Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2002
01/08/2002US6337278 Technique for forming a borderless overlapping gate and diffusion contact structure in integrated circuit device processing
01/08/2002US6337277 Flowing water vapor over layer to be etched; condensing water vapor on layer; etching through layer to form opening having side wall, wherein condensed water vapor is arranged to cover side wall to protect side wall from etching
01/08/2002US6337276 Methods of forming a copper wiring in a semiconductor device using chemical vapor deposition
01/08/2002US6337275 Method for forming a self aligned contact in a semiconductor device
01/08/2002US6337274 Forming a conductive line includes forming a silicon comprising region over a substrate, forming titanium nitride layer; annealing, depositing tungsten layer, patterning, forming capacitor
01/08/2002US6337273 Method for fabricating contact of semiconductor device
01/08/2002US6337272 Depositing cobalt on silicon semiconductor substrate by sputtering while heating
01/08/2002US6337271 Polishing simulation
01/08/2002US6337270 Process for manufacturing semiconductor device
01/08/2002US6337269 Method of fabricating a dual damascene structure
01/08/2002US6337268 Method of manufacturing contact structure
01/08/2002US6337267 Method for fabricating a semiconductor memory device and the structure thereof
01/08/2002US6337266 Small electrode for chalcogenide memories
01/08/2002US6337265 Method for integration of integrated circuit devices
01/08/2002US6337264 Simplified method of patterning polysilicon gate in a semiconductor device including an oxime layer as a mask
01/08/2002US6337263 Method for improving the quality of metal conductor tracks on semiconductor structures
01/08/2002US6337262 Self aligned T-top gate process integration
01/08/2002US6337261 Semiconductor processing methods of forming integrated circuitry and semiconductor processing methods of forming dynamic random access memory (DRAM) circuitry
01/08/2002US6337260 Introducing oxygen atoms into substrate from an oxygen-containing layer overlying an ion implanted surface of substrate for gettering interstitial defects within substrate responsible for transient enhanced diffusion
01/08/2002US6337259 Method for fabricating semiconductor device with high quality crystalline silicon film
01/08/2002US6337258 Method of dividing a wafer
01/08/2002US6337257 Semiconductor device and method of manufacturing the same
01/08/2002US6337256 Impurity ion segregation precluding layer, fabrication method thereof, isolation structure for semiconductor device using the impurity ion segregation precluding layer and fabricating method thereof
01/08/2002US6337255 Method for forming a trench structure in a silicon substrate
01/08/2002US6337254 Method of forming trench isolation structure with dummy active regions and overlying discriminately doped conduction layer
01/08/2002US6337253 Process of making buried capacitor for silicon-on-insulator structure
01/08/2002US6337252 Semiconductor device manufacturing method
01/08/2002US6337251 Method of manufacturing semiconductor device with no parasitic barrier
01/08/2002US6337250 Semiconductor device containing MOS elements and method of fabricating the same
01/08/2002US6337249 Semiconductor device and fabrication process thereof
01/08/2002US6337248 Process for manufacturing semiconductor devices
01/08/2002US6337247 Method of producing a vertical MOS transistor
01/08/2002US6337246 Method for inhibiting tunnel oxide growth at the edges of a floating gate during semiconductor device processing
01/08/2002US6337245 Method for fabricating flash memory device and flash memory device fabricated thereby
01/08/2002US6337244 Method of forming flash memory
01/08/2002US6337243 Semiconductor processing method of making a hemispherical grain (HSG) polysilicon layer
01/08/2002US6337241 Manufacturing method of a semiconductor memory device
01/08/2002US6337240 Method for fabricating an embedded dynamic random access memory
01/08/2002US6337239 Layer configuration with a material layer and a diffusion barrier which blocks diffusing material components and process for producing a diffusion barrier
01/08/2002US6337238 Semiconductor device having a dielectric film and a fabrication process thereof
01/08/2002US6337237 Capacitor processing method and DRAM processing method
01/08/2002US6337236 Forming insulating film over substrate, forming semiconductor film on insulating film, forming a gate insulating film over semiconductor film after heating, forming gate electrode; improved carrier mobility
01/08/2002US6337235 Semiconductor device and manufacturing method thereof
01/08/2002US6337234 Method of fabricating a buried bus coplanar thin film transistor
01/08/2002US6337233 Method of manufacturing a polycrystalline silicon layer
01/08/2002US6337232 Method of fabrication of a crystalline silicon thin film semiconductor with a thin channel region
01/08/2002US6337231 Method for producing semiconductor device
01/08/2002US6337230 Semiconductor device and manufacturing method thereof
01/08/2002US6337229 Method of making crystal silicon semiconductor and thin film transistor
01/08/2002US6337227 Method of fabrication of stacked semiconductor devices
01/08/2002US6337225 Method of making stacked die assemblies and modules
01/08/2002US6337223 Semiconductor optical device and method for fabricating the same
01/08/2002US6337221 Die bonding method for manufacturing fine pitch ball grid array packages
01/08/2002US6337217 Method and apparatus for improved focus in optical processing
01/08/2002US6337216 Methods of forming ferroelectric memory cells
01/08/2002US6337175 Performing a first exposure of the resist formed on the substrate with a given mask pattern; developing; supplying denaturing agent; exposure to form pattern
01/08/2002US6337173 Method for fabricating a semiconductor capacitor
01/08/2002US6337172 Applying photoresist to insulating layer of semiconductor device structure; exposing photoresists at differfent areas of the semiconductor device to radiation; removing photoresist and insulating layer
01/08/2002US6337171 As a resist applicable to far ultraviolet rays such as a krf excimer laser, charged particle rays such as electron beams, and x-rays
01/08/2002US6337164 Charged-particle-beam microlithography methods exhibiting improved pattern-feature accuracy, and device manufacturing methods comprising same
01/08/2002US6337163 Forming underlying film on work film; forming resist film; exposing to first energy beam of a pattern; forming resist pattern by subjecting resist film to a developing treatment; exposing a region of underlying film; dry-etching
01/08/2002US6337161 Semiconductor
01/08/2002US6337151 Semiconductors
01/08/2002US6337148 Copper source reagent compositions, and method of making and using same for microelectronic device structures
01/08/2002US6337123 Multilayered ceramic substrate and method of producing the same
01/08/2002US6337109 Method of producing crystalline semiconductor
01/08/2002US6337032 Providing sol-gel precursor solution comprising inorganic salt and alkoxide of metal, coating, heating, stabilizing, driving off volatile components, forming crystalline phase
01/08/2002US6337030 Wafer processing apparatus, wafer processing method, and SOI wafer fabrication method
01/08/2002US6337028 Process of forming a pattern on a substrate
01/08/2002US6337004 High adhesion performance roll sputtered strike layer
01/08/2002US6337003 Vacuum apparatus and driving mechanism therefor
01/08/2002US6336991 Method of holding substrate and substrate holding system
01/08/2002US6336990 Thermocompression bonding method for electrically and mechanically connecting conductors
01/08/2002US6336975 Thin film forming equipment and method
01/08/2002US6336974 Apparatus and method for controlling the depth of immersion of a semiconductor element in an exposed surface of a viscous fluid
01/08/2002US6336973 Apparatus and method for modifying the configuration of an exposed surface of a viscous fluid
01/08/2002US6336970 Surface preparation method and semiconductor device
01/08/2002US6336968 Non-oxygen precipitating czochralski silicon wafers
01/08/2002US6336848 Apparatus for polishing leads of a semiconductor package
01/08/2002US6336845 Method and apparatus for polishing semiconductor wafers
01/08/2002US6336787 Method for transferring wafers in a semiconductor tape-peeling apparatus
01/08/2002US6336775 Gas floating apparatus, gas floating-transporting apparatus, and thermal treatment apparatus
01/08/2002US6336567 Magnetic secured container closure with release by movement of magnetic member
01/08/2002US6336546 Conveying system
01/08/2002US6336463 Cleaning/drying station and production line for semiconductor devices
01/08/2002US6336423 Apparatus for forming a deposited film by plasma chemical vapor deposition
01/08/2002US6336269 Method of fabricating an interconnection element
01/08/2002US6336262 Process of forming a capacitor with multi-level interconnection technology
01/08/2002CA2007373C Ink jet recording sheet
01/07/2002CA2352641A1 Optical semiconductor device, method for manufacturing the same, and optical module and optical communication apparatus provided with the optical semiconductor device
01/07/2002CA2352513A1 Manufacturing process for a power electronic component, and power electronic component thus obtained
01/03/2002WO2002001930A2 Electrostatic methods and apparatus for mounting and demounting particles from a surface having an array of tacky and non-tacky areas
01/03/2002WO2002001719A2 Method and apparatus for testing high performance circuits
01/03/2002WO2002001648A1 Semiconductor structure, device, circuit, and process
01/03/2002WO2002001645A1 Mosfet and method for fabrication of mosfet with buried gate
01/03/2002WO2002001644A2 Power mosfet and methods of forming and operating the same
01/03/2002WO2002001643A2 Soft recovery power diode and related method
01/03/2002WO2002001638A2 Microelectronic packages including reactive components, and methods of fabricating the same
01/03/2002WO2002001634A2 System support for semiconductor chips and electronic components and method for producing a system support and electronic components
01/03/2002WO2002001630A2 Hermetic high frequency module and method for producing the same