Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
---|
12/25/2001 | US6333258 Method of manufacturing a semiconductor device |
12/25/2001 | US6333257 Interconnection structure and method for forming the same |
12/25/2001 | US6333256 Semiconductor processing method of forming openings in a material |
12/25/2001 | US6333255 Method for making semiconductor device containing low carbon film for interconnect structures |
12/25/2001 | US6333254 Methods of forming a local interconnect method of fabricating integrated circuitry comprising an SRAM cell having a local interconnect and having circuitry peripheral to the SRAM cell and method of forming contact plugs |
12/25/2001 | US6333253 Pattern-block flux deposition |
12/25/2001 | US6333252 Low-pin-count chip package and manufacturing method thereof |
12/25/2001 | US6333251 Method of fabricating gate structure of semiconductor device for repairing damage to gate oxide layer |
12/25/2001 | US6333250 Method of forming gate electrode in semiconductor device |
12/25/2001 | US6333249 Method for fabricating a semiconductor device |
12/25/2001 | US6333248 Method of fabricating a semiconductor device |
12/25/2001 | US6333247 Two-step MOSFET gate formation for high-density devices |
12/25/2001 | US6333246 Semiconductor device manufacturing method using electrostatic chuck and semiconductor device manufacturing system |
12/25/2001 | US6333245 Method for introducing dopants into semiconductor devices using a germanium oxide sacrificial layer |
12/25/2001 | US6333244 CMOS fabrication process with differential rapid thermal anneal scheme |
12/25/2001 | US6333243 Forming layer of silicon nitride on substrate having openings; oxidizing substrate first oxidized layer; implanting oxygen into opening below first oxidized layer; oxidizing substrate to form layer of field oxide at opening |
12/25/2001 | US6333242 Method of fabricating semiconductor device without having grooves at edge portions of STI |
12/25/2001 | US6333241 Method for fabricating capacitor of semiconductor memory device |
12/25/2001 | US6333240 Method of spacing a capacitor from a contact site |
12/25/2001 | US6333239 Processes for reduced topography capacitors |
12/25/2001 | US6333238 Method for minimizing the temperature coefficient of resistance of passive resistors in an integrated circuit process flow |
12/25/2001 | US6333237 Method for manufacturing a semiconductor device |
12/25/2001 | US6333236 Semiconductor device and method for manufacturing same |
12/25/2001 | US6333235 Method for forming SiGe bipolar transistor |
12/25/2001 | US6333233 Semiconductor device with self-aligned contact and its manufacture |
12/25/2001 | US6333232 Semiconductor device and method of manufacturing the same |
12/25/2001 | US6333231 Method for manufacturing semiconductor memory |
12/25/2001 | US6333230 Scalable high-voltage devices |
12/25/2001 | US6333229 Method for manufacturing a field effect transitor (FET) having mis-aligned-gate structure |
12/25/2001 | US6333228 Method to improve the control of bird's beak profile of poly in split gate flash |
12/25/2001 | US6333227 Methods of forming hemispherical grain silicon electrodes by crystallizing the necks thereof |
12/25/2001 | US6333226 Method of manufacturing semiconductor memory device having a capacitor |
12/25/2001 | US6333225 Integrated circuitry and methods of forming circuitry |
12/25/2001 | US6333224 Method for fabricating an integrated circuit capacitor |
12/25/2001 | US6333223 Semiconductor device and method of manufacturing the same |
12/25/2001 | US6333222 Semiconductor device and manufacturing method thereof |
12/25/2001 | US6333221 Method for improving planarization of an ILD layer |
12/25/2001 | US6333220 Method and apparatus for providing low-GIDL dual workfunction gate doping with borderless diffusion contact |
12/25/2001 | US6333219 Method for forming a polysilicon node in a semiconductor device |
12/25/2001 | US6333218 Method of etching contacts with reduced oxide stress |
12/25/2001 | US6333217 Method of forming MOSFET with channel, extension and pocket implants |
12/25/2001 | US6333216 Method in the manufacturing of a semiconductor device |
12/25/2001 | US6333215 Method for manufacturing a semiconductor device |
12/25/2001 | US6333212 Semiconductor device and manufacturing method thereof |
12/25/2001 | US6333211 Process for manufacturing a premold type semiconductor package using support pins in the mold and external connector bumps |
12/25/2001 | US6333210 Process of ensuring detect free placement by solder coating on package pads |
12/25/2001 | US6333209 One step method for curing and joining BGA solder balls |
12/25/2001 | US6333208 Robust manufacturing method for making a III-V compound semiconductor device by misaligned wafer bonding |
12/25/2001 | US6333207 Peelable lead structure and method of manufacture |
12/25/2001 | US6333206 Process for the production of semiconductor device |
12/25/2001 | US6333203 Method of forming a resist pattern |
12/25/2001 | US6333202 Flip FERAM cell and method to form same |
12/25/2001 | US6333201 Method for fabricating nonvolatile ferroelectric memory |
12/25/2001 | US6333141 Positioning layer of dielectric material comprising decomposable polymer and an organic polysilica, heating to condense polysilica; decomposing polymer; lithographically patterning dielectric layer; depositing a metallic film |
12/25/2001 | US6333138 Exposure method utilizing partial exposure stitch area |
12/25/2001 | US6333136 Carrier film and process for producing the same |
12/25/2001 | US6333130 Method and apparatus for correcting defects in photomask |
12/25/2001 | US6333129 Light shield film pattern |
12/25/2001 | US6333120 Plating copper underlayer which comprises layer of electroplated copper onto substrate; subjecting copper coated substrate to oxygen-containing gaseous ambient to roughen surface of copper; electroplating second layer of copper |
12/25/2001 | US6333111 Method of producing layered aluminum fine particles and use thereof |
12/25/2001 | US6333104 For coupling of integrated circuit chips to electronic cards using interconnections comprising conductive polymers |
12/25/2001 | US6333079 Feeding material gas for film formation into reactor inside of which is kept evacuated; decomposing gas into plasma by using power having high frequency to form deposited film on substrate provided inside reactor |
12/25/2001 | US6333066 Method for forming PZT thin film using seed layer |
12/25/2001 | US6333003 Starting operation of removing unit, gathering air in process unit into removing unit; replenishing a new impurity remover; supplying to gas-liquid contact portion; stopping; discharging impurities; supplying biocide |
12/25/2001 | US6332989 Slurry for chemical mechanical polishing of copper |
12/25/2001 | US6332988 Terminal metal on semiconductor wafers with solder bump layers |
12/25/2001 | US6332973 Using a circuit and filter for purification of baths, plating out copper from solution and circulation |
12/25/2001 | US6332963 Cup-type plating apparatus and method for plating wafer using the same |
12/25/2001 | US6332961 Device and method for detecting and preventing arcing in RF plasma systems |
12/25/2001 | US6332947 Plasma processing apparatus and plasma processing method using the same |
12/25/2001 | US6332946 Method for assembling a multi-layered ceramic package |
12/25/2001 | US6332928 High throughput OMPVE apparatus |
12/25/2001 | US6332927 Substrate processing apparatus |
12/25/2001 | US6332924 Photoresist dispensing device |
12/25/2001 | US6332898 Substrate processing apparatus and maintenance method therefor |
12/25/2001 | US6332835 Polishing apparatus with transfer arm for moving polished object without drying it |
12/25/2001 | US6332833 Method for fabricating silicon semiconductor discrete wafer |
12/25/2001 | US6332832 CMP polish pad and CMP processing apparatus using the same |
12/25/2001 | US6332830 Polishing method and polishing device |
12/25/2001 | US6332786 Electrical connection device employing an anisotropic electrically conductive film |
12/25/2001 | US6332766 Apparatus for encasing array packages |
12/25/2001 | US6332744 Automatic warehouse and transfer system using the same |
12/25/2001 | US6332724 Substrate processing apparatus |
12/25/2001 | US6332723 Substrate processing apparatus and method |
12/25/2001 | US6332661 Constant current driving apparatus and constant current driving semiconductor integrated circuit |
12/25/2001 | US6332601 Liquid vaporizers for semiconductor processing systems |
12/25/2001 | US6332569 Etched glass solder bump transfer for flip chip integrated circuit devices |
12/25/2001 | US6332525 Vacuum chamber for flat substrates |
12/25/2001 | US6332470 Aerosol substrate cleaner |
12/25/2001 | US6332425 Surface treatment method and system |
12/25/2001 | US6332280 Vacuum processing apparatus |
12/25/2001 | US6332268 Method and apparatus for packaging IC chip, and tape-shaped carrier to be used therefor |
12/25/2001 | CA2229423C Method of and device for measuring return losses in optical fibre components |
12/25/2001 | CA2215691C Scanning lithography system having double pass wynne-dyson optics |
12/23/2001 | CA2351285A1 Production of diaphragms |
12/23/2001 | CA2351106A1 Power module with electronic power components and process for manufacturing such a module |
12/22/2001 | CA2349771A1 Illumination system with spatially controllable partial coherence compensating for line width variances in a photolithographic system |
12/20/2001 | WO2001097584A2 Encapsulation using microcellular foamed materials |
12/20/2001 | WO2001097579A1 Method of mounting electronic part |
12/20/2001 | WO2001097380A1 Apparatus and circuit having reduced leakage current and method therefor |