Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2002
02/28/2002US20020025620 Methods of forming field effect transistors and related field effect transistor constructions
02/28/2002US20020025616 Alignment method and apparatus for aligning cutting blade
02/28/2002US20020025615 Semiconductor device and method for producing the same
02/28/2002US20020025614 Method of fabricating thin film transistor using buffer layer and the thin film transistor
02/28/2002US20020025613 MIS semiconductor device having an LDD structure and a manufacturing method therefor
02/28/2002US20020025612 Method for producing semiconductor device
02/28/2002US20020025611 MasK ROM and method for fabricating the same
02/28/2002US20020025610 Method for substrate noise distribution
02/28/2002US20020025609 Methods of forming dynamic random access memory circuitry
02/28/2002US20020025608 Memory module, method of manufacturing the memory module, and test connector using the memory module
02/28/2002US20020025607 Semiconductor device and a method of manufacturing the same
02/28/2002US20020025605 Suppression recesses; controlled polishing
02/28/2002US20020025604 Low temperature semiconductor layering and three-dimensional electronic circuits using the layering
02/28/2002US20020025602 Microelectronic assembly with pre-disposed fill material and associated method of manufacture
02/28/2002US20020025601 Apparatus for packaging semiconductor device and method for packaging the same
02/28/2002US20020025600 Laser decapsulation apparatus and method
02/28/2002US20020025599 Process to make a tall solder ball by placing a eutectic solder ball on top of a high lead solder ball
02/28/2002US20020025598 Lead frame tooling design for bleed barrier groove
02/28/2002US20020025594 Method for growing ZnO based oxide semiconductor layer and method for manufacturing semiconductor light emitting device using the same
02/28/2002US20020025592 Microelectronic component and method for fabricating a microelectronic component
02/28/2002US20020025591 Method of manufacturing a semiconductor device
02/28/2002US20020025588 Position detection mark and position detection method
02/28/2002US20020025587 Semiconductor device and method for manufacturing the same
02/28/2002US20020025585 Metal redistribution layer having solderable pads and wire bondable pads
02/28/2002US20020025495 Positive resist composition and base material carrying layer of the positive resist composition
02/28/2002US20020025482 Exposure method
02/28/2002US20020025479 Resolution
02/28/2002US20020025478 Phase shift mask blank, phase shift mask, and methods of manufacture
02/28/2002US20020025453 Perovskite mixed oxide
02/28/2002US20020025432 Process for producing a chip
02/28/2002US20020025417 Novel approach to structurally reinforcing the mechanical performance of silicon level interconnect layers
02/28/2002US20020025406 Metal mask structure and method for maufacturing thereof
02/28/2002US20020025391 Electrically conductive material is selected from the group of one or more of substituted and unsubstituted polyparaphenylene vinylenes, polyphenylenes, polyanilines, polythiophenes, polyphenylene sulfide, polyacetylenes, blends or copolymer
02/28/2002US20020025388 Apparatus includes a chamber, a wafer support, antennae, a control module for controlling the antennae and responsive to associated detectors, which are located in or adjacent the wafer
02/28/2002US20020025377 Method of producing a ferroelectric solid-state layer using an auxiliary substance
02/28/2002US20020025375 Substrate processing method
02/28/2002US20020025372 Method of forming an aluminum comprising line having a titanium nitride comprising layer thereon
02/28/2002US20020025288 Pyrolyzing silane compound to form a silica fine powder and hydrophobizing silica fine powder hydrophobizing the silica fine powder with an organohalosilane in a fluidization vessel
02/28/2002US20020025244 Transfer system and apparatus for workpiece containers and method of transferring the workpiece containers using the same
02/28/2002US20020025019 Exposure method
02/28/2002US20020024883 Method and system for mounting semiconductor device, semiconductor device separating system, and method for fabricating IC card
02/28/2002US20020024876 Semiconductor integrated circuit for which high voltage countermeasure was taken
02/28/2002US20020024875 Current driver configuration for MRAM
02/28/2002US20020024862 Nonvolatile semiconductor memory test circuit and method, nonvolatile semiconductor memory and method for fabricating nonvolatile semiconductor memory
02/28/2002US20020024860 Semiconductor memory device capable of high speed plural parallel test, method of data writing therefor and parallel tester
02/28/2002US20020024856 Semiconductor memory device
02/28/2002US20020024853 Semiconductor memory device
02/28/2002US20020024849 Nonvolatile semiconductor memory
02/28/2002US20020024848 Nonvolatile semiconductor memory
02/28/2002US20020024842 All metal giant magnetoresistive memory
02/28/2002US20020024841 Selective device coupling
02/28/2002US20020024831 Semiconductor memory device
02/28/2002US20020024741 Projection optical system and projection exposure apparatus
02/28/2002US20020024678 End point detector for etching equipment
02/28/2002US20020024671 Aligning method, aligner, and device manufacturing method
02/28/2002US20020024668 Method and apparatus for ellipsometric metrology for a sample contained in a chamber or the like
02/28/2002US20020024663 Method and apparatus for user guidance in optical inspection and measurement of thin films and substrates, and software therefore
02/28/2002US20020024650 Projection exposure apparatus, and device manufacturing method using the same
02/28/2002US20020024649 Exposure apparatus and method, device manufacturing method, and discharge lamp
02/28/2002US20020024648 Exposure apparatus and exposure method
02/28/2002US20020024646 Exposure apparatus and device manufacturing method using the same
02/28/2002US20020024643 Projection exposure apparatus having aberration measurement device
02/28/2002US20020024629 Electro-optical device
02/28/2002US20020024627 Liquid crystal display device and method of manufacturing the same
02/28/2002US20020024391 High-frequency semiconductor device
02/28/2002US20020024380 Internal voltage generating circuit
02/28/2002US20020024375 Compound semiconductor switching device for high frequency switching
02/28/2002US20020024352 Semiconductor integrated circuit with test points inserted thereinto
02/28/2002US20020024351 Method and apparatus for evaluating insulating film
02/28/2002US20020024348 Packaging and interconnection of contact structure
02/28/2002US20020024174 Ring chuck to hold 200 and 300 mm wafer
02/28/2002US20020024152 Semiconductor member, semiconductor device and manufacturing methods thereof
02/28/2002US20020024150 Etch stop in damascene interconnect structure and method of making
02/28/2002US20020024149 Semiconductor device having pads, the intervals of which are adjusted and arranged in semiconductor chip corners
02/28/2002US20020024148 Semiconductor device, designing method and designing device thereof
02/28/2002US20020024147 Low-pin-count chip package and manufacturing method thereof
02/28/2002US20020024146 Semiconductor device
02/28/2002US20020024145 Semiconductor device with a fluorinated silicate glass film as an interlayer metal dielectric film, and manufacturing method thereof
02/28/2002US20020024144 Bi-level digit line architecture for high density drams
02/28/2002US20020024142 Semiconductor device and manufacturing method of the same
02/28/2002US20020024141 Semiconductor device including a plurality of interconnection layers, manufacturing method thereof and method of designing semiconductor circuit used in the manufacturing method
02/28/2002US20020024140 Semiconductor device
02/28/2002US20020024139 Combined capping layer and ARC for CU interconnects
02/28/2002US20020024137 Method of securing solder balls and any components fixed to one and the same side of a substrate
02/28/2002US20020024136 Ring positionable about a periphery of a contact pad, semiconductor device components including same, and methods for positioning the ring around a contact pad
02/28/2002US20020024131 Hollow package and method for fabricating the same and solid-state image apparatus provided therewith
02/28/2002US20020024127 Semiconductor device and manufacture method of that
02/28/2002US20020024126 Integrated circuit, casting mold for producing an integrated module, method of producing an integrated circuit, and method of testing an integrated circuit
02/28/2002US20020024125 Semiconductor device and method for assembling the same
02/28/2002US20020024123 Low profile ball grid array package
02/28/2002US20020024121 A semiconductor package produced by solder plating without solder residue
02/28/2002US20020024119 Semiconductor device and method of manufacturing the same
02/28/2002US20020024118 Semiconductor device having a capacitor and a fabrication process thereof
02/28/2002US20020024114 Semiconductor device
02/28/2002US20020024113 Semiconductor device with a bipolar transistor, and method of manufacturing such a device
02/28/2002US20020024112 Semiconductor device
02/28/2002US20020024111 Shallow trench isolation type semiconductor device and method of forming the same
02/28/2002US20020024110 Semiconductor device using bumps, method for fabricating same, and method for forming bumps
02/28/2002US20020024108 Novel non-crystalline oxides for use in microelectronic, optical, and other applications
02/28/2002US20020024107 Semiconductor device and method of manufacturing the same