Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2002
03/06/2002EP1184763A1 Arrangement for data transmission between an equipment for manufacturing of a semiconductor device and a communicating device and method for operating the arrangement
03/06/2002EP1184725A1 Method for adjusting a lithographic tool
03/06/2002EP1184723A2 Negative resist composition, process for forming resist patterns, and process for manufacturing electronic device
03/06/2002EP1184683A1 X-ray plane detector
03/06/2002EP1184489A2 Impurity doping method for semiconductor as well as system therefor and semiconductor materials prepared thereby
03/06/2002EP1184488A2 An apparatus for fabricating a III-V nitride film and a method for fabricating the same
03/06/2002EP1184485A1 MOCVD precursors in mixed solvents
03/06/2002EP1184483A2 Thin-film formation system and thin-film formation process
03/06/2002EP1184425A1 Method for producing hydrophobic silica fine powder
03/06/2002EP1184419A2 Resin composition for selaing semiconductor, semiconductor device using the same semiconductor wafer and mounted structure of semiconductor device
03/06/2002EP1184355A1 METHOD FOR MANUFACTURING Si-SiC MEMBER FOR SEMICONDUCTOR HEAT TREATMENT
03/06/2002EP1184091A1 Wet treatment apparatus
03/06/2002EP1183761A2 Semiconductor structures having a strain compensated layer and method of fabrication
03/06/2002EP1183735A1 Non-volatile semiconductor memory cell, comprising a metal-oxide dielectric and a method for producing the same
03/06/2002EP1183734A1 Lateral dmos improved breakdown structure and method
03/06/2002EP1183732A1 Semiconductor device and method of manufacturing the same
03/06/2002EP1183731A1 Semiconductor devices
03/06/2002EP1183730A2 Improved integrated oscillators and tuning circuits
03/06/2002EP1183729A1 Method and apparatus using silicide layer for protecting integrated circuits from reverse engineering
03/06/2002EP1183728A1 Semiconductor storage component with storage cells, logic areas and filling structures
03/06/2002EP1183727A1 SEMICONDUCTOR DEVICE WITH AN INTEGRATED CMOS CIRCUIT WITH MOS TRANSISTORS HAVING SILICON-GERMANIUM (Si 1-x?Ge x?) GATE ELECTRODES, AND METHOD OF MANUFACTURING SAME
03/06/2002EP1183726A1 Method for handling thinned chips for introducing them into chip cards
03/06/2002EP1183725A1 Semiconductor device and method of manufacturing same
03/06/2002EP1183724A1 A method of manufacturing a semiconductor device
03/06/2002EP1183723A1 Circuit suitable for vertical integration and method of producing same
03/06/2002EP1183722A1 Apparatus and method for reducing differential sputter rates
03/06/2002EP1183721A1 Low temperature sacrificial oxide formation
03/06/2002EP1183720A1 Method for cleaning a silicon substrate surface and use for making integrated electronic components
03/06/2002EP1183719A1 Scalable lead zirconium titanate (pzt) thin film material and deposition method, and ferroelectric memory device structures comprising such thin film material
03/06/2002EP1183718A1 Non-volatile semiconductor memory cell and method for its production
03/06/2002EP1183717A1 Method for the growth of a thin silicon oxide layer on a silicon substrate surface and double reactor machine
03/06/2002EP1183716A1 Substrate support for plasma processing
03/06/2002EP1183715A2 System for processing wafers
03/06/2002EP1183714A1 Method for transferring elements and device enabling said transfer
03/06/2002EP1183713A1 Wafer orientation sensor
03/06/2002EP1183712A1 Handling thin workpieces
03/06/2002EP1183708A1 Method and apparatus for real-time correction of resist heating in lithography
03/06/2002EP1183707A1 Apparatus and methods for secondary electron emission microscopy with dual beam
03/06/2002EP1183684A2 Reactive ion beam etching method and a thin film head fabricated using the method
03/06/2002EP1183642A1 Integrated circuit device which is secured against attacks resulting from controlled destruction of an additional layer
03/06/2002EP1183604A2 Test interface for electronic circuirts
03/06/2002EP1183555A1 Hydrophone assembly
03/06/2002EP1183546A2 Low power scan flipflop
03/06/2002EP1183406A1 Sequential chemical vapor deposition
03/06/2002EP1019914B1 Nand-type floating gate memory device with dual source side select transistors and programming method
03/06/2002EP1016118B1 Apparatus and method for improved scanning efficiency in an ion implanter
03/06/2002EP1015220A4 Injection molding encapsulation for an electronic device directly onto a substrate
03/06/2002EP0778584B1 Semiconductor integrated circuit device with large-scale memory and controller embedded on one semiconductor chip, and method of testing the device
03/06/2002EP0746875B1 Method of manufacturing semiconductor devices with semiconductor elements formed in a layer of semiconductor material glued on a support wafer
03/06/2002EP0715769B1 Self-aligned cmos process
03/06/2002EP0601093B1 Igbt process using platinum for lifetime control
03/06/2002CN2480985Y Tool for semiconductor element test
03/06/2002CN2480984Y Wafe lifting device for platform of etching machine
03/06/2002CN2480983Y Quick taking/setting mechanism
03/06/2002CN1339176A Semiconductor device, method and device for producing same, circuit board and electronic equipment
03/06/2002CN1339174A Electronic parts mounting method and device therefor
03/06/2002CN1339173A Lateral field effect transistor of sic, method for production thereof and a use of such a transistor
03/06/2002CN1339172A Semiconductor device having self-aligned contact structure and methods of forming same
03/06/2002CN1339160A Semiconductor integrated circuit and nonvolatile memory element
03/06/2002CN1339055A Adhesive, electrode-connecting structure, and method of connecting electrodes
03/06/2002CN1338892A Solder ball releaser
03/06/2002CN1338880A Photoelectric device and electronic apparatus
03/06/2002CN1338782A Method for forming films
03/06/2002CN1338781A Insulated gate semiconductor device and manufacture thereof
03/06/2002CN1338780A Protector with thristor rectifier
03/06/2002CN1338779A 半导体器件 Semiconductor devices
03/06/2002CN1338777A Thin semiconductor device and its preparing process
03/06/2002CN1338776A Process for selectively preparing semispherical silicon grain
03/06/2002CN1338775A Semiconductor device and manufacture thereof, substrate of electric circuits and electronic device
03/06/2002CN1338774A Process for preparing lower electrode of capacitor in memory
03/06/2002CN1338773A Method for packing miniature semiconductor chip
03/06/2002CN1338772A Method for reducing electromigration
03/06/2002CN1338771A Method for cleaning semiconductor wafer
03/06/2002CN1338770A Manufacture of film semiconductor device
03/06/2002CN1338756A Device for no-loss writing magnetoresistive RAM
03/06/2002CN1338755A Optimum conductive body layout for writing magnet RAM with improved performance
03/06/2002CN1080459C Method of forming charge-storage electrode of semiconductor device
03/06/2002CN1080458C Mask for detecting defect
03/06/2002CN1080457C Method for making field effect transistor
03/06/2002CN1080456C High speed ashing method
03/06/2002CN1080454C Cleaning method and system of semiconductor substrate and production method of cleaning liquid
03/06/2002CN1080453C Light emitting device, wafer for light emitting device, and method of preparing same
03/06/2002CN1080166C Method of and apparatus for polishing wafer
03/05/2002US6353916 Timing analysis method for use in verification of operating speed of semiconductor integrated circuits
03/05/2002US6353841 Reconfigurable processor devices
03/05/2002US6353550 Ferroelectric memory device
03/05/2002US6353470 Microlithography reduction objective and projection exposure apparatus
03/05/2002US6353355 Semiconductor device enabling high-speed generation of internal power-supply potential at the time of power on
03/05/2002US6353353 Integrated semiconductor circuit with improved power supply control
03/05/2002US6353328 Test system with mechanical alignment for semiconductor chip scale packages and dice
03/05/2002US6353312 Method for positioning a semiconductor die within a temporary package
03/05/2002US6353269 Method for making cost-effective embedded DRAM structures compatible with logic circuit processing
03/05/2002US6353268 Semiconductor die attachment method and apparatus
03/05/2002US6353267 Semiconductor device having first and second sealing resins
03/05/2002US6353266 Semiconductor device having improved pad coupled to wiring on semiconductor substrate
03/05/2002US6353265 Semiconductor device
03/05/2002US6353263 Semiconductor device and manufacturing method thereof
03/05/2002US6353262 Circuit substrate, detector, and method of manufacturing the same
03/05/2002US6353261 Method and apparatus for reducing interconnect resistance using an interconnect well
03/05/2002US6353260 Effective diffusion barrier