Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2002
03/05/2002US6352741 Planar high temperature superconductive integrated circuits for using ion implantation
03/05/2002US6352629 Coaxial electromagnet in a magnetron sputtering reactor
03/05/2002US6352623 Vertically configured chamber used for multiple processes
03/05/2002US6352620 Staged aluminum deposition process for filling vias
03/05/2002US6352611 Ceramic composition for an apparatus and method for processing a substrate
03/05/2002US6352596 Post CMP cleaning method using a brush cleaner with torque monitor
03/05/2002US6352595 Method and system for cleaning a chemical mechanical polishing pad
03/05/2002US6352594 Method and apparatus for improved chemical vapor deposition processes using tunable temperature controlled gas injectors
03/05/2002US6352593 Mini-batch process chamber
03/05/2002US6352592 Free floating shield and semiconductor processing system
03/05/2002US6352591 Methods and apparatus for shallow trench isolation
03/05/2002US6352589 Apparatus for spin-coating semiconductor substrate and method of doing the same
03/05/2002US6352580 Complexes having tris(pyrazolyl)borate ligands for forming films
03/05/2002US6352469 Polishing apparatus with slurry screening
03/05/2002US6352468 Lapping method and method for manufacturing lapping particles for use in the lapping method
03/05/2002US6352467 Integrated electrodeposition and chemical mechanical polishing tool
03/05/2002US6352466 Method and apparatus for wireless transfer of chemical-mechanical planarization measurements
03/05/2002US6352454 Wear-resistant spring contacts
03/05/2002US6352436 Self retained pressure connection
03/05/2002US6352423 Apparatus for underfilling semiconductor devices
03/05/2002US6352422 Method and apparatus for epoxy loc die attachment
03/05/2002US6352403 Controlled environment enclosure and mechanical interface
03/05/2002US6352399 Twin tower wafer boat loading system and method
03/05/2002US6352265 Seal ring using gas curtain
03/05/2002US6352197 Method and apparatus for wire-bonding for electric components
03/05/2002US6352191 Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
03/05/2002US6352084 Substrate treatment device
03/05/2002US6352083 Substrate treating apparatus and substrate treating method
03/05/2002US6352082 The cleaning enhancement substance dopes the liquid which is attached to the front face and the back face to cause a concentration gradient of the cleaning enhancement substance to accelerate fluid flow of the attached liquid
03/05/2002US6352081 Method of cleaning a semiconductor device processing chamber after a copper etch process
03/05/2002US6352073 Semiconductor manufacturing equipment
03/05/2002US6352050 Remote plasma mixer
03/05/2002US6352049 Plasma assisted processing chamber with separate control of species density
03/05/2002US6351925 Method of packing a semiconductor manufacturing apparatus to be carried into a clean room
03/05/2002US6351885 Method of making conductive bump on wiring board
03/05/2002US6351871 Aqueous quaternary ammonium hydroxide as a screening mask cleaner
03/05/2002CA2233543C Adjustable slit and method for varying line width
03/05/2002CA2086287C Method of manufacturing fusible links in semiconductor devices
02/2002
02/28/2002WO2002017694A1 Installation device
02/28/2002WO2002017438A1 Interposer for use in electronic packages
02/28/2002WO2002017411A1 Polishing apparatus comprising pad and polishing method using the same
02/28/2002WO2002017409A2 Method of fabricating thermally stable mtj cell and apparatus
02/28/2002WO2002017403A1 Memory cell array with ferroelectric capacitor, method for manufacturing the same, and ferroelectric memory device
02/28/2002WO2002017399A1 Semiconductor arrangement and method for production thereof
02/28/2002WO2002017398A1 Device for protecting an integrated circuit formed in a substrate
02/28/2002WO2002017397A1 Electronic element, method for producing an element of this type and a semiconductor element
02/28/2002WO2002017391A2 Method of manufacturing a semiconductor device and a support plate, and a semiconductor device obtained by means of said method
02/28/2002WO2002017389A2 Disposable spacer technology for device tailoring
02/28/2002WO2002017388A2 Method of improving the adhesion of copper
02/28/2002WO2002017387A2 Conductive material patterning methods
02/28/2002WO2002017386A1 Process for forming shallow isolating regions in an integrated circuit and an integrated circuit thus formed
02/28/2002WO2002017385A1 Semiconductor cofiguration and corresponding production process
02/28/2002WO2002017384A1 Electrostatic chuck temperature control method and system
02/28/2002WO2002017383A2 Flexure based translation stage
02/28/2002WO2002017382A1 Alignment device
02/28/2002WO2002017381A2 Method for preventing damage to wafers in a sequential multiple steps polishing process
02/28/2002WO2002017380A2 Selective flux deposition
02/28/2002WO2002017379A1 Semiconductor joining substrate-use tape with adhesive and copper-clad laminate sheet using it
02/28/2002WO2002017378A1 Mounting method and device
02/28/2002WO2002017376A1 Active-matrix liquid crystal display
02/28/2002WO2002017375A1 Vertical field-effect transistor and method for the production thereof
02/28/2002WO2002017374A1 Low-dielectric silicon nitride film and method of forming the same, semiconductor device and fabrication process thereof
02/28/2002WO2002017373A1 Super critical drying of low k materials
02/28/2002WO2002017372A1 Boron diffusion barrier layer and its use in semiconductor device fabrication
02/28/2002WO2002017371A1 Method for reducing semiconductor resistance, device for reducing semiconductor resistance and semiconductor element
02/28/2002WO2002017370A1 Method for producing a doped semiconductor material
02/28/2002WO2002017369A1 Method of fabricating group-iii nitride semiconductor crystal, metho of fabricating gallium nitride-based compound semiconductor, gallium nitride-based compound semiconductor, gallium nitride-based compound semiconductor light-emitting device, and light source using the semiconductor light-emitting device
02/28/2002WO2002017367A2 Semiconductor device having passive elements and method of making same
02/28/2002WO2002017366A1 Method and device for installation
02/28/2002WO2002017365A1 Low temperature processing of ferroelectric strontium bismuth tantalate layers and the production of ferroelectric components thereof
02/28/2002WO2002017364A2 Micromechanical multichip module and method of making same
02/28/2002WO2002017362A2 Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabricating such devices
02/28/2002WO2002017359A2 High carrier concentration p-type transparent conducting oxide films
02/28/2002WO2002017357A2 Three dimensional inspection of leaded ics
02/28/2002WO2002017356A2 Method and structure for adhering msq material to liner oxide
02/28/2002WO2002017355A2 Semiconductor wafer container cleaning apparatus
02/28/2002WO2002017354A2 Ring chuck to hold 200 and 300 mm wafer
02/28/2002WO2002017337A2 LOWER THERMAL BUDGET SiON BARRIER FOR MIS TANOX STACK CAPACITOR
02/28/2002WO2002017030A2 Methods and apparatus for obtaining data for process operation, optimization, monitoring, and control
02/28/2002WO2002017029A1 Arrangement for data transmission between an equipment for manufacturing of a semiconductor device and a communicating device and method for operating the arrangement
02/28/2002WO2002017019A2 Oxime sulfonate and n-oxyimidosulfonate photoacid generators and photoresists comprising same
02/28/2002WO2002016973A2 Electronic and optical devices and methods of forming these devices
02/28/2002WO2002016477A2 Organosilicate resins as hardmasks for organic polymer dielectrics in fabrication of microelectronic devices
02/28/2002WO2002016463A2 Polymers with high internal free volume
02/28/2002WO2002016079A1 Cmp device and production method for semiconductor device
02/28/2002WO2002016078A2 Polishing apparatus and methods controlling the polishing pressure as a function of the overlapping area between the polishing head and the semiconductor substrate
02/28/2002WO2002016075A2 Cmp apparatus with an oscillating polishing pad rotating in the opposite direction of the wafer
02/28/2002WO2002016063A2 Method for producing composite components by powder injection molding and composite powder appropriate for use in said method
02/28/2002WO2001088993A3 A METHOD FOR LOCALLY MODIFYING THE EFFECTIVE BANDGAP ENERGY IN INDIUM GALLIUM ARSENIDE PHOSPHIDE (InGaAsP) QUANTUM WELL STRUCTURES
02/28/2002WO2001086708A3 Amorphous metal oxide gate dielectric structure
02/28/2002WO2001084604A3 Method for producing an integrated capacitor
02/28/2002WO2001082344A3 Method of patterning lead zirconium titanate and barium strontium titanate
02/28/2002WO2001082343A3 Heat management in wafer processing equipment using thermoelectric device
02/28/2002WO2001075939A3 Method and apparatus for increased workpiece throughput
02/28/2002WO2001074958A3 Polishing agent and method for producing planar layers
02/28/2002WO2001074074A8 Techniques for controlling access to web content information and television content information using user modes
02/28/2002WO2001073854A3 Variable capacitor with programmability
02/28/2002WO2001071795A3 Method for forming high quality multiple thickness oxide layers by reducing descum induced defects
02/28/2002WO2001071781A3 Combination differential and absolute pressure transducer for load lock control
02/28/2002WO2001067465A3 Lead zirconate titanate dielectric thin film composites on metallic foils