| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 09/27/2001 | WO2001071795A2 Method for forming high quality multiple thickness oxide layers by reducing descum induced defects |
| 09/27/2001 | WO2001071794A1 REPAIR OF FILM HAVING AN Si-O BACKBONE |
| 09/27/2001 | WO2001071793A2 Method for forming high quality multiple thickness oxide layers by using high temperature descum |
| 09/27/2001 | WO2001071792A1 Method for polishing using a sulfur-containing stop layer |
| 09/27/2001 | WO2001071791A1 Surface planarization of thin silicon films during and after processing by the sequential lateral solidification method |
| 09/27/2001 | WO2001071789A1 Semiconductor wafer cleaning agent and cleaning method |
| 09/27/2001 | WO2001071788A1 Water for storing silicon wafers and storing method |
| 09/27/2001 | WO2001071787A1 Method of forming ultrashallow junctions by laser annealing and rapid thermal annealing |
| 09/27/2001 | WO2001071786A1 Method and system for providing a continuous motion sequential lateral solidification |
| 09/27/2001 | WO2001071784A1 Method of manufacturing semiconductor and manufacturing apparatus |
| 09/27/2001 | WO2001071783A1 Method of manufacturing a transistor |
| 09/27/2001 | WO2001071781A2 Combination differential and absolute pressure transducer for load lock control |
| 09/27/2001 | WO2001071779A2 Method and apparatus for planarizing a semiconductor contactor |
| 09/27/2001 | WO2001071777A2 Method of fabricating flux concentrating layer for use with magnetoresistive random access memories |
| 09/27/2001 | WO2001071776A2 Materials having low dielectric constants and methods of making |
| 09/27/2001 | WO2001071773A2 Method and device for connecting at least one chip to a rewiring arrangement |
| 09/27/2001 | WO2001071765A2 Plasma reactor with overhead rf electrode tuned to the plasma |
| 09/27/2001 | WO2001071735A1 Magnetic element with an improved magnetoresistance ratio |
| 09/27/2001 | WO2001071734A2 Multi-layer tunneling device with a graded stoichiometry insulating layer |
| 09/27/2001 | WO2001071730A1 Systems and methods to reduce grinding marks and metallic contamination |
| 09/27/2001 | WO2001071429A1 Method and composition for removing sodium-containing material from microcircuit substrates |
| 09/27/2001 | WO2001071427A1 Photo-lithographic method for semiconductors |
| 09/27/2001 | WO2001071426A2 Apparatus for generating a laser pattern on a photomask and associated methods |
| 09/27/2001 | WO2001071425A2 Method for two dimensional adaptive process control of critical dimensions during spin coating process |
| 09/27/2001 | WO2001071422A1 Scanning framing blade apparatus |
| 09/27/2001 | WO2001071323A1 Apparatus for detecting defect |
| 09/27/2001 | WO2001071069A1 Method for producing silicon single crystal having no flaw |
| 09/27/2001 | WO2001071066A1 Device providing electrical contact to the surface of a semiconductor workpiece during metal plating |
| 09/27/2001 | WO2001070873A2 Nanocylinder arrays |
| 09/27/2001 | WO2001070867A2 Flame retardant epoxy molding compositions |
| 09/27/2001 | WO2001070628A2 Plasma processing for porous silica thin film |
| 09/27/2001 | WO2001070605A1 Chuck transport method and system |
| 09/27/2001 | WO2001070517A1 High speed stripping for damaged photoresist |
| 09/27/2001 | WO2001070457A1 Grind polish cluster and double side polishing of substrates |
| 09/27/2001 | WO2001070454A1 Cluster tool systems and methods for processing wafers |
| 09/27/2001 | WO2001070438A1 Device for monitoring and calibrating oxide charge measurement equipment and method therefor |
| 09/27/2001 | WO2001070435A1 Ultra fine composite metal particles |
| 09/27/2001 | WO2001070366A1 Deaerator and deaerating method |
| 09/27/2001 | WO2001035006A3 Metal-infiltrated ceramic seal |
| 09/27/2001 | WO2001033611A3 Machine for processing wafers |
| 09/27/2001 | WO2001033232A3 Precision stage |
| 09/27/2001 | WO2001031681A8 Method and apparatus for eliminating displacement current from current measurements in a plasma processing system |
| 09/27/2001 | WO2001029884A8 Apparatus for attaching resists and wafers to substrates |
| 09/27/2001 | WO2001025167A8 Process for cleaning ceramic articles |
| 09/27/2001 | WO2001017724A3 Ultrasonic transducer slurry dispenser |
| 09/27/2001 | WO2001009929A3 Method for etch rate enhancement by background oxygen control in a soft etch system |
| 09/27/2001 | WO2001006318A8 Phase shifter film and production method therefor |
| 09/27/2001 | WO2000079564A3 Plasma reactor with internal inductive antenna capable of generating helicon wave |
| 09/27/2001 | WO2000074110A3 Integrated circuit wafer probe card assembly |
| 09/27/2001 | WO2000041456A9 Optical detector with a filter layer made of porous silicon and method for the production thereof |
| 09/27/2001 | WO2000022203A3 Production of bulk single crystals of aluminum nitride, silicon carbide and aluminum nitride:silicon carbide alloy |
| 09/27/2001 | US20010025369 Block based design methodology |
| 09/27/2001 | US20010025368 System and method for H-Tree clocking layout |
| 09/27/2001 | US20010025367 Method for modeling diffusion of impurities in a semiconductor |
| 09/27/2001 | US20010025366 Circuit design apparatus, circuit design method, circuit design program, and semiconductor intergrated circuit fabrication method |
| 09/27/2001 | US20010025365 Semiconductor integrated circuit and wiring method |
| 09/27/2001 | US20010025364 Three-dimensional MCM, method for manufacturing the same, and storage medium storing data for the method |
| 09/27/2001 | US20010025355 Circuit configuration with deactivatable scan path |
| 09/27/2001 | US20010025233 Method of simulation of production process of semiconductor device and simulator thereof |
| 09/27/2001 | US20010025230 Electric Characteristic evaluating apparatus for a semiconductor device |
| 09/27/2001 | US20010025207 Vaccum processing apparatus and semiconductor manufacturing line using the same |
| 09/27/2001 | US20010025205 Construction of a film on a semiconductor wafer |
| 09/27/2001 | US20010025204 Vacuum processing apparatus and semiconductor manufacturing line using the same |
| 09/27/2001 | US20010025017 Cleaning agent composition, method for cleaning and use thereof |
| 09/27/2001 | US20010024939 Wafer polishing apparatus |
| 09/27/2001 | US20010024938 Wafer polishing apparatus |
| 09/27/2001 | US20010024937 Polishing apparatus |
| 09/27/2001 | US20010024936 Wafer surface machining apparatus |
| 09/27/2001 | US20010024935 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads |
| 09/27/2001 | US20010024933 Composition and method for polishing in metal CMP |
| 09/27/2001 | US20010024930 Method and apparatus for wireless transfer of chemical-mechanical planarization measurements |
| 09/27/2001 | US20010024929 Method and apparatus for wireless transfer of chemical-mechanical planarization measurements |
| 09/27/2001 | US20010024928 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives |
| 09/27/2001 | US20010024890 Contactor having LSI-circuit-side contact piece and test-board-side contact piece for testing semiconductor device and manufacturing method thereof |
| 09/27/2001 | US20010024886 Uniform dielectric layer and method to form same |
| 09/27/2001 | US20010024885 Substrate for semiconductor device and method of manufacturing the same |
| 09/27/2001 | US20010024884 Low threading dislocation density relaxed mismatched epilayers without high temperature growth |
| 09/27/2001 | US20010024882 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies |
| 09/27/2001 | US20010024881 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies |
| 09/27/2001 | US20010024880 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies |
| 09/27/2001 | US20010024879 Method for planarizing a semiconductor device using ceria-based slurry |
| 09/27/2001 | US20010024878 Flat soft magnetic powder with strain removed and binder which includes chlorinated polyethylene and a vinyl chloride resin; electromagnetic interference supression; reducing permeability of radiation noise |
| 09/27/2001 | US20010024877 Cluster tool systems and methods for processing wafers |
| 09/27/2001 | US20010024876 Fabrication process of semiconductor substrate |
| 09/27/2001 | US20010024875 Method for patterning semiconductor devices on a silicon substrate using oxynitride film |
| 09/27/2001 | US20010024874 Manufacture of a semiconductor device |
| 09/27/2001 | US20010024873 Method for fabricating semiconductor components |
| 09/27/2001 | US20010024872 Semiconductor integrated circuit device and manufacturing method of that |
| 09/27/2001 | US20010024871 Semiconductor device and method and apparatus for manufacturing semiconductor device |
| 09/27/2001 | US20010024870 Fabrication process of a semiconductor integrated circuit device |
| 09/27/2001 | US20010024869 Selective silicon formation for semiconductor devices |
| 09/27/2001 | US20010024868 Microelectronic structure and method of fabricating it |
| 09/27/2001 | US20010024867 Semiconductor device and method of manufacturing the same |
| 09/27/2001 | US20010024866 Method of manufacturing a transistor |
| 09/27/2001 | US20010024864 Method and structure for reducing leakage currents of active area diodes and source/drain diffusions |
| 09/27/2001 | US20010024863 Silicon-on-insulator chip having an isolation barrier for reliability |
| 09/27/2001 | US20010024862 Method for forming a lower electrode by using an electroplating method |
| 09/27/2001 | US20010024861 Method for manufacturing electronic devices having HV transistors and LV transistors with salicided junctions |
| 09/27/2001 | US20010024860 Method for manufacturing a gate structure incorporating therein aluminum oxide as a gate dielectric |
| 09/27/2001 | US20010024859 Semiconductor integrated circuit device and a method of manufacturing thereof |