Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2001
12/20/2001WO2001097358A1 Multi-finger current ballasting esd protection circuit and interleaved ballasting for esd-sensitive circuits
12/20/2001WO2001097291A1 Method for producing a field effect transistor having a floating gate
12/20/2001WO2001097290A2 Buried inverted gate field-effect transistor (bigfet)
12/20/2001WO2001097289A1 Silicon on insulator logic circuit utilizing diode switching elements
12/20/2001WO2001097288A1 Semiconductor device for preventing noise generation
12/20/2001WO2001097286A2 High density three dimensional chip package assembly systems and methods
12/20/2001WO2001097285A2 Electronic component consisting of a housing and a substrate
12/20/2001WO2001097284A2 Method for forming dual damascene structure
12/20/2001WO2001097283A1 Copper interconnects with improved electromigration resistance and low resistivity
12/20/2001WO2001097282A1 Method for making substrates and resulting substrates
12/20/2001WO2001097281A2 Method for processing a wafer
12/20/2001WO2001097280A2 Quality control using profile library
12/20/2001WO2001097279A2 Method and apparatus for using scatterometry to perform feedback and feed-forward control
12/20/2001WO2001097278A1 Solder bump and wire bonding by infrared heating
12/20/2001WO2001097277A1 Electronic parts packaging method and electronic parts package
12/20/2001WO2001097276A1 Microparticle arrangement film, electrical connection film, electrical connection structure, and microparticle arrangement method
12/20/2001WO2001097275A1 Thermally induced reflectivity switch for laser thermal processing
12/20/2001WO2001097274A2 Heterostructure field effect transistor and method of manufacturing it
12/20/2001WO2001097273A1 Silicon bipolar transistor, circuit arrangement and method for production of a silicon bipolar transistor
12/20/2001WO2001097272A1 A method for producing a pn-junction
12/20/2001WO2001097271A1 Method and apparatus for uniform direct radiant heating in a rapid thermal processing reactor
12/20/2001WO2001097270A2 Substrate cleaning apparatus and method
12/20/2001WO2001097269A1 Film transforming method, film transforming system, and wafer product
12/20/2001WO2001097268A1 Detergent composition
12/20/2001WO2001097267A1 Structure evaluating method, method for manufacturing semiconductor devices, and recording medium
12/20/2001WO2001097266A1 Method of manufacturing thin-film semiconductor device
12/20/2001WO2001097265A2 Method of plasma doping deep trenches covered with hemispherical gained silicon
12/20/2001WO2001097264A1 Hot plate
12/20/2001WO2001097263A1 Hot plate
12/20/2001WO2001097262A1 Semiconductor manufacturing apparatus detecting a state of connection between controllers
12/20/2001WO2001097261A2 Plate capacitor in an insulating trench
12/20/2001WO2001097260A2 Holder for a substrate cassette and device provided with such a holder
12/20/2001WO2001097258A2 Fast recovery diode and method for its manufacture
12/20/2001WO2001097257A2 Dual metal gate transistors for cmos process
12/20/2001WO2001097256A2 A method of and apparatus for monitoring a ball forming process
12/20/2001WO2001097235A1 Photolithographically-patterned out-of-plane coil structures
12/20/2001WO2001097227A1 Non-volatile ferromagnetic memory having sensor circuitry shared with its state change circuitry
12/20/2001WO2001096972A2 Methods and apparatus for maintaining a pressure within an environmentally controlled chamber
12/20/2001WO2001096964A1 Photoresist remover composition
12/20/2001WO2001096961A2 Multipass multiphoton absorption method and apparatus
12/20/2001WO2001096960A1 Negative-acting chemically amplified photoresist composition
12/20/2001WO2001096957A1 Method for creating an integrated circuit stage wherein fine and large patterns coexist
12/20/2001WO2001096956A2 Method for producing a planar mask on surfaces having reliefs
12/20/2001WO2001096955A2 A method and apparatus for etching metal layers on substrates
12/20/2001WO2001096894A1 Compliant probe apparatus
12/20/2001WO2001096890A1 Device and method for inspection
12/20/2001WO2001096888A2 Difference frequency imaging and spectroscopy to measure dopants using an alternating current scanning tunneling microscope
12/20/2001WO2001096885A1 Connector apparatus
12/20/2001WO2001096884A1 Self teaching robotic carrier handling system
12/20/2001WO2001096883A2 Microcontactor probe and electric probe unit
12/20/2001WO2001096840A2 High sensitivity optical inspection system and method for detecting flaws on a diffractive surface
12/20/2001WO2001096836A1 Device for positioning disk-shaped objects
12/20/2001WO2001096634A1 Thick single crystal diamond layer method for making it and gemstones produced from the layer
12/20/2001WO2001096633A1 Single crystal diamond prepared by cvd
12/20/2001WO2001096620A2 High purity niobium and products containing the same, and methods of making the same
12/20/2001WO2001096182A1 Peroxide preservation
12/20/2001WO2001096062A1 Polishing pad with built-in optical sensor
12/20/2001WO2001069664A3 Forming microscale structures from polycrystalline materials
12/20/2001WO2001063983A3 Thermal management system
12/20/2001WO2001061733A3 Double recessed transistor
12/20/2001WO2001056119A3 Line-narrowing module for tunable laser
12/20/2001WO2001048493A3 Low power scan flipflop
12/20/2001WO2001024255A3 Interferometric method for endpointing plasma etch processes
12/20/2001WO2001011431B1 Method and apparatus of holding semiconductor wafers for lithography and other wafer processes
12/20/2001WO2000079571A3 Vacuum compliant door hinge
12/20/2001WO2000075966A3 Dual epitaxial layer for high voltage vertical conduction power mosfet devices
12/20/2001WO2000073994A9 Pixel classification in object inspection based on likelihood
12/20/2001WO2000019481A3 Low contamination high density plasma processing chamber and methods for processing a semiconductor substrate
12/20/2001WO1999012190A3 Sealed capsule opening and unloading system
12/20/2001US20010054171 Method of designing a semiconductor circuit and a semiconductor circuit designed using the method
12/20/2001US20010054166 LSI having a built-in self-test circuit
12/20/2001US20010053964 Method of forming a pattern using proximity-effect-correction
12/20/2001US20010053948 Apparatus and method for laying out transistor in semiconductor integrated circuit allowing efficient layout editing, and method for manufacturing semiconductor integrated circuit using the same method
12/20/2001US20010053863 Curable allyl homopolymer
12/20/2001US20010053842 Aromatic resins; electronics; films
12/20/2001US20010053840 High density; heat resistance; polysilicates
12/20/2001US20010053762 Associated with failure of gamete maturation, by administering a complex comprising an insulin-like growth factor (IGF) and insulin-like growth factor binding protein-3 (IGFBP-3); male or female infertility
12/20/2001US20010053740 Bismuth lanthanum titanate (BLT), BLT thin film, and electronic device including the BLT thin film
12/20/2001US20010053665 Polishing head of a chemical and mechanical polishing apparatus
12/20/2001US20010053663 Polishing apparatus
12/20/2001US20010053658 Window portion with an adjusted rate of wear
12/20/2001US20010053657 Apparatus and methods fo substantial planarization of solder bumps
12/20/2001US20010053620 Method and apparatus for interconnecting devices using an adhesive
12/20/2001US20010053618 Nitride semiconductor substrate and method for manufacturing the same, and nitride semiconductor device using nitride semiconductor substrate
12/20/2001US20010053617 Transportation method for a semiconductor device and transportation route selection method for a semiconductor device
12/20/2001US20010053616 Method and an apparatus for manufacturing multilayer electronic part
12/20/2001US20010053615 Ammonia activation gas is delivered into a reactor at the same time as trimethylaluminum and using methanol, ethanol or isopropanol as oxygen source instead of water vapor
12/20/2001US20010053614 Semiconductor device and method of manufacturing the same
12/20/2001US20010053613 Transistor and method of forming the same
12/20/2001US20010053612 Methods for making nearly planar dielectric films in integrated circuits
12/20/2001US20010053611 Method of removing polymer residues after tungsten etch back
12/20/2001US20010053610 Method of plasma etching thin films of difficult to dry etch materials
12/20/2001US20010053609 Applying a power source to an upper electrode and a bias power to a lower electrode so power density is less than about 1000 watts per 200 millimeter diameter wafer surface
12/20/2001US20010053607 Fabrication process of semiconductor substrate
12/20/2001US20010053606 Light sensitive chemical-mechanical polishing method
12/20/2001US20010053605 Apparatus and method for reducing differential sputter rates
12/20/2001US20010053604 Process for removing photoresist material
12/20/2001US20010053603 Method of manufacturing a copper metal wiring in a semiconductor device
12/20/2001US20010053602 Forming aluminum oxide, copper and conductive barrier layers on an active matrix with a substrate and insulating layer with an opening of a predetermined shape; to prevent diffusion of copper
12/20/2001US20010053601 Method of manufacturing MIS semiconductor device that can control gate depletion and has low resistance gate electrode to which germanium is added