| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 03/07/2002 | US20020027252 Dual-gate CMOS semiconductor device and dual-gate CMOS semiconductor device manufacturing method |
| 03/07/2002 | US20020027251 Semiconductor device |
| 03/07/2002 | US20020027250 A protective element formed in an soi substrate for preventing a breakdown in an oxide film located below a diffused resistor |
| 03/07/2002 | US20020027249 Semiconductor device and method for forming the same |
| 03/07/2002 | US20020027248 Laser fuseblow protection method for silicon on insulator (SOI) transistors |
| 03/07/2002 | US20020027247 Semiconductor device and method of manufacturing the same |
| 03/07/2002 | US20020027246 Semiconductor device |
| 03/07/2002 | US20020027245 Field effect transistor with reduced narrow channel effect |
| 03/07/2002 | US20020027244 Semiconductor device and method for fabricating the same |
| 03/07/2002 | US20020027243 Methods of forming field effect transistors |
| 03/07/2002 | US20020027241 Novel split-gate flash cell |
| 03/07/2002 | US20020027240 Semiconductor device and method of manufacturing the same |
| 03/07/2002 | US20020027239 CMOS image sensor and manufacturing method thereof |
| 03/07/2002 | US20020027233 Semiconductor device, microcomputer and flash memory |
| 03/07/2002 | US20020027232 Hbt having a carbon-doped gaasbsb base contact layer |
| 03/07/2002 | US20020027229 Light emitting module and method of driving the same, and optical sensor |
| 03/07/2002 | US20020027227 Semiconductor memory device having a trench and a gate electrode vertically formed on a wall of the trench |
| 03/07/2002 | US20020027226 Semiconductor integrated circuit device equipped with power make-up circuit used in burn-in test after packaging and method for testing the same |
| 03/07/2002 | US20020027204 Electron beam exposure apparatus, device for shaping a beam of charged particles and method for manufacturing the device |
| 03/07/2002 | US20020027198 Method and apparatus for charged particle beam exposure |
| 03/07/2002 | US20020027189 Solid-state image pick-up device and image pick-up method therefor |
| 03/07/2002 | US20020027152 Wire bonding apparatus |
| 03/07/2002 | US20020027151 Wire bonding method and wire bonding apparatus |
| 03/07/2002 | US20020027138 Magnetic secured container closure with release by movement of magnetic member |
| 03/07/2002 | US20020027124 Fabricating nanometer-scale active electronic device; attaching bio-links to substrate to form functionalized substrate; bringing functionalized nanometer-scale active electronic device within close proximity of electronic device |
| 03/07/2002 | US20020027084 Supplying deionized water into an anode cell and a cathode cell of a 3-cell electrolyzer; filling intermediate cell with an electrolytic aqueous solution to perform electrolysis, cells of electrolyzer are divided by ion exchange membranes |
| 03/07/2002 | US20020027022 Front-and-back electrically conductive substrate and method for manufacturing same |
| 03/07/2002 | US20020027010 Plastic integrated circuit device package having exposed lead surface |
| 03/07/2002 | US20020027000 Substrate temperature adjustment apparatus |
| 03/07/2002 | US20020026985 Etching device |
| 03/07/2002 | US20020026984 By which a predetermined number of flat workpieces may be parallel processed, whereby the number of operating cycles for such treatment is minimalized so as to reach optimal short throughput times with optimal low handling |
| 03/07/2002 | US20020026983 Method and apparatus for controlling the temperature of a gas distribution plate in a process reactor |
| 03/07/2002 | US20020026978 Multilayer ceramic substrate and manufacturing method therefor |
| 03/07/2002 | US20020026976 For cleaning in the manufacturing of semiconductor devices, liquid crystal display panels |
| 03/07/2002 | US20020026952 Dipping the silicon wafer in a cleaning solution comprising an aqueous solution containing low concentration hydrogen fluoride and hydrogen peroxide while applying ultrasonic vibration to the silicon wafer |
| 03/07/2002 | US20020026951 Method and apparatus for removing processing liquid from a processing liquid delivery line |
| 03/07/2002 | US20020026931 Semiconductor manufacturing equipment |
| 03/07/2002 | US20020026900 Depolymerization of starch particles, heating, acidolysis and spray drying to form starch hydrolzylates having heat and enzyme resistance, used for tablets, dietery fiber, fat substitutes and antiicing agents |
| 03/07/2002 | US20020026896 Solution treatment apparatus |
| 03/07/2002 | US20020026894 Coating film forming method and coating apparatus |
| 03/07/2002 | US20020026893 Ideal oxygen precipitating epitaxial silicon wafers and oxygen out-diffusion-less process therefor |
| 03/07/2002 | US20020026892 Impurity doping method for semiconductor as well as system therefor and semiconductor materials prepared thereby |
| 03/07/2002 | US20020026878 Method for calibrating a lithographic projection apparatus and apparatus capable of applying such a method |
| 03/07/2002 | US20020026856 Thin films; thermoconductivity, electrical resistance |
| 03/07/2002 | US20020026729 Method and apparatus for high-pressure wafer processing and drying |
| 03/07/2002 | US20020026728 Processing method for substrate |
| 03/07/2002 | US20020026708 Method of fabricating temperature control device |
| 03/07/2002 | US20020026703 Method for mounting parts, and IC card and manufacturing method thereof |
| 03/07/2002 | DE10139755A1 Forming marking for measuring alignment of more than two layers of semiconductor wafer by matching discontinuity in respective patterns |
| 03/07/2002 | DE10139111A1 Verfahren für das Verbinden eines leitfähigen Klebers und einer Elektrode sowie einer verbundenen Struktur A method of bonding a conductive adhesive and an electrode as well as a connected structure |
| 03/07/2002 | DE10135351A1 Resist layer exposure for semiconductors, involves exposing resist layer comprising polymeric material satisfying preset relation between oxygen content ratio and density, with specific rays |
| 03/07/2002 | DE10134484A1 Verfahren zur Verhinderung eines Biegens von Halbleiterschichten und anhand des Verfahrens hergestellte Halbleitervorrichtung A method for preventing bending of the semiconductor layer and produced by the method semiconductor device |
| 03/07/2002 | DE10133443A1 Halbleiterschaltungsanordnung mit Energiezufuhr- und Masseleitungen, angepasst für Hochfrequenzbetrieb Semiconductor circuitry with Energiezufuhr- and ground lines adapted for high-frequency operation |
| 03/07/2002 | DE10132668A1 Halbleitervorrichtung mit definierter Eingangs- /Ausgangsblockgröße und Verfahren zu deren Entwicklung A semiconductor device having a defined input / output block size, and methods for their development |
| 03/07/2002 | DE10132433A1 Semiconductor wafer treatment method, involves removing deposits from periphery and rear-face of semiconductor wafer during each optional step in treatment processes |
| 03/07/2002 | DE10131246A1 Method for producing a semiconducter wafer with asymmetric edges involves fixing wafer onto rotating table and offsetting rotating machining tool with respect to centerline of wafer |
| 03/07/2002 | DE10128387A1 Integrierter Mikrokontakt-Pin und Verfahren zu dessen Herstellung Integrated micro-contact pin and method for its production |
| 03/07/2002 | DE10048881A1 Device for planar joining of two wafers e.g. for thin grinding and separation of product-wafer, has product wafer arranged surface-congruently over carrier wafer |
| 03/07/2002 | DE10043213C1 Scrubber washing polishing slurry from wafer using de-ionized water, has upper and lower, mirror-symmetrical gear boxes driving brushes sandwiching wafer |
| 03/07/2002 | DE10041872A1 Production of substrates used for electronic circuits comprises electroplating copper layers on a support and processing to leave circuit lines |
| 03/07/2002 | DE10041694A1 Production of a semiconductor thin housing used for flat displays and mobile telephones comprises fixing a chip on a substrate, contacting a gold wire between an aluminum pad on the substrate and the chip, etc. |
| 03/07/2002 | DE10041285A1 Verfahren zur Epitaxie von (Indium, Aluminium, Gallium)-nitrid-Schichten auf Fremdsubstraten A process for the epitaxial growth of (indium, aluminum, gallium) nitride layers on foreign substrates |
| 03/07/2002 | DE10041194A1 Verfahren zur Herstellung von Verbundbauteilen durch Pulver-Spritzgießen und dazu geeignete Verbundpulver Process for the production of composite components by powder injection molding and to appropriate composite powder |
| 03/07/2002 | DE10041040A1 Vorrichtung und Verfahren zur Belichtung einer strahlungsempfindlichen Schicht mittels geladener Teilchen sowie Maske hierfür Apparatus and method for exposing a radiation-sensitive layer by means of charged particles as well as mask for this |
| 03/07/2002 | DE10040465A1 Prozessführung für eine Metall/Metall-Kontaktherstellung Litigation for a metal / metal contact manufacturing |
| 03/07/2002 | DE10040458A1 Vertikaler Feldeffekt-Transistor und Verfahren zu dessen Herstellung Vertical field effect transistor and method of producing the |
| 03/07/2002 | DE10040450A1 Cooling element used for semiconductor elements comprises an electrically insulating plate-like support with regions formed on one main surface for receiving a semiconductor body |
| 03/07/2002 | DE10039710A1 Verfahren zur Herstellung passiver Bauelemente auf einem Halbleitersubstrat A process for the production of passive components on a semiconductor substrate |
| 03/07/2002 | DE10038330A1 Lötverfahren zur Befestigung elektrischer Bauelemente Soldering for mounting electrical components |
| 03/07/2002 | DE10037447A1 Verfahren und Anordnung zum Einstellen der elektrischen Eigenschaften mikroelektronischer Schaltungsanordnungen sowie Verwendung eines mikroelektronischen Schaltungselements Method and arrangement for adjusting the electrical properties of microelectronic circuits and the use of a microelectronic circuit element |
| 03/07/2002 | CA2417236A1 Method of forming a pre-metal dielectric film on a semiconductor substrate |
| 03/06/2002 | EP1185145A1 Ceramic heater |
| 03/06/2002 | EP1185144A1 Hot plate and conductive paste |
| 03/06/2002 | EP1185143A1 Hot plate and conductor paste |
| 03/06/2002 | EP1184979A2 Radio frequency module parts including surface elastic wave elements and manufacturing method thereof |
| 03/06/2002 | EP1184913A1 Nitride semiconductor device and its manufacturino method |
| 03/06/2002 | EP1184910A2 Field plated resistor with enhanced routing area thereover |
| 03/06/2002 | EP1184909A2 Method of manufacturing an integrated circuit |
| 03/06/2002 | EP1184908A2 Field effect transistor |
| 03/06/2002 | EP1184907A1 Method for making a bipolar transistor with a low dielectric constant material in emitter base spacer regions |
| 03/06/2002 | EP1184906A1 Method and structure to make planar analog capacitor on the top of a STI structure |
| 03/06/2002 | EP1184903A1 Method for forming a self-aligned dual damascene interconnection, and formed structure |
| 03/06/2002 | EP1184902A1 Method for forming an isolation trench in a SOI substrate |
| 03/06/2002 | EP1184901A1 Method of manufacturing semiconductor integrated circuit having multilayer wiring structure |
| 03/06/2002 | EP1184900A2 Battery management circuit with power mosfets and manufacturing method thereof |
| 03/06/2002 | EP1184899A2 Heat conductive adhesive film and manufacturing method thereof and electronic component |
| 03/06/2002 | EP1184898A1 Method and apparatus for forming thin film of metal |
| 03/06/2002 | EP1184897A1 Semiconductor base and its manufacturing method, and semiconductor crystal manufacturing method |
| 03/06/2002 | EP1184896A1 Pattern matching method and device, position determining method and device, position aligning method and device, exposing method and device, and device and its production method |
| 03/06/2002 | EP1184895A2 Substrate processing apparatus and substrate inspection method |
| 03/06/2002 | EP1184894A1 Susceptor for semiconductor wafers |
| 03/06/2002 | EP1184891A1 Electron beam lithography |
| 03/06/2002 | EP1184876A2 Semiconductor memory |
| 03/06/2002 | EP1184875A2 Circuit and method for accelerating the aging of a MRAM |
| 03/06/2002 | EP1184874A2 On-chip trim link sensing and latching circuit for fuse links |
| 03/06/2002 | EP1184871A1 MRAM memory device |
| 03/06/2002 | EP1184870A1 Electronic driving circuit for memory word lines and memory device |
| 03/06/2002 | EP1184868A2 Semiconductor memory |
| 03/06/2002 | EP1184833A2 Method of driving EL display device |
| 03/06/2002 | EP1184807A1 IC card and method for manufacture |