Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2001
12/18/2001US6331480 Method to improve adhesion between an overlying oxide hard mask and an underlying low dielectric constant material
12/18/2001US6331479 Method to prevent degradation of low dielectric constant material in copper damascene interconnects
12/18/2001US6331478 Methods for manufacturing semiconductor devices having chamfered metal silicide layers
12/18/2001US6331477 Doping of spherical semiconductors during non-contact processing in the liquid state
12/18/2001US6331476 Thin film transistor and producing method thereof
12/18/2001US6331475 Method and manufacturing semiconductor device
12/18/2001US6331474 Defect compensation method for semiconductor element
12/18/2001US6331473 SOI substrate, method for making the same, semiconductive device and liquid crystal panel using the same
12/18/2001US6331472 Method for forming shallow trench isolation
12/18/2001US6331471 Method for improving peeling issues during fabrication of integrated circuits
12/18/2001US6331470 Process for manufacturing a semiconductor material wafer having power regions dielectrically insulated from circuitry regions
12/18/2001US6331469 Trench isolation structure, semiconductor device having the same, and trench isolation method
12/18/2001US6331468 Formation of integrated circuit structure using one or more silicon layers for implantation and out-diffusion in formation of defect-free source/drain regions and also for subsequent formation of silicon nitride spacers
12/18/2001US6331467 Method of manufacturing a trench gate field effect semiconductor device
12/18/2001US6331466 Insulated gate semiconductor device and manufacturing method thereof
12/18/2001US6331465 Alternate method and structure for improved floating gate tunneling devices using textured surface
12/18/2001US6331464 Method of fabricating a flash memory
12/18/2001US6331463 Method for manufacturing low power high efficiency non-volatile erasable programmable memory cell structure
12/18/2001US6331462 Manufacturing method of a semiconductor device for desired circuit patterns
12/18/2001US6331461 Semiconductor processing methods of forming devices on a substrate, forming device arrays on a substrate, forming conductive lines on a substrate, and forming capacitor arrays on a substrate, and integrated circuitry
12/18/2001US6331460 Method of fabricating a mom capacitor having a metal silicide barrier
12/18/2001US6331459 Use of dummy poly spacers and divot fill techniques for DT-aligned processing after STI formation for advanced deep trench capacitor DRAM
12/18/2001US6331458 Active region implant methodology using indium to enhance short channel performance of a surface channel PMOS device
12/18/2001US6331457 Method for manufacturing a semiconductor thin film
12/18/2001US6331456 Fipos method of forming SOI CMOS structure
12/18/2001US6331455 Power rectifier device and method of fabricating power rectifier devices
12/18/2001US6331453 Method for fabricating semiconductor packages using mold tooling fixture with flash control cavities
12/18/2001US6331451 Methods of making thin integrated circuit device packages with improved thermal performance and substrates for making the packages
12/18/2001US6331450 Method of manufacturing semiconductor device using group III nitride compound
12/18/2001US6331449 Method of forming a dicing area of a semicondutor substrate
12/18/2001US6331447 High density flip chip BGA
12/18/2001US6331446 Process for underfilling a controlled collapse chip connection (C4) integrated circuit package with an underfill material that is heated to a partial gel state
12/18/2001US6331445 Phototonic device with strain-induced three dimensional growth morphology
12/18/2001US6331443 Method for manufacturing a liquid crystal display
12/18/2001US6331442 Pre-patterned contact fill capacitor for dielectric etch protection
12/18/2001US6331383 Exposure of photosensitive material having photoacid generator and ph indicator to ultraviolet radiation; colorimetric analysis; masking, development
12/18/2001US6331380 Etching polymer layer with hydrogen/nitrogen-based plasma or damascene layers with metal fill layer; oxygen- and halogen-free
12/18/2001US6331379 Photo-lithography process using multiple anti-reflective coatings
12/18/2001US6331377 Method for fabricating semiconductor device
12/18/2001US6331376 For use in the preparation of a printed circuit boards
12/18/2001US6331368 Test object for use in detecting aberrations of an optical imaging system
12/18/2001US6331356 Polyparaphenylene vinylenes, polyparaphenylenes, polyanilines, polythiophenes, polyazines, polyfuranes, polypyrroles, polyselenophenes, poly-p-phenylene sulfides, polyacetylenes, and blends
12/18/2001US6331347 Method for forming a gold plating electrode a substrate based on the electrode forming method, and a wire bonding method utilizing this electrode forming method
12/18/2001US6331325 Barium strontium titanate (BST) thin films using boron
12/18/2001US6331274 Advanced active circuits and devices for molecular biological analysis and diagnostics
12/18/2001US6331238 Method of patterning a substrate with an atomic mask
12/18/2001US6331234 Copper sputtering target assembly and method of making same
12/18/2001US6331227 Enhanced etching/smoothing of dielectric surfaces
12/18/2001US6331226 Using an adhesive prepared by adding a polycarbodiimide resin with an epoxy resin; excellent adhesion and heat resistance; liquid crystalline polymer
12/18/2001US6331213 Brush alignment method
12/18/2001US6331212 Methods and apparatus for thermally processing wafers
12/18/2001US6331208 Process for producing solar cell, process for producing thin-film semiconductor, process for separating thin-film semiconductor, and process for forming semiconductor
12/18/2001US6331135 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives
12/18/2001US6331119 Conductive adhesive having a palladium matrix interface between two metal surfaces
12/18/2001US6331095 Transportation system and processing apparatus employing the transportation system
12/18/2001US6331023 Gridded substrate transport spatula
12/18/2001US6330971 Radio frequency identification system and method for tracking silicon wafers
12/18/2001US6330967 Process to produce a high temperature interconnection
12/18/2001US6330756 Vacuum processing apparatus and operating method therefor
12/18/2001US6330755 Vacuum processing and operating method
12/18/2001US6330729 Brush alignment platform
12/18/2001US6330728 Brush scrubbing apparatus
12/13/2001WO2001095690A1 Method of making electronic materials
12/13/2001WO2001095681A1 Method for producing ceramic substrate
12/13/2001WO2001095398A1 Power mosfet and method of making the same
12/13/2001WO2001095397A1 Lateral semiconductor device with low on-resistance and method of making the same
12/13/2001WO2001095396A2 Double-implant high performance varactor and method for manufacturing same
12/13/2001WO2001095394A1 Method for producing input/output permutation of several conductive strips with parallel branches of an integrated circuit and resulting circuit
12/13/2001WO2001095392A1 Damascene architecture electronic storage and method for making same
12/13/2001WO2001095391A1 Self-limiting polysilicon buffered locos for dram trench capacitor collar
12/13/2001WO2001095390A1 Semiconductor device and method of manufacturing the device
12/13/2001WO2001095389A2 Shielding of analog circuits on semiconductor substrates
12/13/2001WO2001095388A1 Supporting container and semiconductor manufacturing and inspecting device
12/13/2001WO2001095387A2 Packaging tools and method for semiconductor carrier tape
12/13/2001WO2001095386A2 Apparatus and method for correcting warp of semiconductor carrier tape
12/13/2001WO2001095385A1 Method of making a power mosfet
12/13/2001WO2001095384A1 A method of electronic component fabrication and an electronic component
12/13/2001WO2001095383A1 Method for making an electronic component with self-aligned drain and gate, in damascene architecture
12/13/2001WO2001095382A2 Diamond as a polish-stop layer for chemical-mechanical planarization in a damascene process flow
12/13/2001WO2001095381A2 Post chemical-mechanical planarization (cmp) cleaning composition
12/13/2001WO2001095380A1 Preparation method of a coating of gallium nitride
12/13/2001WO2001095379A1 Hot plate unit
12/13/2001WO2001095378A2 Methods for forming and integrated circuit structures containing ruthenium and tungsten containing layers
12/13/2001WO2001095377A2 Methods for forming and integrated circuit structures containing enhanced-surface-area conductive layers
12/13/2001WO2001095376A2 Methods for forming rough ruthenium-containing layers and structures/methods using same
12/13/2001WO2001095375A1 An electro-fluidic assembly process for integration of electronic devices onto a substrate
12/13/2001WO2001095374A2 Slip resistant horizontal semiconductor wafer boat
12/13/2001WO2001095373A2 Silicon carbide cantilever paddle
12/13/2001WO2001095372A2 System and method for providing defect free rapid thermal processing
12/13/2001WO2001095371A2 Submicron semiconductor device having a self-aligned channel stop region and a method for fabricating the semiconductor device using a trim and etch
12/13/2001WO2001095369A2 Halo-free non-rectifying contact on chip with halo source/drain diffusion
12/13/2001WO2001095365A1 Film thickness measurement using electron-beam induced x-ray microanalysis
12/13/2001WO2001095364A1 Electron beam generator and method of electron beam irradiation
12/13/2001WO2001095363A1 Method and apparatus for controlling ion implantation during vacuum fluctuation
12/13/2001WO2001095362A1 Plasma focus light source with active and buffer gas control
12/13/2001WO2001095352A2 Apparatus and method for accelerating electrons in a plasma reactor
12/13/2001WO2001095034A1 Photosensitive composition for making photoresist
12/13/2001WO2001095029A1 Substrate selector
12/13/2001WO2001094927A1 Method and apparatus for measuring electron injection energy barrier at interface between metal and organic material
12/13/2001WO2001094656A2 Plating apparatus with individually controllable anode segments and associated method