Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2001
12/13/2001US20010051214 Includes two manifolds capable of separating, so it is easy to separate the second manifold supporting the inner tube from the first manifold supporting the outer tube; inner tube can be exchanged without cooling for cleaning
12/13/2001US20010051211 Manufacturing method and plating apparatus for film carrier tape
12/13/2001US20010051128 Bubbling pure ammonia and hydrogen fluoride
12/13/2001US20010051092 Conveyor apparatus for dies and small components
12/13/2001US20010051088 Wafer storage equipment and transfer apparatus thereof having a sensor for detecting state of a wafer transfer arm
12/13/2001US20010051087 Wafer positioning device with storage capability
12/13/2001US20010051086 Automated feed mechanism for electronic components of silicon wafer
12/13/2001US20010051082 Cost effective modular-linear wafer processing
12/13/2001US20010051081 Processes for vacuum treating workpieces, and corresponding process equipment
12/13/2001US20010051029 Three-dimensional mounted assembly, method of manufacturing the same, and optical transmission device
12/13/2001US20010051000 Pattern recognition method
12/13/2001US20010050869 Ferroelectric capacitor array and method for manufacturing ferroelectric memory
12/13/2001US20010050861 Nonvolatile semiconductor storage device and test method therefor
12/13/2001US20010050859 Memory cell array and method for manufacturing it
12/13/2001US20010050846 Reel-deployed printed circuit board and method for manufacturing chip-on-board packages
12/13/2001US20010050836 Electrostatic chuck for ion injector
12/13/2001US20010050835 Surge protection circuit for semiconductor devices
12/13/2001US20010050799 Electro-optical device, method for making the same, and electronic apparatus
12/13/2001US20010050769 Illuminance measurement apparatus and exposure apparatus
12/13/2001US20010050762 Fluorescence radiation filter
12/13/2001US20010050761 Exposure method and exposure apparatus
12/13/2001US20010050743 Method of manufacturing an array substrate for liquid crystal display
12/13/2001US20010050730 Defect correcting method for liquid crystal panel
12/13/2001US20010050607 Integrated transformer
12/13/2001US20010050597 Oscillating circuit
12/13/2001US20010050590 Semiconductor integrated circuit device having circuit generating reference voltage
12/13/2001US20010050578 Semiconductor apparatus
12/13/2001US20010050570 Method of forming an apparatus configured to engage an electrically conductive pad on a semiconductive substrate and a method of engaging electrically conductive pads on a semiconductive substrate
12/13/2001US20010050565 Multi-point probe
12/13/2001US20010050560 Method for polysilicon crystalline line width measurement post etch in undoped-poly process
12/13/2001US20010050549 Switch mode power supply with reduced switching losses
12/13/2001US20010050442 Three-dimensional flash memory structure and fabrication method thereof
12/13/2001US20010050441 Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance
12/13/2001US20010050440 Semiconductor device having an improved interlayer conductor connections and a manufacturing method thereof
12/13/2001US20010050439 Surface modified interconnects
12/13/2001US20010050438 Methods of forming materials between conductive electrical components, and insulating materials
12/13/2001US20010050437 Semiconductor device and method of manufacturing the same
12/13/2001US20010050436 Semiconductor device having capacitor and method thereof
12/13/2001US20010050435 In situ plasma pre-deposition wafer treatment in chemical vapor deposition technology for semiconductor integrated circuit applications
12/13/2001US20010050432 Flip chip technique for chip assembly
12/13/2001US20010050431 Semiconductor device and liquid crystal module adopting the same
12/13/2001US20010050428 Semiconductor device and a method of manufacturing the same
12/13/2001US20010050426 LSI package and internal connecting method used therefor
12/13/2001US20010050425 Flexible sheet bonded in tension on a rigid frame so that the sheet spans an aperture in the frame; frame and sheet have different coefficients of thermal expansion; use making microelectronics
12/13/2001US20010050423 Semiconductor device
12/13/2001US20010050422 Semiconductor device and a method of manufacturing the same
12/13/2001US20010050418 Semiconductor device with semiconductor chip on flexible tape
12/13/2001US20010050415 Adjustable threshold isolation transistor
12/13/2001US20010050414 Semiconductor device and method of making same
12/13/2001US20010050413 Method of controlling striations and CD loss in contact oxide etch
12/13/2001US20010050411 Semiconductor integrated circuit
12/13/2001US20010050410 High sheet MOS resistor method and apparatus
12/13/2001US20010050409 MIM capacitor having reduced capacitance error and phase rotation
12/13/2001US20010050408 Integrated high-performance decoupling capacitor and heat sink
12/13/2001US20010050406 Fuse programming circuit for programming fuses
12/13/2001US20010050405 Method of manufacturing a rom device that includes ion implantation through an insulating layer
12/13/2001US20010050402 Photoelectric converter, its driving method, and system including the photoelectric converter
12/13/2001US20010050401 Insulated gate field effect semiconductor device and forming method thereof
12/13/2001US20010050400 Method and system for reducing short channel effects in a memory device formed using a self-aligned source
12/13/2001US20010050399 Semiconductor integrated circuit device
12/13/2001US20010050397 Semiconductor device and method of manufacturing the same
12/13/2001US20010050396 Semiconductor device and method for fabricating the same
12/13/2001US20010050395 Semiconductor device and method for fabricating the same
12/13/2001US20010050393 GaAs MOSFET having low capacitance and on-resistance and method of manufacturing the same
12/13/2001US20010050392 Semiconductor device and method for fabricating the same
12/13/2001US20010050391 Liquid chemical vapor deposition source material including at least one organometallic compound of platinum group metal dissolved in tetrahydrofuran and having moisture content of not more than 200 ppm
12/13/2001US20010050390 Semiconductor device, and method of manufacturing the semiconductor device
12/13/2001US20010050389 Semiconductor device with adhesion-improvement capacitor and process for producing the device
12/13/2001US20010050388 A dynamic-type semiconductor memory device
12/13/2001US20010050387 Semiconductor non-volatile memory device and corresponding fabrication process
12/13/2001US20010050386 Semiconductor integrated circuit device and the process of manufacturing the same
12/13/2001US20010050385 Method for simultaneously forming a storage-capacitor electrode and interconnect
12/13/2001US20010050384 Devices having improved capacitance and methods of their fabrication
12/13/2001US20010050382 Retrograde well structure for a CMOS imager
12/13/2001US20010050381 Semiconductor apparatus and manufacturing method therefor
12/13/2001US20010050380 Semiconductor memory device
12/13/2001US20010050378 Semiconductor memory
12/13/2001US20010050369 Edge termination for silicon power devices
12/13/2001US20010050368 Liquid crystal display device array substrate and method of manufacturing the same
12/13/2001US20010050365 Thin-film transistor and semiconductor device using thin-film transistors
12/13/2001US20010050364 Semiconductor device and manufacturing method thereof
12/13/2001US20010050363 Semiconductor device and manufacturing method thereof
12/13/2001US20010050350 Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
12/13/2001US20010050349 Removal (oxy)nitride from surface of silicide semiconductor
12/13/2001US20010050343 Apparatus using charged particle beam
12/13/2001US20010050341 Positioning system for use in lithographic apparatus
12/13/2001US20010050303 Method for chemically reworking metal layers on integrated circuit bond pads
12/13/2001US20010050294 Adhesive dispensing and vision system for an automatic assembly system
12/13/2001US20010050272 Laser removal of foreign materials from surfaces
12/13/2001US20010050268 Polishing pad of a polyurethane of propane diol
12/13/2001US20010050265 Reduction of metal oxide in a dual frequency etch chamber
12/13/2001US20010050226 Integrated copper fill process
12/13/2001US20010050223 Sputtering target having an annular vault
12/13/2001US20010050220 Using ionization metal plasma
12/13/2001US20010050180 Method for preparing side attach pad traces through buried conductive material
12/13/2001US20010050147 Plasma etching system
12/13/2001US20010050146 Substrate processing apparatus and substrate processing method
12/13/2001US20010050145 Etch/strip apparatus integrated with cleaning equipment
12/13/2001US20010050144 Plasma processing apparatus
12/13/2001US20010050143 Method and apparatus for semiconductor wafer process monitoring