Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2001
12/25/2001US6333258 Method of manufacturing a semiconductor device
12/25/2001US6333257 Interconnection structure and method for forming the same
12/25/2001US6333256 Semiconductor processing method of forming openings in a material
12/25/2001US6333255 Method for making semiconductor device containing low carbon film for interconnect structures
12/25/2001US6333254 Methods of forming a local interconnect method of fabricating integrated circuitry comprising an SRAM cell having a local interconnect and having circuitry peripheral to the SRAM cell and method of forming contact plugs
12/25/2001US6333253 Pattern-block flux deposition
12/25/2001US6333252 Low-pin-count chip package and manufacturing method thereof
12/25/2001US6333251 Method of fabricating gate structure of semiconductor device for repairing damage to gate oxide layer
12/25/2001US6333250 Method of forming gate electrode in semiconductor device
12/25/2001US6333249 Method for fabricating a semiconductor device
12/25/2001US6333248 Method of fabricating a semiconductor device
12/25/2001US6333247 Two-step MOSFET gate formation for high-density devices
12/25/2001US6333246 Semiconductor device manufacturing method using electrostatic chuck and semiconductor device manufacturing system
12/25/2001US6333245 Method for introducing dopants into semiconductor devices using a germanium oxide sacrificial layer
12/25/2001US6333244 CMOS fabrication process with differential rapid thermal anneal scheme
12/25/2001US6333243 Forming layer of silicon nitride on substrate having openings; oxidizing substrate first oxidized layer; implanting oxygen into opening below first oxidized layer; oxidizing substrate to form layer of field oxide at opening
12/25/2001US6333242 Method of fabricating semiconductor device without having grooves at edge portions of STI
12/25/2001US6333241 Method for fabricating capacitor of semiconductor memory device
12/25/2001US6333240 Method of spacing a capacitor from a contact site
12/25/2001US6333239 Processes for reduced topography capacitors
12/25/2001US6333238 Method for minimizing the temperature coefficient of resistance of passive resistors in an integrated circuit process flow
12/25/2001US6333237 Method for manufacturing a semiconductor device
12/25/2001US6333236 Semiconductor device and method for manufacturing same
12/25/2001US6333235 Method for forming SiGe bipolar transistor
12/25/2001US6333233 Semiconductor device with self-aligned contact and its manufacture
12/25/2001US6333232 Semiconductor device and method of manufacturing the same
12/25/2001US6333231 Method for manufacturing semiconductor memory
12/25/2001US6333230 Scalable high-voltage devices
12/25/2001US6333229 Method for manufacturing a field effect transitor (FET) having mis-aligned-gate structure
12/25/2001US6333228 Method to improve the control of bird's beak profile of poly in split gate flash
12/25/2001US6333227 Methods of forming hemispherical grain silicon electrodes by crystallizing the necks thereof
12/25/2001US6333226 Method of manufacturing semiconductor memory device having a capacitor
12/25/2001US6333225 Integrated circuitry and methods of forming circuitry
12/25/2001US6333224 Method for fabricating an integrated circuit capacitor
12/25/2001US6333223 Semiconductor device and method of manufacturing the same
12/25/2001US6333222 Semiconductor device and manufacturing method thereof
12/25/2001US6333221 Method for improving planarization of an ILD layer
12/25/2001US6333220 Method and apparatus for providing low-GIDL dual workfunction gate doping with borderless diffusion contact
12/25/2001US6333219 Method for forming a polysilicon node in a semiconductor device
12/25/2001US6333218 Method of etching contacts with reduced oxide stress
12/25/2001US6333217 Method of forming MOSFET with channel, extension and pocket implants
12/25/2001US6333216 Method in the manufacturing of a semiconductor device
12/25/2001US6333215 Method for manufacturing a semiconductor device
12/25/2001US6333212 Semiconductor device and manufacturing method thereof
12/25/2001US6333211 Process for manufacturing a premold type semiconductor package using support pins in the mold and external connector bumps
12/25/2001US6333210 Process of ensuring detect free placement by solder coating on package pads
12/25/2001US6333209 One step method for curing and joining BGA solder balls
12/25/2001US6333208 Robust manufacturing method for making a III-V compound semiconductor device by misaligned wafer bonding
12/25/2001US6333207 Peelable lead structure and method of manufacture
12/25/2001US6333206 Process for the production of semiconductor device
12/25/2001US6333203 Method of forming a resist pattern
12/25/2001US6333202 Flip FERAM cell and method to form same
12/25/2001US6333201 Method for fabricating nonvolatile ferroelectric memory
12/25/2001US6333141 Positioning layer of dielectric material comprising decomposable polymer and an organic polysilica, heating to condense polysilica; decomposing polymer; lithographically patterning dielectric layer; depositing a metallic film
12/25/2001US6333138 Exposure method utilizing partial exposure stitch area
12/25/2001US6333136 Carrier film and process for producing the same
12/25/2001US6333130 Method and apparatus for correcting defects in photomask
12/25/2001US6333129 Light shield film pattern
12/25/2001US6333120 Plating copper underlayer which comprises layer of electroplated copper onto substrate; subjecting copper coated substrate to oxygen-containing gaseous ambient to roughen surface of copper; electroplating second layer of copper
12/25/2001US6333111 Method of producing layered aluminum fine particles and use thereof
12/25/2001US6333104 For coupling of integrated circuit chips to electronic cards using interconnections comprising conductive polymers
12/25/2001US6333079 Feeding material gas for film formation into reactor inside of which is kept evacuated; decomposing gas into plasma by using power having high frequency to form deposited film on substrate provided inside reactor
12/25/2001US6333066 Method for forming PZT thin film using seed layer
12/25/2001US6333003 Starting operation of removing unit, gathering air in process unit into removing unit; replenishing a new impurity remover; supplying to gas-liquid contact portion; stopping; discharging impurities; supplying biocide
12/25/2001US6332989 Slurry for chemical mechanical polishing of copper
12/25/2001US6332988 Terminal metal on semiconductor wafers with solder bump layers
12/25/2001US6332973 Using a circuit and filter for purification of baths, plating out copper from solution and circulation
12/25/2001US6332963 Cup-type plating apparatus and method for plating wafer using the same
12/25/2001US6332961 Device and method for detecting and preventing arcing in RF plasma systems
12/25/2001US6332947 Plasma processing apparatus and plasma processing method using the same
12/25/2001US6332946 Method for assembling a multi-layered ceramic package
12/25/2001US6332928 High throughput OMPVE apparatus
12/25/2001US6332927 Substrate processing apparatus
12/25/2001US6332924 Photoresist dispensing device
12/25/2001US6332898 Substrate processing apparatus and maintenance method therefor
12/25/2001US6332835 Polishing apparatus with transfer arm for moving polished object without drying it
12/25/2001US6332833 Method for fabricating silicon semiconductor discrete wafer
12/25/2001US6332832 CMP polish pad and CMP processing apparatus using the same
12/25/2001US6332830 Polishing method and polishing device
12/25/2001US6332786 Electrical connection device employing an anisotropic electrically conductive film
12/25/2001US6332766 Apparatus for encasing array packages
12/25/2001US6332744 Automatic warehouse and transfer system using the same
12/25/2001US6332724 Substrate processing apparatus
12/25/2001US6332723 Substrate processing apparatus and method
12/25/2001US6332661 Constant current driving apparatus and constant current driving semiconductor integrated circuit
12/25/2001US6332601 Liquid vaporizers for semiconductor processing systems
12/25/2001US6332569 Etched glass solder bump transfer for flip chip integrated circuit devices
12/25/2001US6332525 Vacuum chamber for flat substrates
12/25/2001US6332470 Aerosol substrate cleaner
12/25/2001US6332425 Surface treatment method and system
12/25/2001US6332280 Vacuum processing apparatus
12/25/2001US6332268 Method and apparatus for packaging IC chip, and tape-shaped carrier to be used therefor
12/25/2001CA2229423C Method of and device for measuring return losses in optical fibre components
12/25/2001CA2215691C Scanning lithography system having double pass wynne-dyson optics
12/23/2001CA2351285A1 Production of diaphragms
12/23/2001CA2351106A1 Power module with electronic power components and process for manufacturing such a module
12/22/2001CA2349771A1 Illumination system with spatially controllable partial coherence compensating for line width variances in a photolithographic system
12/20/2001WO2001097584A2 Encapsulation using microcellular foamed materials
12/20/2001WO2001097579A1 Method of mounting electronic part
12/20/2001WO2001097380A1 Apparatus and circuit having reduced leakage current and method therefor