Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2002
02/28/2002US20020024106 Semiconductor integrated circuit device and a method of manufacturing the same
02/28/2002US20020024105 Semiconductor memory device
02/28/2002US20020024103 Structure of borderless contact and fabricating method thereof
02/28/2002US20020024102 Retrograde doping profile in twin well CMOS device
02/28/2002US20020024100 Shallow doped junctions with a variable profile gradation of dopants
02/28/2002US20020024099 Transistor
02/28/2002US20020024098 Semiconductor device
02/28/2002US20020024097 TFT type optical detecting sensor implementing different TFTs and the fabricating method thereof
02/28/2002US20020024095 Semiconductor device manufacturing method and semiconductor device
02/28/2002US20020024094 Novel cmos circuit of gaas/ge on si substrate
02/28/2002US20020024093 Semiconductor device with self-aligned contact structure employing dual spacers and method of manufacturing the same
02/28/2002US20020024092 Memory cell, memory cell arrangement and fabrication method
02/28/2002US20020024091 Trench structure substantially filled with high-conductivity material
02/28/2002US20020024090 3-D smart power IC
02/28/2002US20020024089 Semiconductor element and semiconductor memory device using the same
02/28/2002US20020024087 On-chip capacitor
02/28/2002US20020024086 Localized masking for semiconductor structure development
02/28/2002US20020024085 Semiconductor device and method for fabricating the same
02/28/2002US20020024084 Memory Circuity and Dynamic Random Access Memory Circuity Memory Circuity and Dynamic Random
02/28/2002US20020024083 Dram technology compatible non volatile memory cells
02/28/2002US20020024082 Semiconductor memory and manufacturing method thereof
02/28/2002US20020024081 Vertical non-volatile semiconductor memory cell and method for manufaturing the memory cell
02/28/2002US20020024080 Capacitor fabrication methods and capacitor constructions
02/28/2002US20020024079 Semiconductor memory device and method for fabricating the same
02/28/2002US20020024078 Insulated gate field effect transistor and method of fabricating the same
02/28/2002US20020024077 Semiconductor device and method for fabricating the same
02/28/2002US20020024076 Semiconductor device and manufacturing method of the same
02/28/2002US20020024075 Semiconductor memory device
02/28/2002US20020024074 Semiconductor device including ferroelectric capacitor and method of manufacturing the same
02/28/2002US20020024073 Semiconductor device and method for fabricating the same
02/28/2002US20020024072 Ferroelastic lead germanate thin film and deposition method
02/28/2002US20020024069 Charge transfer device
02/28/2002US20020024067 Image sensor capable of decreasing leakage current between diodes and method for fabricating the same
02/28/2002US20020024066 Solid-state image pickup device
02/28/2002US20020024064 Method of designing semiconductor integrated circuit device and semiconductor integrated circuit device
02/28/2002US20020024063 Layout structure for dynamic random access memory
02/28/2002US20020024061 Bipolar transistor
02/28/2002US20020024060 Semiconductor device
02/28/2002US20020024057 Semiconductor device and process of fabricating same
02/28/2002US20020024056 Field effect transistor
02/28/2002US20020024053 Light-emitting element, semiconductor light-emitting device, and manufacturing methods therefor
02/28/2002US20020024050 Method of making SiC semiconductor devices with W/WC/TaC contacts
02/28/2002US20020024049 Semiconductor storage apparatus
02/28/2002US20020024048 Semiconductor integrated circuit and fabrication method thereof
02/28/2002US20020024047 Insulated gate field effect semiconductor devices and method of manufacturing the same
02/28/2002US20020024045 Semiconductor integrated circuit device and method for designing the same
02/28/2002US20020024023 Method and apparatus for testing a substrate
02/28/2002US20020024020 Electron-beam drawing appraratus electron-beam drawing method
02/28/2002US20020024019 Mask defect checking method and device for electron beam exposure
02/28/2002US20020024012 Electron microscope
02/28/2002US20020024008 Method of detecting arrangement of beam spots
02/28/2002US20020024005 Interference system and semiconductor exposure apparatus having the same
02/28/2002US20020024003 Apparatus for processing a wafer
02/28/2002US20020023964 Non-contact type IC card and method for manufacturing such card
02/28/2002US20020023946 Method of an apparatus for heating a substrate
02/28/2002US20020023945 Low temperature solder column attach by injection molded solder and structure formed
02/28/2002US20020023944 Bondhead lead clamp apparatus and method
02/28/2002US20020023943 Concave face wire bond capillary
02/28/2002US20020023942 Wire bonding apparatus
02/28/2002US20020023940 Bondhead lead clamp apparatus and method
02/28/2002US20020023919 Fluid heating apparatus
02/28/2002US20020023914 Heating apparatus
02/28/2002US20020023906 Method of producing through-hole in aromatic polyimide film
02/28/2002US20020023901 Energy-efficient, laser-based method and system for processing target material
02/28/2002US20020023900 Chemistry for boron diffusion barrier layer and method of application in semiconductor device fabrication
02/28/2002US20020023896 Plasma etching method and apparatus
02/28/2002US20020023894 Surface preparation of substances for continuous convective assembly of fine particles
02/28/2002US20020023832 Plasma vapor deposition with coil sputtering
02/28/2002US20020023831 Pressure in the film-forming space is maintained at a pressure lower than the pressure in the sputtering space and a pressure sufficient for sputtered particles to move in the film forming space with their mean free path
02/28/2002US20020023774 Singulation methods and substrates for use with same
02/28/2002US20020023773 Method for manufacturing raised electrical contact patten of controlled geometry
02/28/2002US20020023765 Electronic device sealing electronic element therein and manufacturing method thereof, and printed wiring board suitable for such electronic device
02/28/2002US20020023732 Heat sink and process and molding tool for production of same
02/28/2002US20020023725 Nozzle for cleaving substrates
02/28/2002US20020023720 Apparatus for processing samples
02/28/2002US20020023719 A buffing assembly, at least one buff pad, a slurry delivery system containing a slurry which is chemically reactive to the barrier layer, and an endpoint detection system (infra red, or optical or laser or motor current detection systems)
02/28/2002US20020023718 RF matching unit
02/28/2002US20020023717 System for processing a workpiece
02/28/2002US20020023716 Apparatus and method for plasma processing high-speed semiconductor circuits with increased yield
02/28/2002US20020023715 Substrate polishing apparatus and substrate polishing mehod
02/28/2002US20020023675 Solar battery assembly and method of forming a solar battery assembly
02/28/2002US20020023671 Wet treatment apparatus
02/28/2002US20020023670 Method of and apparatus for cleaning semiconductor device
02/28/2002US20020023669 Positioning a semiconductor wafer within an enclosed vessel, etching polycrystalline silicon with hydrogen fluoride, filling the vessel with inert nitrogen gas, rinsing the wafer with deionized water, forming anhydrous liquid layer over it
02/28/2002US20020023668 Offer a short cycle of operation, and minimize the amount of time that the wafer is exposed to external air
02/28/2002US20020023664 Treating with a medium containing hydrofluoric acid (HF) and then with a medium containing ozone that is free of aqueous HF directly following the treatment with the medium containing HF, without any additional step of washing with water
02/28/2002US20020023663 High pressure gas water forms bubbles on the surface of the wafer to push away particles, and the bubbles repulse the particles and prevent re-adherence; will not etch silicon oxide, tungsten silicide, and photoresist, noncontaminating
02/28/2002US20020023661 Ultrasonic cleaning a substrate such as glass while being carried by a carrier roller by ultrasonic vibration units arranged in two rows in widthwise direction; vibration plate and the vibrator detach easily by removing a bolt
02/28/2002US20020023590 Susceptor for semiconductor wafers
02/28/2002US20020023589 Plasma generating apparatus
02/28/2002US20020023588 Substrate holder, a blow inlet for source gas, exhaust outlets for source gas; where direction of flow of source gas relative the substrate is varied with time using valves; barium strontium titanate films
02/28/2002US20020023554 Method and stencil for extruding material on a substrate
02/28/2002US20020023540 Gas separation apparatus
02/28/2002US20020023458 Vertical heat treatment system, method for controlling vertical heat treatment system, and method for transferring object to be treated
02/28/2002US20020023413 Methods of packaging semiconductor wafers by molding a packing bag about a carrying device that contains the semiconductor wafers
02/28/2002US20020023389 Contains polishing colloidal particles whose primary particles have a diameter of from five to thirty nanometers, wherein the degree of association of the primary particles is five or less; use manufacturing a semiconductor device
02/28/2002US20020023370 Method for drying a semiconductor wafer, a mixture for drying, and a dryer
02/28/2002US20020023343 Method of manufacturing multi-layer printed wiring board
02/28/2002US20020023342 Electronic device and a method of manufacturing the same
02/28/2002US20020023340 Method of separating a plate-like workpiece adsorption-held on an elastic adsorption pad