Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2002
01/03/2002US20020000588 Semiconductor device having a ferroelectric capacitor with tensile stress properties
01/03/2002US20020000587 Method for forming capacitor of nonvolatile semiconductor memory device and the capacitor
01/03/2002US20020000586 Capacitively coupled ferroelectric random access memory cell and a method for manufacturing the same
01/03/2002US20020000585 Semiconductor device having ferroelectric memory cells and method of manufacturing the same
01/03/2002US20020000584 Semiconductor structure and device including a monocrystalline conducting layer and method for fabricating the same
01/03/2002US20020000583 System with meshed power and signal buses on cell array
01/03/2002US20020000580 Scalable manufacture process for power mosfet with fully self-aligned shrinkable gate and drain
01/03/2002US20020000579 Semiconductor device having a gate insulation film resistant to dielectric breakdown.
01/03/2002US20020000578 Semiconductor integrated circuit device
01/03/2002US20020000577 Semiconductor memory of good retention and its manufacture
01/03/2002US20020000576 Display device
01/03/2002US20020000575 Spin-valve transistor
01/03/2002US20020000574 Semiconductor device having vertical bipolar transistor
01/03/2002US20020000573 Radio frequency modules and modules for moving
01/03/2002US20020000570 Semiconductor device
01/03/2002US20020000567 Microwave array transistor for low-noise and high-power applications
01/03/2002US20020000566 Semiconductor switching element with integrated schottky diode and process for producing the switching element and diode
01/03/2002US20020000562 Fabrication of low leakage-current backside illuminated photodiodes
01/03/2002US20020000557 Method of deforming a pattern and semiconductor device formed by utilizing deformed pattern
01/03/2002US20020000556 Hexagonal boron nitride film with low dielectric constant, layer dielectric film and method of production thereof, and plasma CVD apparatus
01/03/2002US20020000555 TFT substrate with low contact resistance and damage resistant terminals
01/03/2002US20020000554 Electric device, matrix device, electro-optical display device and semiconductor memory having thin-film transistors
01/03/2002US20020000553 Thin film transistor liquid crystal display and manufacturing method thereof
01/03/2002US20020000552 Semiconductor device and method of producing the same
01/03/2002US20020000551 Semiconductor device and manufacturing method thereof
01/03/2002US20020000550 Algorithm for detecting sloped contact holes using a critical-dimension waveform
01/03/2002US20020000547 Silicon/graphite composite ring for supporting silicon wafer, and dry etching apparatus equipped with the same
01/03/2002US20020000521 Method and apparatus for conditioning an electrostatic chuck
01/03/2002US20020000520 Surface position detection device and exposure apparatus and exposure method achieved by utilizing detection device
01/03/2002US20020000519 Contamination prevention in optical system
01/03/2002US20020000467 Holographic laser scanning method and system employing visible scanning-zone indicators identifying a three-dimensional omni-directional laser scanning volume for package transport navigation
01/03/2002US20020000432 Heat treatment apparatus and substrate processing system
01/03/2002US20020000427 Method for predicting and avoiding a bad bond when utilizing fiber push connect laser bonding
01/03/2002US20020000424 Method and device for removing an unnecessary film
01/03/2002US20020000423 Method for enhancing oxide to nitride selectivity through the use of independent heat control
01/03/2002US20020000422 Anisotropic, resist layer thickness increases, remains constant, or decreases more slowly; combines with conventional plasma etch
01/03/2002US20020000383 Placing the substrate surface within an enclosure, introducing liquid material into enclosure, and directing the liquid angularly toward substrate surface flowing rotationally upon contact; semiconductors
01/03/2002US20020000382 Contacting metal seed layer on substrate with acidic electrolyte bath containing acids, copper compounds, suppressors and water, then subjecting to current
01/03/2002US20020000380 Electroplating solution provides ions or complex of noble metals for electroplating the surface of the workpiece; semiconductor wafers; integrated circuits
01/03/2002US20020000379 Electroplating apparatus and electroplating method
01/03/2002US20020000374 Sputtering apparatus
01/03/2002US20020000372 Dry contact assemblies, methods for making dry contact assemblies, and plating machines with dry contact assemblies for plating microelectronic workpieces
01/03/2002US20020000371 Substrate processing apparatus and substrate plating apparatus
01/03/2002US20020000370 Ion processing of a substrate
01/03/2002US20020000368 Vacuum treatment chamber and method for treating surfaces
01/03/2002US20020000330 Intaglio printing method, intaglio printer, method of formation of bumps, or wiring pattern, apparatus therefor, bump electrode and printed circuit board
01/03/2002US20020000327 Wiring substrate, semiconductor device and package stack semiconductor device
01/03/2002US20020000294 Method and apparatus for mounting semiconductor chips onto a flexible substrate
01/03/2002US20020000271 Filling recessed microstructures on semiconductor surface with copper metallization; particle sizes; annealing; electroplating; robotics
01/03/2002US20020000263 Reducing alkylmetal to the metal and alkane, then reaction with titanium tetrachloride which deposits titanium which can further be annealed to form titanium silicide; low resistance contacts
01/03/2002US20020000251 Multi-channel rotary joint
01/03/2002US20020000240 Liquid processing apparatus
01/03/2002US20020000239 Stripping composition: quaternary ammonium base, surfactant and high boiling solvent; environmentally and chemically safe
01/03/2002US20020000203 Multi-thermal zone shielding apparatus
01/03/2002US20020000202 Remote plasma apparatus for processing sustrate with two types of gases
01/03/2002US20020000201 Plasma chemical vapor deposition apparatus
01/03/2002US20020000200 Chemical vapor deposition apparatus
01/03/2002US20020000199 Film forming apparatus and method for producing tungsten nitride film
01/03/2002US20020000197 Vacuum processing apparatus and multi-chamber vacuum processing apparatus
01/03/2002US20020000196 Reactor for depositing thin film on wafer
01/03/2002US20020000194 Dual degas/cool loadlock cluster tool
01/03/2002US20020000193 Coating apparatus and mixing apparatus
01/03/2002US20020000189 Method of pulling up silicon single crystal and method of manufacturing epitaxial wafer
01/03/2002US20020000185 Non-oxygen precipitating Czochralski silicon wafers
01/03/2002US20020000091 Safety device for a moving system
01/03/2002US20020000034 Continuous processing of thin-film batteries and like devices
01/03/2002US20020000029 Pipe structure, alignment apparatus, electron beam lithography apparatus, exposure apparatus, exposure apparatus maintenance method, semiconductor device manufacturing method, and semiconductor manufacturing factory
01/03/2002US20020000019 Multi functional cleaning module of manufacturing apparatus for flat panel display and cleaning apparatus using the same
01/03/2002DE10128928A1 Semiconductor memory used for a DRAM comprises bit lines buried in a substrate, word lines formed on the substrate, and vertical transistors formed on individual storage cells
01/03/2002DE10127945A1 Array substrate for use in thin film transistor-liquid crystal display device, has drain electrode formed over gate electrode, such that it corresponds to inverted T-shaped opening in gate electrode
01/03/2002DE10125031A1 Tischpositioniervorrichtung Tischpositioniervorrichtung
01/03/2002DE10118167A1 Cleaning apparatus for semiconductor wafers includes movable marangoni dryer having hood for moving the wafers from loader into inner bath
01/03/2002DE10109172A1 Current limiter used in an electrical circuit comprises a silicon substrate, an n-conducting layer, n+ layers formed on opposite surfaces of the n- conducting layer, and electrodes formed on opposite surfaces of the substrate
01/03/2002DE10108542A1 Production of a wafer used in the production of integrated components comprises polishing the wafer, treating with an oxidant, cleaning, rinsing and drying, inspecting one polished side of the wafer
01/03/2002DE10108283A1 Manufacture of semiconductor device involves using organic polymeric embedding material to embed hole patterns
01/03/2002DE10104204A1 Halbleiter-Vorrichtung und Verfahren zur Herstellung derselben A semiconductor device and method of manufacturing the same
01/03/2002DE10064198A1 Production of a semiconductor device comprises forming either an aluminum, a tungsten or a copper foil on a base layer on a substrate, forming an aluminum, tungsten or copper pattern
01/03/2002DE10036897C1 Field effect transistor used in a switching arrangement comprises a gate region between a source region and a drain region
01/03/2002DE10030694A1 Time-controlled processing of small components, especially semiconductor components in processing and test stations by receiving and depositing components at same alignment
01/03/2002DE10030495A1 Verfahren zum Verbinden einer Vielzahl von optischen Elementen mit einem Grundkörper A method of connecting a plurality of optical elements comprising a base body
01/03/2002DE10029919A1 Method and device for converting programmable electronic components with connector contacts like microprocessors removes the programmable electronic components with integrated flash EPROM from a feeder conveyor container.
01/03/2002DE10029791A1 Verfahren zur Herstellung einer stabilen Verbindung zwischen zwei Wafern A process for the preparation of a stable connection between two wafers
01/03/2002DE10029659A1 Verfahren zur Herstellung eines Feldeffekttransistors A process for producing a field effect transistor
01/03/2002DE10029658A1 Barrier layer production comprises oxidizing a silicon substrate to produce a substrate oxide, forming an oxygen-impermeable layer on the boundary surface between the substrate oxide layer and the substrate, and etching
01/03/2002DE10029288A1 Verfahren zur Herstellung einer planaren Maske auf topologiehaltigen Oberflächen A process for producing a planar topology mask on surfaces containing
01/03/2002DE10029287A1 Verfahren zur Herstellung eines Feldeffekttransistors mit einem Floating Gate A process for producing a field effect transistor with a floating gate
01/03/2002CA2413592A1 Method to restore hydrophobicity in dielectric films and materials
01/03/2002CA2410432A1 Method and apparatus for testing high performance circuits
01/02/2002EP1168907A1 Device for mounting a flip-chip unto a workpiece
01/02/2002EP1168906A1 Power module with electronic power components and production method thereof
01/02/2002EP1168607A2 An on-chip signal filter with bond wire inductors
01/02/2002EP1168466A2 Method for manufacturing semiconductors thin film, and magnetoelectric conversion element provided with semiconductor thin film thereby manufactured
01/02/2002EP1168462A1 Light-emitting thyristor matrix array and driver circuit
01/02/2002EP1168460A2 Light emitting element, method of manufacturing the same, and semiconductor device having light emitting element
01/02/2002EP1168457A2 Ferroelectric memory cell and method of manufacture
01/02/2002EP1168456A2 A CMOS-process compatible, tunable NDR (negative differential resistance) device and method of operating same
01/02/2002EP1168455A2 Power semiconductor switching element
01/02/2002EP1168454A2 Nonvolatile semiconductor memory
01/02/2002EP1168453A2 Semiconductor device with heavily-doped diffusion layer and method for fabricating the same
01/02/2002EP1168452A2 Semiconductor device having vertical bipolar transistor