Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2002
01/01/2002US6334566 Device and method for clamping and wire-bonding the leads of a lead frame one set at a time
01/01/2002US6334523 Component conveyor
01/01/2002US6334453 Seal configuration for use with a motor drive assembly in a microelectronic workpiece processing system
01/01/2002US6334404 Method and apparatus for reducing particle contamination on wafers
01/01/2002US6334398 Variable gap stop which can be used in a semiconductor processing device
01/01/2002US6334311 Thermoelectric-cooling temperature control apparatus for semiconductor device fabrication facility
01/01/2002US6334266 Supercritical fluid drying system and method of use
01/01/2002US6334249 Cavity-filling method for reducing surface topography and roughness
01/01/2002US6334230 Wafer cleaning apparatus
01/01/2002US6334229 Apparatus for cleaning edges of contaminated substrates
01/01/2002CA2225131C Process for producing semiconductor article
01/01/2002CA2197491C Ferroelectric capacitor and method for manufacturing thereof
12/2001
12/28/2001CA2350057A1 Planarized plastic modules for integrated circuits
12/27/2001WO2001099257A1 Gas bearing rotation assemblies for substrate processing systems
12/27/2001WO2001099199A1 Thin-film transistor and method of manufacture thereof
12/27/2001WO2001099198A2 Power mosfet and method of making the same
12/27/2001WO2001099197A1 Vertical mos transistor with buried gate and method for making same
12/27/2001WO2001099194A2 Semiconductor arrangement
12/27/2001WO2001099193A1 Semiconductor chip and semiconductor device using the semiconductor chip
12/27/2001WO2001099186A2 Shielding of analog circuits on semiconductor substrates
12/27/2001WO2001099185A2 Integrated circuit vertical trench device and method of forming thereof
12/27/2001WO2001099184A2 Dual damascene process utilizing a low-k dual dielectric
12/27/2001WO2001099183A2 Method and apparatus for a direct buried strap for same level interconnections for semiconductor devices
12/27/2001WO2001099182A2 Insitu diffusion barrier and copper metallization for improving reliability of semiconductor devices
12/27/2001WO2001099181A2 Clean method for recessed conductive barriers
12/27/2001WO2001099180A2 Novel frontside contact to substrate of soi device
12/27/2001WO2001099179A1 Method for making a soi semiconductor substrate with thin active semiconductor layer
12/27/2001WO2001099178A1 Die bonding device
12/27/2001WO2001099177A2 Trench mosfet with double-diffused body profile
12/27/2001WO2001099176A1 Silicide target for depositing less embrittling gate oxide and method of manufacturing silicide target
12/27/2001WO2001099175A1 Connector surface for sublithographic semiconductor structures and method for production thereof
12/27/2001WO2001099174A2 METHOD TO ETCH POLY Si GATE STACKS ON RAISED STI STRUCTURE
12/27/2001WO2001099173A2 Method of treating a substrate
12/27/2001WO2001099172A1 Electrical insulation of chip wafers by liquid phase sio2 deposition
12/27/2001WO2001099171A1 Gas supply device and treating device
12/27/2001WO2001099170A2 Ceria slurry and process for the chemical-mechanical polishing of silicon dioxide
12/27/2001WO2001099169A2 Etch stop layer system for sige devices
12/27/2001WO2001099168A1 Semiconductor device and method of manufacture thereof
12/27/2001WO2001099167A2 Memory device including nanoclusters and method for manufacture
12/27/2001WO2001099166A1 Thin film forming method
12/27/2001WO2001099165A1 Method for forming thin film and apparatus for forming thin film
12/27/2001WO2001099164A2 Patterning method using a removable inorganic antireflection coating
12/27/2001WO2001099163A2 Multiplayer pillar arry capacitor structure for deep -sub-micron cmos
12/27/2001WO2001099162A2 Gate oxidation for vertical trench device
12/27/2001WO2001099159A2 Reduction of black silicon in deep trench etch
12/27/2001WO2001099158A2 Collar formation by selective oxide deposition
12/27/2001WO2001099157A1 A semiconductor processing system with lamp cooling
12/27/2001WO2001099156A1 Configurable single substrate wet-dry integrated cluster cleaner
12/27/2001WO2001099155A2 Nitride semiconductor substrate and method for manufacturing the same, and nitride semiconductor device using nitride semiconductor substrate
12/27/2001WO2001099154A1 Method and device for cleaning and then bonding substrates
12/27/2001WO2001099153A2 A negative differential resistance device and method of operating same
12/27/2001WO2001099151A2 Structure and method for abrupt pn junction diode formed using chemical vapor deposition processing
12/27/2001WO2001099145A1 A method for fault identification in a plasma process
12/27/2001WO2001099114A1 Reference cell for high speed sensing in non-volatile memories
12/27/2001WO2001099099A2 Magnetic multilayer structure with improved magnetic field range
12/27/2001WO2001098838A2 Method of forming optical images, mask for use in this method, method of manufacturing a device using this method, and apparatus for carrying out this method
12/27/2001WO2001098837A1 Photoresist remover composition comprising ammonium fluoride
12/27/2001WO2001098836A2 Method of reducing post-development defects in and around openings formed in photoresist by use of non-patterned exposure
12/27/2001WO2001098835A1 Method for determining overlay measurement uncertainty
12/27/2001WO2001098829A1 A method for individualised marking of circuit boards
12/27/2001WO2001098793A2 Systems for testing integraged circuits during burn-in
12/27/2001WO2001098788A2 Diagnosting reliability of vias by e-beam probing
12/27/2001WO2001098761A1 Overlay alignment mark design
12/27/2001WO2001098755A2 Optical inspection method and apparatus with adaptive spatial filter
12/27/2001WO2001098724A1 Graphite-based heat sink
12/27/2001WO2001098721A1 Optical apparatus and methods for shrinking electronic components
12/27/2001WO2001098563A2 Orientation independent oxidation of silicon
12/27/2001WO2001098556A2 Temperature controlled gas feedthrough
12/27/2001WO2001098554A2 Improved lamphead for a rapid thermal processing chamber
12/27/2001WO2001098212A1 Ceramic film and method for its preparation, and semiconductor device and piezoelectric element
12/27/2001WO2001098200A1 Vertical transistor comprising a mobile gate and a method for the production thereof
12/27/2001WO2001098028A1 Polishing pad
12/27/2001WO2001098016A2 Laser system for processing target material
12/27/2001WO2001097983A1 Process and system for determining acceptability of a fluid dispense
12/27/2001WO2001080304A8 Improved test structures and methods for inspecting and utilizing the same
12/27/2001WO2001069655A3 Spin transistor
12/27/2001WO2001057908A3 A method and apparatus for implanting semiconductor wafer substrates
12/27/2001WO2001056065A3 Unreactive gas anneal and low temperature pretreatment of layered superlattice materials
12/27/2001WO2001046664A3 Method for producing micromechanical structures
12/27/2001WO2001045483A3 Method for the preparation of pure citalopram
12/27/2001WO2001045161B1 Nonvolatile memory and method of driving nonvolatile memory
12/27/2001WO2001043168A3 Method for handling semiconductor substrates during processing and/or machining
12/27/2001WO2001042855A3 Lithography device which uses a source of radiation in the extreme ultraviolet range and multi-layered mirrors with a broad spectral band in this range
12/27/2001WO2001037338A3 Method for integrating a chip in a printed board and integrated circuit
12/27/2001WO2001001469A3 Process for designing a mask
12/27/2001WO2000062977A9 Method of conditioning wafer polishing pads
12/27/2001US20010056569 Method of designing layout of semiconductor device
12/27/2001US20010056568 Logic compound method and logic compound apparatus
12/27/2001US20010056557 Semiconductor integrated circuit device including semiconductor memory with tester circuit capable of analyzing redundancy repair
12/27/2001US20010056446 Asic design support system
12/27/2001US20010056310 Task instructing method and apparatus, storage medium for storing the method, card type storage medium used by the apparatus, and task instructing and managing system
12/27/2001US20010056144 Fill material for dual damascene processes
12/27/2001US20010056052 Cleaning liquid
12/27/2001US20010055942 Polishing method using a reconstituted dry particulate polishing composition
12/27/2001US20010055941 Method of chemical mechanical polishing
12/27/2001US20010055937 Cleaning method and polishing apparatus employing such cleaning method
12/27/2001US20010055936 Methods and apparatuses for planarizing microelectronic substrate assemblies
12/27/2001US20010055934 Low pressure steam softening adhesive; easy peeling
12/27/2001US20010055932 Method and apparatus for wireless transfer of chemical-mechanical planarization measurements
12/27/2001US20010055928 Water-permeable adhesive tape