Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2001
09/18/2001US6291273 Plastic molded type semiconductor device and fabrication process thereof
09/18/2001US6291272 Structure and process for making substrate packages for high frequency application
09/18/2001US6291271 Method of making semiconductor chip package
09/18/2001US6291270 Revealing localized cutting line patterns in a semiconductor device
09/18/2001US6291269 Semiconductor bare chip, method of manufacturing semiconductor bare chip and mounting structure of semiconductor bare chip
09/18/2001US6291268 Low cost method of testing a cavity-up BGA substrate
09/18/2001US6291267 Process for underfilling chip-under-chip semiconductor modules
09/18/2001US6291266 Method for fabricating large area flexible electronics
09/18/2001US6291265 Method of manufacturing an interposer
09/18/2001US6291264 Flip-chip package structure and method of fabricating the same
09/18/2001US6291263 Method of fabricating an integrated circuit package having a core-hollowed encapsulation body
09/18/2001US6291261 Method and device for processing a flat workpiece, especially a semiconductor wafer
09/18/2001US6291260 Crack-preventive substrate and process for fabricating solder mask
09/18/2001US6291255 TFT process with high transmittance
09/18/2001US6291253 Feedback control of deposition thickness based on polish planarization
09/18/2001US6291252 Automatic method to eliminate first-wafer effect
09/18/2001US6291251 Method for fabricating ferroelectric memory
09/18/2001US6291250 Method for manufacturing semiconductor memory device
09/18/2001US6291183 A plurality of oligonucleotide linker molecules are attached on a planar solid support, photoremovable groups react with terminal ends of oligonucleotides, substrates exposed to light activate binding at selected areas; peptide synthesis
09/18/2001US6291145 Image formation method with photosensitive material
09/18/2001US6291137 Multilayer elenent with patterns on templates with conductive films, removal horizontal portions of films and etching
09/18/2001US6291131 Monomers for photoresist, polymers thereof, and photoresist compositions using the same
09/18/2001US6291119 Exposure to rescattered electron beams, compensation exposure dosage
09/18/2001US6291114 Photomask with a mask edge provided with a ring-shaped ESD protection area
09/18/2001US6291111 Patterns with reverse treatment
09/18/2001US6291110 Exposing wafers, masking with programmable photolithography, controlling active electron distribution
09/18/2001US6291088 Inorganic overcoat for particulate transport electrode grid
09/18/2001US6291085 Zinc oxide films containing P-type dopant and process for preparing same
09/18/2001US6291072 Multilayer element with with insulating film of poly alpha, alpha-difluoroparaxylene
09/18/2001US6291030 Method for reducing capacitance in metal lines using air gaps
09/18/2001US6291028 Forming plasma from inert gas introduced into processing chamber, bringing radio frequency energy used in plasma formation to full power, introducing remaining reactant gases to effect plasma deposition
09/18/2001US6290868 Field-structured material media and methods for synthesis thereof
09/18/2001US6290865 Spin-rinse-drying process for electroplated semiconductor wafers
09/18/2001US6290864 Fluoride gas etching of silicon with improved selectivity
09/18/2001US6290863 Method and apparatus for etch of a specific subarea of a semiconductor work object
09/18/2001US6290833 Providing electroplating bath including copper sulfate, ammonium sulfate, complexing agenta and ethylene glycol; exposing workpiece surface on which microelectronic devices are to be formed; applying electroplating power to deposit
09/18/2001US6290825 High-density plasma source for ionized metal deposition
09/18/2001US6290822 Sputtering high dielectric constant film onto a substrate to incorporate carbon into high dielectric constant film in addition to those elements included in formulation in ambiant gas comprisng argona nd carbon dioxide, removing carbon
09/18/2001US6290805 System and method for using a pick and place apparatus
09/18/2001US6290804 Controlled cleavage process using patterning
09/18/2001US6290780 Method and apparatus for processing a wafer
09/18/2001US6290777 Method and device for washing electronic parts member, or the like
09/18/2001US6290774 Sequential hydride vapor phase epitaxy
09/18/2001US6290773 Method and apparatus for fabricating single crystal
09/18/2001US6290741 Auxiliary device for filter exchange in clean room
09/18/2001US6290736 In chemical mechanical polishing (cmp) in planarization of noble metals, and the formation of noble metal damascene electrode structures
09/18/2001US6290580 Polishing method for silicon wafers which uses a polishing compound which reduces stains
09/18/2001US6290577 Fluid pressure regulated wafer polishing head
09/18/2001US6290491 Method for heating a semiconductor wafer in a process chamber by a shower head, and process chamber
09/18/2001US6290481 Flash-free mold structure for integrated circuit package
09/18/2001US6290414 Method and apparatus for insertion and retainment of pomade within a dispenser
09/18/2001US6290405 Substrate processing apparatus
09/18/2001US6290274 Vacuum system and method for securing a semiconductor wafer in a planar position
09/18/2001US6290116 Bondhead lead clamp apparatus and method
09/18/2001US6290056 Conveying apparatus for conveying magnetic workpieces
09/18/2001US6289843 Method and apparatus for improving the film quality of plasma enhanced CVD films at the interface
09/18/2001US6289803 Method and apparatus for screen printing
09/18/2001US6289737 Vacuum pressure control system
09/18/2001US6289605 Method for drying a semiconductor wafer
09/18/2001US6289583 Method for making cards with multiple contact tips for testing semiconductor chips
09/18/2001US6289550 Jet cleaning device for developing station
09/18/2001CA2202426C Mounting structure for a semiconductor circuit
09/14/2001CA2340981A1 Method for the analysis of a test software tool
09/13/2001WO2001067839A1 Chip-mounting device and method of alignment thereof
09/13/2001WO2001067817A1 Ceramic substrate
09/13/2001WO2001067570A2 Buried mesa semiconductor device
09/13/2001WO2001067569A1 Plasma based process for photonic integration
09/13/2001WO2001067568A1 Quantum well intermixing
09/13/2001WO2001067524A1 Iii nitride compound semiconductor device
09/13/2001WO2001067522A1 Metal-insulator-metal capacitor and a method for producing same
09/13/2001WO2001067520A1 Semiconductor device
09/13/2001WO2001067517A1 Semiconductor device and method of manufacturing the same.
09/13/2001WO2001067516A1 Rapid ramping anneal method for fabricating superlattice materials
09/13/2001WO2001067515A1 Monolithically integrated semiconductor component
09/13/2001WO2001067513A1 Semiconductor device, method of manufacturing semiconductor device, lead frame, method of manufacturing lead frame, and method of manufacturing semiconductor device with lead frame
09/13/2001WO2001067511A2 Method of forming a stacked-die integrated circuit chip package on a wafer level
09/13/2001WO2001067510A1 Simox substrate and method for production thereof
09/13/2001WO2001067509A1 Semiconductor device and method of manufacture thereof
09/13/2001WO2001067508A1 Method for inspecting semiconductor circuit pattern
09/13/2001WO2001067506A1 Method and apparatus for mounting chip
09/13/2001WO2001067505A2 Substrate thermal management system
09/13/2001WO2001067504A1 Electronic device packaging
09/13/2001WO2001067503A1 A1 processing for impurity gettering in silicon
09/13/2001WO2001067502A2 Method and apparatus for milling copper interconnects in a charged particle beam system
09/13/2001WO2001067501A1 Apparatus and method for reducing differential sputter rates
09/13/2001WO2001067500A2 Methods for making nearly planar dielectric films in integrated circuits
09/13/2001WO2001067499A1 Multiple bandgap photonic integration
09/13/2001WO2001067498A1 Method for producing a field effect transistor with side wall oxidation
09/13/2001WO2001067497A1 Quantum well intermixing
09/13/2001WO2001067496A1 Method for opening key patterns on semiconductor
09/13/2001WO2001067495A2 Semiconductor trenches and formation thereof
09/13/2001WO2001067494A2 Precision electroplated solder bumps and method for manufacturing thereof
09/13/2001WO2001067493A1 Recipe cascading in a wafer processing system
09/13/2001WO2001067491A2 Digital feature separation
09/13/2001WO2001067490A2 Single tunnel gate oxidation process for fabricating nand flash memory
09/13/2001WO2001067469A1 Magnetic field element having a biasing magnetic layer structure
09/13/2001WO2001067465A2 Lead zirconate titanate dielectric thin film composites on metallic foils
09/13/2001WO2001067460A1 Magnetic device with a coupling layer and method of manufacturing and operation of such device
09/13/2001WO2001067458A1 Electronic semiconductor circuit which includes a tunnel diode
09/13/2001WO2001067387A1 Reinforced integrated circuit