Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2002
02/26/2002US6350113 Resin molding machine
02/26/2002US6350097 Method and apparatus for processing wafers
02/26/2002US6349887 Liquid delivery system
02/26/2002US6349872 Packaging method
02/26/2002US6349870 Method of manufacturing electronic component
02/26/2002US6349832 Stud and ride for use on matrix trays
02/26/2002US6349669 Method and apparatus for depositing a thin film, and semiconductor device having a semiconductor-insulator junction
02/26/2002US6349594 Method of measuring film thickness distribution
02/26/2002US6349456 Method of manufacturing photodefined integral capacitor with self-aligned dielectric and electrodes
02/26/2002CA2239277C Passive element circuit
02/26/2002CA2211562C De-warping apparatus for straightening a plate
02/21/2002WO2002015659A1 Method and device for the fixing of electronic circuits
02/21/2002WO2002015654A1 Mounting method and mounting device
02/21/2002WO2002015650A2 Externally excited torroidal plasma source
02/21/2002WO2002015649A2 Close coupled match structure for rf drive electrode
02/21/2002WO2002015293A2 Organic field-effect transistor (ofet), a production method therefor, an integrated circuit constructed from the same and their uses
02/21/2002WO2002015285A1 Metal sulfide semiconductor transistor devices
02/21/2002WO2002015283A2 Metal sulfide-oxide semiconductor transistor devices
02/21/2002WO2002015280A1 Thick oxide layer on bottom of trench structure in silicon
02/21/2002WO2002015278A2 Multigate semiconductor device and method of fabrication
02/21/2002WO2002015277A2 Dense arrays and charge storage devices, and methods for making same
02/21/2002WO2002015276A2 Memory cell, memory cell device and method for the production thereof
02/21/2002WO2002015275A1 Method for manufacturing semiconductor device
02/21/2002WO2002015274A1 Semiconductor device for communication
02/21/2002WO2002015273A2 Methods for producing passive components on a semiconductor substrate
02/21/2002WO2002015267A2 Integrated circuit package including opening exposing portion of an ic
02/21/2002WO2002015266A2 Direct build-up layer on an encapsulated die package
02/21/2002WO2002015263A1 Semiconductor device and method for manufacturing the same
02/21/2002WO2002015262A1 Method of isolating semiconductor device
02/21/2002WO2002015259A1 High reliability non-conductive adhesives for non-solder flip chip bondings and flip chip bonding method using the same
02/21/2002WO2002015258A1 Mounting method
02/21/2002WO2002015257A1 Sensor micro-machined with electrolytic welding and method for making same
02/21/2002WO2002015256A1 Micromachined sensor with insulating protection of connections
02/21/2002WO2002015255A1 System and method for cleaning semiconductor fabrication equipment parts
02/21/2002WO2002015254A2 Method of manufacturing a trench-gate semiconductor device and corresponding device
02/21/2002WO2002015253A1 Method of producing silicon wafer
02/21/2002WO2002015252A2 A method for producing a metal film, a thin film device having such metal film and a liquid crystal display device having such thin film device
02/21/2002WO2002015251A1 Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process
02/21/2002WO2002015250A1 Structuring of ferroelectric layers
02/21/2002WO2002015249A2 Integrated shallow trench isolation process
02/21/2002WO2002015248A1 Quartz glass jig for plasma-using process device
02/21/2002WO2002015247A2 Method and apparatus for processing a semiconductor wafer using novel final polishing method
02/21/2002WO2002015246A1 Method of polishing semiconductor wafer
02/21/2002WO2002015245A2 Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence
02/21/2002WO2002015244A2 Process for producing semiconductor article using graded expitaxial growth
02/21/2002WO2002015243A1 Device and method for processing substrate
02/21/2002WO2002015242A1 Method of producing semiconductor integrated circuit device and method of producing multi-chip module
02/21/2002WO2002015241A1 Systems and methods for forming processing streams
02/21/2002WO2002015240A1 Directed assembly of nanometer-scale molecular devices
02/21/2002WO2002015238A2 Device and method for optical inspection of semiconductor wafer
02/21/2002WO2002015237A2 Changing local compressibility of a wafer support member
02/21/2002WO2002015236A2 Wafer area pressure control
02/21/2002WO2002015235A1 Method for wafer position data retrieval in semiconductor wafer manufacturing
02/21/2002WO2002015234A2 Carrier monitoring and fab-wide carrier management systems
02/21/2002WO2002015233A2 Integrated transistor devices
02/21/2002WO2002015231A2 A method for patterning layers of semiconductor devices
02/21/2002WO2002015222A2 Use of pulsed voltage in a plasma reactor
02/21/2002WO2002015209A2 Methods and apparatus for making integrated circuit package including opening exposing portion of the ic
02/21/2002WO2002015190A2 Non-volatile memory, method of manufacture and programming
02/21/2002WO2002015171A1 Circuit selection of magnetic memory cells and related cell structures
02/21/2002WO2002014954A2 Antireflective coating compositions
02/21/2002WO2002014953A1 Resin composition sensitive to actinic energy ray and method of forming polymer pattern from the resin composition
02/21/2002WO2002014924A1 Relay image optical system, and illuminating optical device and exposure system provided with the optical system
02/21/2002WO2002014846A2 Multiple beam inspection apparatus and method
02/21/2002WO2002014840A2 Database interpolation method for optical measurement of diffractive microstructures
02/21/2002WO2002014576A1 Sputtering target
02/21/2002WO2002014018A2 Abrasive pad for cmp
02/21/2002WO2002014015A1 Retaining ring for chemical-mechanical polishing head, polishing apparatus, slurry cycle system, and method
02/21/2002WO2002014014A2 Chemical mechanical planarization of metal substrates
02/21/2002WO2002014008A1 Soldering method for mounting electric components
02/21/2002WO2002013943A2 Ensemble manifold, system and method for monitoring particles in clean environments
02/21/2002WO2001086034A3 Modified susceptor for use in chemical vapor deposition process
02/21/2002WO2001084616A3 Semiconductor device using a barrier layer
02/21/2002WO2001084552A3 Programming of nonvolatile memory cells
02/21/2002WO2001080303A3 Method and apparatus for manufacturing an interconnect structure
02/21/2002WO2001080291B1 Methods and apparatus for thermally processing wafers
02/21/2002WO2001078135A3 Methods for repairing defects on a semiconductor substrate
02/21/2002WO2001078116A3 System for the preferential removal of silicon oxide
02/21/2002WO2001076771A3 Low temperature oxidizing method of making a layered superlattice material
02/21/2002WO2001069685A3 Trench-gate semiconductor devices
02/21/2002WO2001069659A3 Fabrication of semiconductor materials and devices with controlled electrical conductivity
02/21/2002WO2001068271A8 Controlling surface chemistry on solid substrates
02/21/2002WO2001067502A3 Method and apparatus for milling copper interconnects in a charged particle beam system
02/21/2002WO2001063024A8 Production of ceramic layers
02/21/2002WO2001061762A3 Punch-through diode and method of manufacturing the same
02/21/2002WO2001061746A3 Test structure for metal cmp process control
02/21/2002WO2001061409A3 Apparatus and method of cleaning reticles for use in a lithography tool
02/21/2002WO2001059832A3 Evaluation of etching processes in semiconductors
02/21/2002WO2001059815A3 Method and apparatus for processing a microelectronic workpiece at an elevated temperature
02/21/2002WO2001051679A3 Anti-reflective coating process and apparatus
02/21/2002WO2001048870A3 Interconnect for microelectronic structures with enhanced spring characteristics
02/21/2002WO2001046992A3 Optical method for the determination of grain orientation in films
02/21/2002WO2001029899A3 Semiconductor pn-junction diode, method of making the same and electronic circuit comprising the same
02/21/2002WO2001029881A3 Method of making an optoelectronic device using multiple etch stop layers
02/21/2002WO2001020646A3 Fill strategies in the optical kerf
02/21/2002WO2000074139A9 A single polysilicon flash eeprom and method for making same
02/21/2002US20020023254 System and method for processing a transistor channel layout
02/21/2002US20020023250 Parameterized designing method of data driven information processor employing self-timed pipeline control
02/21/2002US20020022937 Abnormality-cause identifying apparatus and method
02/21/2002US20020022708 Incorporating thermosetting monomer containing triple bond into a polymer thereby forming the low dielectric constant polymer