessed and rounded surface and its manufacturing method |
| 09/19/2001 | EP1134796A2 Planarization after metal chemical mechanical polishing in semiconductor wafer fabrication |
| 09/19/2001 | EP1134795A1 Method of adjusting the threshold voltage of a MOS transistor |
| 09/19/2001 | EP1134794A1 Semiconductor thin film and thin film device |
| 09/19/2001 | EP1134793A1 Exposure method and exposure apparatus |
| 09/19/2001 | EP1134792A2 Apparatus for mounting semiconductor chips on a substrate |
| 09/19/2001 | EP1134791A2 Shadow ring with common guide member |
| 09/19/2001 | EP1134790A2 Apparatus for separating a composite member using fluid jet |
| 09/19/2001 | EP1134789A2 One-piece dual gas faceplate for a showerhead in a semiconductor wafer processing system |
| 09/19/2001 | EP1134788A1 Apparatus for mounting semiconductor chips on a substrate |
| 09/19/2001 | EP1134774A2 Plasma processing apparatus |
| 09/19/2001 | EP1134773A2 Method and apparatus for generating a plasma and semiconductor device fabrication method and apparatus |
| 09/19/2001 | EP1134744A2 Integrated memory having backplate segments |
| 09/19/2001 | EP1134661A1 Method for analysing a program for testing electronic components |
| 09/19/2001 | EP1134641A1 Apparatus for storing and moving a cassette |
| 09/19/2001 | EP1134618A2 Alignment for lithography |
| 09/19/2001 | EP1134617A2 Pattern formation material and method |
| 09/19/2001 | EP1134557A2 Method for accomodating sensors in a housing |
| 09/19/2001 | EP1134493A2 Steam generator |
| 09/19/2001 | EP1134304A2 Method of vertically aligning carbon nanotubes on substrates using thermal chemical vapor deposition with dc bias |
| 09/19/2001 | EP1134224A2 Cyclosilane compound, and solution composition and process for forming a silicon film |
| 09/19/2001 | EP1134064A2 Resin sealing/molding apparatus for electronic parts |
| 09/19/2001 | EP1134034A1 Method of forming paste |
| 09/19/2001 | EP1133904A1 Deposited thin build-up layer dimensions as a method of relieving stress in high density interconnect printed wiring board substrates |
| 09/19/2001 | EP1133797A1 Semiconductor device with esd protection |
| 09/19/2001 | EP1133795A1 Method for producing an integrated circuit processed on both sides |
| 09/19/2001 | EP1133792A1 Chemical mechanical polishing of feram capacitors |
| 09/19/2001 | EP1133791A1 Heat sink manufacturing device and manufacturing method |
| 09/19/2001 | EP1133790A1 Contaminant removal method |
| 09/19/2001 | EP1133788A1 Silane-based oxide anti-reflective coating for patterning of metal features in semiconductor manufacturing |
| 09/19/2001 | EP1133787A1 Inert gas recovery annealing of hydrogen-damaged ferroelectric films |
| 09/19/2001 | EP1133786A2 Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces |
| 09/19/2001 | EP1133713A2 Nanoparticle-based electrical, chemical, and mechanical structures and methods of making same |
| 09/19/2001 | EP1133652A2 Manifold system of removable components for distribution of fluids |
| 09/19/2001 | EP1133593A1 Growth method for a crystalline structure |
| 09/19/2001 | EP1133590A1 Epitaxial silicon wafers substantially free of grown-in defects |
| 09/19/2001 | EP1133442A1 Opening system compatible with a vertical interface |
| 09/19/2001 | EP1133441A1 Dual arm substrate handling robot with a batch loader |
| 09/19/2001 | EP1133440A1 Automated opening and closing of ultra clean storage containers |
| 09/19/2001 | EP1133437A1 Cushioned wafer container |
| 09/19/2001 | EP1133380A2 A carrier head with edge control for chemical mechanical polishing |
| 09/19/2001 | EP1133378A2 Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head |
| 09/19/2001 | EP1133376A1 Laser system |
| 09/19/2001 | EP1003615A4 Method for passivation of a metallization layer |
| 09/19/2001 | EP0944708A4 Non-corrosive cleaning composition for removing plasma etching residues |
| 09/19/2001 | EP0860026B1 Process for reducing defects in oxide layers on silicon carbide |
| 09/19/2001 | EP0838089B1 Integrated circuit arrangement with at least two components insulated from one another and a process for producing the said circuit arrangement |
| 09/19/2001 | EP0836747B1 Method of producing a read-only storage cell arrangement |
| 09/19/2001 | CN2449358Y Vacuum ring for classifier |
| 09/19/2001 | CN1314005A Semiconductor chip with surface coating |
| 09/19/2001 | CN1314004A Method and device for applying IC sealant with bump |
| 09/19/2001 | CN1313962A Photosensitive resin composition and method of improving dry etching resistance of photosensitive resin composition |
| 09/19/2001 | CN1313825A Cushioned wafer container |
| 09/19/2001 | CN1313661A Semiconductor laser and method for connection of leads |
| 09/19/2001 | CN1313640A Semiconductor device and forming method thereof |
| 09/19/2001 | CN1313637A Chip package with high effective heat transferring structure |
| 09/19/2001 | CN1313635A Macro-design technology for chip circuit connection arrangement with macro-scale |