| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 09/25/2001 | US6293713 Substrate processing apparatus |
| 09/25/2001 | US6293696 System and process for calibrating pyrometers in thermal processing chambers |
| 09/25/2001 | US6293457 Integrated method for etching of BLM titanium-tungsten alloys for CMOS devices with copper metallization |
| 09/25/2001 | US6293456 Methods for forming solder balls on substrates |
| 09/25/2001 | US6293408 Inspection handler apparatus and method |
| 09/25/2001 | US6293386 Leadframe transport and method therefor |
| 09/25/2001 | US6293317 Method and device for the application of a liquid substance |
| 09/25/2001 | US6293310 Gas panel |
| 09/25/2001 | US6293291 Method and apparatus for the treatment of objects, preferably wafers |
| 09/25/2001 | US6293288 Cleaning method and apparatus |
| 09/25/2001 | US6293139 Method of determining performance characteristics of polishing pads |
| 09/25/2001 | US6293137 Hydrogen sensor |
| 09/25/2001 | US6292972 Scrub washing apparatus and scrub washing method |
| 09/20/2001 | WO2001069991A1 Method of manufacturing multilayer ceramic substrate, and conductor paste |
| 09/20/2001 | WO2001069989A1 Packaging structure and method |
| 09/20/2001 | WO2001069686A1 Bar-type field effect transistor and method for the production thereof |
| 09/20/2001 | WO2001069685A2 Trench-gate semiconductor devices |
| 09/20/2001 | WO2001069679A1 Vertical electrical interconnections in a stack |
| 09/20/2001 | WO2001069676A2 Method and apparatus for bonding substrates |
| 09/20/2001 | WO2001069673A1 Flash memory device and method for manufacturing the same, and method for forming dielectric film |
| 09/20/2001 | WO2001069672A1 A method of manufacturing a semiconductor device |
| 09/20/2001 | WO2001069671A1 Method for adjusting an electrical parameter on an integrated electronic component |
| 09/20/2001 | WO2001069670A1 Module with built-in electronic elements and method of manufacture thereof |
| 09/20/2001 | WO2001069669A1 Method and device for producing a semiconductor chip covering |
| 09/20/2001 | WO2001069668A1 Method of manufacturing source/drain regions having a deep junction |
| 09/20/2001 | WO2001069667A1 Method for producing electrical connections in a semiconductor component |
| 09/20/2001 | WO2001069666A1 Method for manufacturing silicon mirror wafer, silicon mirror wafer, and heat treatment furnace |
| 09/20/2001 | WO2001069665A1 Method for forming dielectric film |
| 09/20/2001 | WO2001069664A2 Forming microscale structures from polycrystalline materials |
| 09/20/2001 | WO2001069663A1 Production method of iii nitride compound semiconductor and iii nitride compound semiconductor element |
| 09/20/2001 | WO2001069662A1 Group iii nitride compound semiconductor and method for manufacturing the same |
| 09/20/2001 | WO2001069661A1 Laser exposure device |
| 09/20/2001 | WO2001069660A2 Method and apparatus for supporting a substrate |
| 09/20/2001 | WO2001069659A2 Fabrication of semiconductor materials and devices with controlled electrical conductivity |
| 09/20/2001 | WO2001069658A2 One-time programmable anti-fuse element and method |
| 09/20/2001 | WO2001069656A2 Localized heating and cooling of substrates |
| 09/20/2001 | WO2001069655A2 Spin transistor |
| 09/20/2001 | WO2001069654A2 Semiconductor device with light shield and corresponding etching method |
| 09/20/2001 | WO2001069652A2 Method for uncovering a contact surface |
| 09/20/2001 | WO2001069642A2 Plasma deposition method and system |
| 09/20/2001 | WO2001069607A2 Memory cell, method of formation, and operation |
| 09/20/2001 | WO2001069604A2 Automated reference cell trimming verify |
| 09/20/2001 | WO2001069459A2 Standard block architecture for integrated circuit design |
| 09/20/2001 | WO2001069336A1 Touch calibration system for wafer transfer robot |
| 09/20/2001 | WO2001069299A1 Ultra-high resolution imaging devices |
| 09/20/2001 | WO2001069205A1 Beam delivery and imaging for optical probing of a device operating under electrical test |
| 09/20/2001 | WO2001069152A1 Processing machine with lockdown rotor |
| 09/20/2001 | WO2001069131A2 Chamber cleaning mechanism |
| 09/20/2001 | WO2001068955A1 Iii-v nitride substrate boule and method of making and using the same |
| 09/20/2001 | WO2001068954A2 Axial gradient transport apparatus and process |
| 09/20/2001 | WO2001068941A1 Method and implementing device for a chemical reaction |
| 09/20/2001 | WO2001068939A2 Magnetically enhanced plasma etch process using a heavy fluorocarbon etching gas |
| 09/20/2001 | WO2001068938A1 Method and apparatus for repairing lithography masks using a charged particle beam system |
| 09/20/2001 | WO2001068934A1 Method and apparatus for performing high pressure physical vapor deposition |
| 09/20/2001 | WO2001068575A1 Fluoroalkylonium salt type cation or acid generator generating cation or acid upon irradiation with energy ray |
| 09/20/2001 | WO2001068551A1 Ceramic substrate |
| 09/20/2001 | WO2001068513A1 Method for precisely machining microstructure |
| 09/20/2001 | WO2001068489A1 Automated feed mechanism for electronic components of silicon wafer |
| 09/20/2001 | WO2001068322A1 Window portion with an adjusted rate of wear |
| 09/20/2001 | WO2001068321A1 Polishing head for wafer, and method for polishing |
| 09/20/2001 | WO2001068311A1 Flip chip interconnection structure |
| 09/20/2001 | WO2001068304A2 Flip chip-in-leadframe package and process |
| 09/20/2001 | WO2001068277A1 Processes and apparatus for treating electronic components |
| 09/20/2001 | WO2001068271A1 Controlling surface chemistry on solid substrates |
| 09/20/2001 | WO2001068224A1 Method and device for processing pfc |
| 09/20/2001 | WO2001050525A8 Integrated circuit die having bond pads near adjacent sides to allow stacking of dice without regard to dice size |
| 09/20/2001 | WO2001033610A3 Unit for processing wafers |
| 09/20/2001 | WO2001020644A3 Method and apparatus for encapsulating semiconductor chips |
| 09/20/2001 | WO2001018603A3 Polymer for chemically amplified resist and a resist composition using the same |
| 09/20/2001 | WO2001016998A3 Ultra high resolution lithographic imaging and printing and defect reduction by exposure near the critical condition |
| 09/20/2001 | WO2001011930A9 A cleaving process to fabricate multilayered substrates using low implantation doses |
| 09/20/2001 | WO2000049650A9 Iridium etching methods for anisotrophic profile |
| 09/20/2001 | WO2000003421A8 Improved endpoint detection for substrate fabrication processes |
| 09/20/2001 | WO1999056305A3 Method of forming high aspect ratio apertures |
| 09/20/2001 | US20010023377 Distributed control system architecture and method for a material transport system |
| 09/20/2001 | US20010023264 UV-curable pressure-sensitive adhesive composition and its pressure-sensitive adhesive sheet |
| 09/20/2001 | US20010023255 Phosphonooxymethyl ethers of taxane derivatives |
| 09/20/2001 | US20010023167 Polishing apparatus |
| 09/20/2001 | US20010023166 Wafer carrier rinsing mechanism |
| 09/20/2001 | US20010023139 Center bond flip chip semiconductor carrier and a method of making and using it |
| 09/20/2001 | US20010023137 Repairing photolithographic exposure masks by etching, extending over a length and a width equal of line pattern; repair accuracy |
| 09/20/2001 | US20010023136 Method for fabricating gate oxide film of semiconductor device |
| 09/20/2001 | US20010023135 Rapid thermal etch and rapid thermal oxidation |
| 09/20/2001 | US20010023134 Method of manufacturing a semiconductor device including a seamless shallow trench isolation step |
| 09/20/2001 | US20010023133 Double recessed transistor |
| 09/20/2001 | US20010023132 Method for controlling critical dimension of contact opening |
| 09/20/2001 | US20010023131 Semiconductor processing methods of forming a contact opening |
| 09/20/2001 | US20010023129 Semiconductor device and method for providing a contact hole formed in an insulating film |
| 09/20/2001 | US20010023128 Semiconductor device having multilevel interconnection structure and method for fabricating the same |
| 09/20/2001 | US20010023127 Methods and solutions for cleaning polished aluminum-containing layers, methods for making metallization structures, and the structures resulting from these methods |
| 09/20/2001 | US20010023126 Spraying tetraethoxysilane and hydrogen peroxide |
| 09/20/2001 | US20010023125 Stress adjustment insulating film |
| 09/20/2001 | US20010023124 Semiconductor device with ohmic contact-connection and method for the ohmic contact-connection of a semiconductor device |
| 09/20/2001 | US20010023123 Method for forming semiconductor device having low parasite capacitance using air gap and self-aligned contact plug |
| 09/20/2001 | US20010023122 Semiconductor device and method for manufacturing the same |
| 09/20/2001 | US20010023121 Semiconductor device method of manufacturing same |
| 09/20/2001 | US20010023120 Semiconductor device having a gate insulating film structure including an insulating film containing metal, silicon and oxygen and manufacturing method thereof |
| 09/20/2001 | US20010023118 Customization of an integrated circuit in packaged form |
| 09/20/2001 | US20010023117 Methods of treating surfaces of substrates |
| 09/20/2001 | US20010023116 Method for setting the threshold voltage of a MOS transistor |