| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 12/20/2001 | US20010052618 Semiconductor device having a plurality of gate insulating films of different thicknesses, and method of manufacturing such semiconductor device |
| 12/20/2001 | US20010052617 Transistor and method of manufacturing the same |
| 12/20/2001 | US20010052616 Nonvolatile semiconductor storage apparatus and production method of the same |
| 12/20/2001 | US20010052615 Nonvolatile semiconductor memory device and process of production and write method thereof |
| 12/20/2001 | US20010052614 Semiconductor memory provided with vertical transistor and method of manufacturing the same |
| 12/20/2001 | US20010052613 Soi semiconductor device and method for manufacturing the same |
| 12/20/2001 | US20010052611 Merged memory and logic semiconductor device of salicided dual gate structure including embedded memory of self-aligned contact structure and manufacturing method thereof |
| 12/20/2001 | US20010052610 Reduced topography DRAM cell fabricated using a modified logic process and method for operating same |
| 12/20/2001 | US20010052609 Multilayer electrode for a ferroelectric capacitor |
| 12/20/2001 | US20010052608 Multilayer electrode for a ferroelectric capacitor |
| 12/20/2001 | US20010052607 Nonvolatile semiconductor memory |
| 12/20/2001 | US20010052599 Semiconductor memory device including plurality of global data lines in parallel arrangement with low parasitic capacitance, and fabrication method thereof |
| 12/20/2001 | US20010052596 Semiconducting devices and method of making thereof |
| 12/20/2001 | US20010052589 Electroluminescent phosphor powders, methods for making phosphor powders and devices incorporating same |
| 12/20/2001 | US20010052587 Chemical mechanical polishing slurry and method for polishing metal/oxide layers |
| 12/20/2001 | US20010052579 Charged-particle-beam microlithography apparatus and methods including optical corrections made during subfield exposures |
| 12/20/2001 | US20010052576 Electron optical system array, method of manufacturing the same, charged-particle beam exposture apparatus, and device manufacturing method |
| 12/20/2001 | US20010052573 Target mark member, method for manufacturing, and electron beam exposure apparatus thereof |
| 12/20/2001 | US20010052517 Thermal processing apparatus |
| 12/20/2001 | US20010052513 Apparatus for transforming semiconducting thin layer |
| 12/20/2001 | US20010052512 Method and subsystem for generating a trajectory to be followed by a motor-driven stage when processing microstructures at a laser- processing site |
| 12/20/2001 | US20010052467 Making thermally stable electromagnetic coil vanes, by photolithographically exposing high resolution, dense wire patterns in copper on both sides of ceramic substrate, plating additional copper and firing to eutectically bond |
| 12/20/2001 | US20010052466 Capacitor having electrode formed by electroplating and manufacturing method thereof |
| 12/20/2001 | US20010052465 Electrolyte cell configured to receive a substrate to have a metal film deposited thereon; a porous, rigid diffuser positioned between where the substrate is to be and the anode; uniform coating; pressure removes bubbles |
| 12/20/2001 | US20010052458 High frequency sputtering device |
| 12/20/2001 | US20010052457 Electroplating reactor including back-side electrical contact apparatus |
| 12/20/2001 | US20010052456 Self Ionized Plasma Sputtering |
| 12/20/2001 | US20010052455 Allows deposition of a uniform layer of pure titanium on a layer of formed titanium nitride, for example; RF energy is supplied to a coil to generate a plasma and a separate DC bias is applied to the coil to control sputtering rate |
| 12/20/2001 | US20010052409 Cooling/heating apparatus for semiconductor processing liquid |
| 12/20/2001 | US20010052393 Vacuum processing apparatus |
| 12/20/2001 | US20010052392 Multichamber substrate processing apparatus |
| 12/20/2001 | US20010052359 Method of substrate temperature control and method of assessing substrate temperature controllability |
| 12/20/2001 | US20010052354 Apparatus for processing substrate using process solutions having desired mixing ratios |
| 12/20/2001 | US20010052352 Method and device for treating substrates |
| 12/20/2001 | US20010052351 Acid zeta potential modifier, a pH adjuster, an etchant contamination remover and a corrosion inhibitor; aftertreatment of chemical mechanical polishing |
| 12/20/2001 | US20010052325 Substrate processing apparatus |
| 12/20/2001 | US20010052324 Device for producing and processing semiconductor substrates |
| 12/20/2001 | US20010052323 Method and apparatus for forming material layers from atomic gasses |
| 12/20/2001 | US20010052322 Plasma process device |
| 12/20/2001 | US20010052321 Single-substrate-processing apparatus for semiconductor |
| 12/20/2001 | US20010052319 Plasma processing apparatus and plasma processing method |
| 12/20/2001 | US20010052318 Apparatus for electroless plating a contact pad |
| 12/20/2001 | US20010052316 Apparatus for reduced-pressure epitaxial growth and method of controlling the apparatus |
| 12/20/2001 | US20010052278 Integrated circuit package separators |
| 12/20/2001 | US20010052159 Rotating belt wafer edge cleaning apparatus |
| 12/20/2001 | EP1145280A3 Vacuum compliant door hinge |
| 12/20/2001 | EP1145273A3 Low contamination high density plasma etch chambers and methods for making the same |
| 12/20/2001 | DE10129282A1 Integrated circuit modules connection method involves connecting interlocking edge, by aligning teeth and recesses of edge of integrated circuit with adjacent edge |
| 12/20/2001 | DE10128577A1 Semiconductor pressure sensor for e.g., as intake pressure sensor in vehicle engine intake, has semiconductor substrate, diaphragm portion, strain gauge, circuit portion, and local oxidation of silicon film |
| 12/20/2001 | DE10127231A1 Herstellungsverfahren eines Halbleitersubstrats Manufacturing method of a semiconductor substrate |
| 12/20/2001 | DE10125407A1 Verbesserte elektronische Sicherungen durch die lokale Verschlechterung der schmelzbaren Verbindung Improved electronic fuses by the local deterioration of the fusible link |
| 12/20/2001 | DE10120295A1 Vapor deposition apparatus for producing stacked layer structure, includes first and second run lines, vent lines, and line-switching mechanism |
| 12/20/2001 | DE10119049A1 Thermische Bearbeitungseinrichtung und thermisches Bearbeitungsverfahren Thermal processing device and thermal processing method |
| 12/20/2001 | DE10116791A1 "Verfahren zur Herstellung einer großen Anzahl von Halbleiterchip s aus einem Halbleiterwafer" "A process for producing a large number of semiconductor chip S from a semiconductor wafer" |
| 12/20/2001 | DE10064200A1 Nichtflüchtige Halbleiterspeichervorrichtung und integrierte Halbleiterschaltung A non-volatile semiconductor memory device and a semiconductor integrated circuit |
| 12/20/2001 | DE10064199A1 Halbleitervorrichtung Semiconductor device |
| 12/20/2001 | DE10063623A1 Semiconductor memory has select drive circuit which selectively drives dummy word line transistor, while operating in test mode |
| 12/20/2001 | DE10062232A1 Halbleitervorrichtung und Verfahren zu deren Herstellung Semiconductor device and process for their preparation |
| 12/20/2001 | DE10059773A1 Semiconductor device, esp. with pad-electrode structure e.g. MOS transistor, has plan-view shape of lower extending section of pad-electrode having predetermined shape |
| 12/20/2001 | DE10052889A1 Plasmabearbeitungseinrichtung und Plasmabearbeitungsverfahren für Substrate Plasma processing apparatus and plasma processing method for substrates |
| 12/20/2001 | DE10051140A1 Method of forming cylindrical elevations on surface of substrate for integrated circuits, involves filling openings formed in screening material with pure copper or with high-melting point metal by galvanizing |
| 12/20/2001 | DE10036140C1 Non-destructive read-out of MRAM memory cells involves normalizing actual cell resistance, comparing normalized and normal resistance values, detecting content from the result |
| 12/20/2001 | DE10029255A1 Mounting chips using flip-chip technology by subjecting wafer to pressure and heat to melt bumps and attach wafer |
| 12/20/2001 | DE10028424A1 DRAM-Speicherzelle für DRAM-Speichervorrichtung und deren Herstellungsverfahren DRAM memory cell for DRAM memory device and its manufacturing method |
| 12/20/2001 | DE10026924A1 Kompensationsbauelement Compensation component |
| 12/20/2001 | DE10026740A1 Semiconducting switch element with integral Schottky diode has first connection electrode electrically connected to first connection zone and to Schottky barrier in second connection zone |
| 12/20/2001 | DE10024710A1 Einstellung von Defektprofilen in Kristallen oder kristallähnlichen Strukturen Setting of defect profiles in crystals or crystal-like structures |
| 12/20/2001 | CA2408317A1 Encapsulation using microcellular foamed materials |
| 12/19/2001 | EP1164644A2 Plastic substrates with improved barrier properties for devices sensitive to water and/or oxygen |
| 12/19/2001 | EP1164642A2 Semiconductor memory |
| 12/19/2001 | EP1164641A2 Light emitting module and method of driving the same, and optical sensor |
| 12/19/2001 | EP1164639A2 Alignment marks for manufacturing semiconductor device |
| 12/19/2001 | EP1164638A2 Method of increasing the capacity of trench capacitors |
| 12/19/2001 | EP1164637A2 Method of making metallization and contact structures in an integrated circuit comprising an etch stop layer |
| 12/19/2001 | EP1164636A2 Method to form self aligned, L-shaped sidewall spacers |
| 12/19/2001 | EP1164635A2 Thin film transistors and semiconductor device |
| 12/19/2001 | EP1164634A2 Method of manufacturing a field effect transistor |
| 12/19/2001 | EP1164633A2 Method for etching an electrode in a semiconductor device |
| 12/19/2001 | EP1164632A2 Method of forming a fluoro-organosilicate layer on a substrate |
| 12/19/2001 | EP1164631A2 Process for forming openings in a layer |
| 12/19/2001 | EP1164630A2 Graded/stepped silicide process to improve MOS transistor |
| 12/19/2001 | EP1164629A1 Exposure apparatus, semiconductor device, and photomask |
| 12/19/2001 | EP1164628A2 Processing system and method |
| 12/19/2001 | EP1164595A1 Semiconductor device |
| 12/19/2001 | EP1164437A2 Lithographic system |
| 12/19/2001 | EP1164435A1 Photosensitive polysilazane composition and method of forming patterned polysilazane film |
| 12/19/2001 | EP1164434A2 Radiation-sensitive resin composition |
| 12/19/2001 | EP1164433A1 Radiation-sensitive resin composition |
| 12/19/2001 | EP1164432A1 Optical proximity correction method utilizing serifs having variable dimensions |
| 12/19/2001 | EP1164407A2 Illumination system and scanning exposure apparatus using the same |
| 12/19/2001 | EP1164381A2 Integrated circuit with a test fucntion and test arrangement for testing an integrated circuit |
| 12/19/2001 | EP1164351A2 Method and apparatus for measuring a bump on a substrate |
| 12/19/2001 | EP1164210A2 A method of growing a semiconductor layer |
| 12/19/2001 | EP1164209A2 Cathode cartridge of testing device for electroplating and testing device for electroplating |
| 12/19/2001 | EP1164208A2 Electroplating method using combination of vibrational flow in plating bath and plating current of pulse |
| 12/19/2001 | EP1164206A2 Chemical vapor deposition method for amorphous silicon and resulting film |
| 12/19/2001 | EP1163971A1 Electronic device and semiconductor device |
| 12/19/2001 | EP1163700A1 High-voltage transistor with multi-layer conduction region |
| 12/19/2001 | EP1163699A1 Virtual-ground, split-gate flash memory cell arrangements |
| 12/19/2001 | EP1163698A1 Iridium oxide diffusion barrier between local interconnect layer and thin film of layered superlattice material |