Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2001
09/27/2001US20010023771 Metal line, method for fabricating the metal line, thin film transistor employing the metal line and display device
09/27/2001US20010023770 Packaging and interconnection of contact structure
09/27/2001US20010023742 Plasma reactor for the treatment of large size substrates
09/27/2001US20010023741 Inductively coupled plasma downstream strip module
09/27/2001US20010023733 System and method for making aerated concrete sheets using a saw
09/27/2001US20010023732 System and method for making aerated concrete sheets using lower and upper conveyors
09/27/2001US20010023709 Pilot-type two-port vacuum valve
09/27/2001US20010023701 Remover for a ruthenium containing metal and use thereof
09/27/2001US20010023700 Method and apparatus for immersion treatment of semiconductor and other devices
09/27/2001US20010023663 Mechanically softened tissues and towels; increased surface fuzziness
09/27/2001US20010023660 Method for fabricating a semiconductor structure having a crystalline alkaline earth metal oxide interface with silicon
09/27/2001US20010023534 Bent wire forming method
09/27/2001US20010023532 Method for producing multilayer circuit board
09/27/2001US20010023522 Flexibly interconnected vacuum chambers comprising load-canceling device therebetween, and process apparatus comprising same
09/27/2001EP1144737A3 Production of bulk single crystals of aluminum nitride, silicon carbide and aluminum nitride:silicon carbide alloy
09/27/2001EP1144155A3 Ultrasonic transducer slurry dispenser
09/27/2001DE10107125A1 Process for forming an integrated circuit comprises forming a pair of connecting patterns on a substrate followed by an etch stop and a sacrificial insulation layer, and selectively etching the sacrificial insulation layer
09/27/2001DE10056564A1 Plasma-activated surface treatment involves placing insulator between two electrodes with no shape-locking contact in defined surface areas
09/27/2001DE10023871C1 Field effect transistor comprises an electrically non-conducting substrate, a channel region between source and drain regions, and a gate region for controlling the channel region
09/27/2001DE10015213C1 Electronic or micro-electronic component is formed by number of insulation layers on substrate structured for free surfaces to be activated so that seeded by metallizing solution
09/27/2001DE10012882A1 Process for applying an integrated switching circuit to a support element used in the production of a semiconductor chip comprises using a hardenable compensation layer of pasty consistency to join the circuit to the support element
09/27/2001DE10012880A1 Process for encapsulating semiconductor chips comprises applying an adhering film on the lower side of the system carrier before injecting a pressed composition
09/27/2001DE10012876A1 Surface optimization method for components in integrated analogue circuits
09/27/2001DE10012112A1 Bar-type field effect transistor (FET) used in electronic devices comprises a bar formed on a substrate, and a gate and a spacer formed over part of the bar
09/27/2001DE10008004A1 Protective screen used for an electrostatic holder for processing substrates and wafers in plasma etching devices comprises a holding element for positioning the screen over the electrostatic holder
09/27/2001CA2404296A1 Nanocylinder arrays
09/27/2001CA2402850A1 Method and device for transferring spin-polarized charge carriers
09/27/2001CA2402383A1 Flame retardant epoxy molding compositions
09/27/2001CA2397692A1 Apparatus for generating a laser pattern on a photomask and associated methods
09/27/2001CA2374498A1 Surface planarization of thin silicon films during and after processing by the sequential lateral solidification method
09/27/2001CA2374057A1 Method and system for providing a continuous motion sequential lateral solidification
09/26/2001EP1137332A1 Printed wiring board and method of producing the same and capacitor to be contained in printed wiring board
09/26/2001EP1137329A2 Fixture, circuit board with fixture, and electronic-component mounted body and method of manufacturing the same
09/26/2001EP1137321A1 Ceramic heater
09/26/2001EP1137182A2 Semiconductor device for controlling semiconductor power switches
09/26/2001EP1137077A2 A semiconductor device, a method for manufacturing a semiconductor device and an epitaxial growth substrate for a semiconductor device
09/26/2001EP1137074A2 Power field effect transistor
09/26/2001EP1137073A1 Heterojunction bipolar transistor having a T-shaped emitter contact and method of making the same
09/26/2001EP1137072A2 Semiconductor device comprising a group III / nitride material and method of fabricating the same
09/26/2001EP1137069A1 Fabrication method for pasted soi wafer and pasted soi wafer
09/26/2001EP1137068A2 Power semiconductor device having a protection circuit
09/26/2001EP1137067A2 Multi-chip ball grid array ic packages
09/26/2001EP1137066A2 Semiconductor device and process of production of same
09/26/2001EP1137063A2 Gate electrode for DRAM transistor
09/26/2001EP1137062A1 Method for forming an isolation region
09/26/2001EP1137061A1 Operating method and device
09/26/2001EP1137060A2 Method for producing multilayer circuit board and multilayer circuit board
09/26/2001EP1137059A1 Semiconductor device, method for making the same and method for making electrical contacts between separated circuit elements
09/26/2001EP1137058A1 A method for pattering layers of semiconductor devices
09/26/2001EP1137057A2 Method for forming element isolation region
09/26/2001EP1137056A1 Abrasive liquid for metal and method for polishing
09/26/2001EP1137055A1 Method for manufacturing a high-frequency semiconductor structure and high-frequency semiconductor structure
09/26/2001EP1137053A2 Water cooled support for lamps and rapid thermal processing chamber
09/26/2001EP1137052A1 Automatic calibration system for wafer transfer robot
09/26/2001EP1137042A2 Plasma processing chamber
09/26/2001EP1137013A2 Semiconductor memory production system and method
09/26/2001EP1137012A2 Improved programming method for a memory cell
09/26/2001EP1136960A1 Individual arrangement
09/26/2001EP1136944A1 Non-contact type ic card and method and apparatus for manufacturing the same
09/26/2001EP1136920A2 Electric characteristic evaluating apparatus for a semiconductor device
09/26/2001EP1136827A2 Contactor having LSI-circuit-side contact piece and test-board-side contact piece for testing semiconductor device and manufacturing method thereof
09/26/2001EP1136816A2 X-ray spectroscopic analyzer having sample surface observation mechanism
09/26/2001EP1136735A2 Pilot-type two-port vacuum valve
09/26/2001EP1136614A1 Method for forming a thin film
09/26/2001EP1136597A2 Silicon surface oxidation device and method of fabricating optical waveguide substrate by the device
09/26/2001EP1136596A1 Silicon wafer and its method of fabrication
09/26/2001EP1136592A2 Method and apparatus for removal of unwanted electroplating deposits
09/26/2001EP1136590A2 Apparatus and method for controlling the temperature of a wall of a reaction chamber
09/26/2001EP1136589A1 CVD apparatus having movable gas inlet
09/26/2001EP1136588A2 MOCVD method of tantalum oxide film
09/26/2001EP1135846A1 Displacement device
09/26/2001EP1135810A1 Indirect laser patterning of resist
09/26/2001EP1135803A1 Interlayer between titanium nitride and high density plasma oxide
09/26/2001EP1135802A1 Three-dimensional packaging technology for multi-layered integrated circuits
09/26/2001EP1135801A1 Dram cell having an annular signal transfer region
09/26/2001EP1135800A1 Manufacture of an integrated circuit isolation structure
09/26/2001EP1135798A2 Method of making shallow junction semiconductor devices
09/26/2001EP1135797A1 Textured bi-based oxide ceramic films
09/26/2001EP1135796A1 Process for forming a sion/teos interlevel dielectric with after-treatment of the cvd silicium oxynitride layer
09/26/2001EP1135795A2 Specimen holding robotic arm end effector
09/26/2001EP1135794A1 A method and apparatus for the transport and tracking of an electronic component
09/26/2001EP1135793A2 Apparatus for storing and moving a cassette
09/26/2001EP1135789A2 Microfabricated template for multiple charged particle beam calibrations and shielded charged particle beam lithography
09/26/2001EP1135777A1 Particles
09/26/2001EP1135713A1 Composition and method for removing probing ink and negative photoresist from silicon wafers
09/26/2001EP1135693A1 Probe card for probing wafers with raised contact elements
09/26/2001EP1135692A1 Method and arrangement for dielectric integrity testing
09/26/2001EP1135690A2 Lithographic contact elements
09/26/2001EP1135659A1 Apparatus and method for thermal processing of semiconductor substrates
09/26/2001EP1135545A1 Removing oxides or other reducible contaminants from a substrate by plasma treatment
09/26/2001EP1135236A1 Reverse linear polisher with loadable housing
09/26/2001EP1029340A4 Apparatus and method for secondary electron emission microscope
09/26/2001EP0943127B1 Method for testing and for generating a mapping for an electronic device
09/26/2001EP0934127B1 Process for making a parylene coating
09/26/2001EP0916138B1 Method of operating a storage cell arrangement
09/26/2001EP0902962B1 Apparatus for plasma jet treatment of substrates
09/26/2001EP0897593B1 Device and process for treating substrates in a fluid container
09/26/2001EP0847059B1 Semiconductor memory
09/26/2001EP0763256B1 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE WITH BiCMOS CIRCUIT
09/26/2001EP0754289B1 Measurement of AFM cantilever deflection with high frequency radiation and dopant profiler