Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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03/12/2002 | US6355514 Dual bit isolation scheme for flash devices |
03/12/2002 | US6355513 Asymmetric depletion region for normally off JFET |
03/12/2002 | US6355512 Method for producing semiconductor device |
03/12/2002 | US6355511 Method of providing a frontside contact to substrate of SOI device |
03/12/2002 | US6355510 Method for manufacturing a thin film transistor for protecting source and drain metal lines |
03/12/2002 | US6355509 Removing a crystallization catalyst from a semiconductor film during semiconductor device fabrication |
03/12/2002 | US6355507 Method of forming overmolded chip scale package and resulting product |
03/12/2002 | US6355504 Electrical interconnections, methods of conducting electricity, and methods of reducing horizontal conductivity within an anisotropic conductive adhesive |
03/12/2002 | US6355502 Semiconductor package and method for making the same |
03/12/2002 | US6355501 Three-dimensional chip stacking assembly |
03/12/2002 | US6355500 Semiconductor device and manufacturing method thereof |
03/12/2002 | US6355499 Method of making ball grid array package |
03/12/2002 | US6355497 Removable large area, low defect density films for led and laser diode growth |
03/12/2002 | US6355495 Method and apparatus for analyzing minute foreign substance, and process for semiconductor elements or liquid crystal elements by use thereof |
03/12/2002 | US6355494 Method and apparatus for controlling material removal from a semiconductor substrate using induced current endpointing |
03/12/2002 | US6355493 Method for forming IC's comprising a highly-resistive or semi-insulating semiconductor substrate having a thin, low resistance active semiconductor layer thereon |
03/12/2002 | US6355492 Forming layer of ruthenium or iridium, including yttrium or yttrium oxide, oxidizing surface in diffusion controlling reaction by heat treating in pressurized oxidizing atmosphere, forming oxide of electrode in interface to insulation layer |
03/12/2002 | US6355399 One step dual damascene patterning by gray tone mask |
03/12/2002 | US6355387 Method of making a mask pattern |
03/12/2002 | US6355385 Providing a silicon substrate comprising an active silicon layer on silicon support portion; forming a wet-etching mask; wet-etching the silicon support portion, exposed in the openings; forming protective film; annealing, removing film |
03/12/2002 | US6355383 Electron-beam exposure system, a mask for electron-beam exposure and a method for electron-beam exposure |
03/12/2002 | US6355382 Photomask and exposure method using a photomask |
03/12/2002 | US6355299 Depositing a first material over a substrate comprising conductive components; forming cavities within the deposited first material; transforming deposited first material into an insulative second material |
03/12/2002 | US6355199 Method of molding flexible circuit with molded stiffener |
03/12/2002 | US6355184 Method of eliminating agglomerate particles in a polishing slurry |
03/12/2002 | US6355183 Apparatus and method for plasma etching |
03/12/2002 | US6355182 High selectivity etching process for oxides |
03/12/2002 | US6355181 Method and apparatus for manufacturing a micromechanical device |
03/12/2002 | US6355153 Chip interconnect and packaging deposition methods and structures |
03/12/2002 | US6355147 Porous electrode apparatus for electrodeposition of detailed metal structures or microelectronic interconnections |
03/12/2002 | US6355111 Method for removing contaminants from a workpiece using a chemically reactive additive |
03/12/2002 | US6355109 Vacuum processing apparatus |
03/12/2002 | US6355106 Deposition of copper with increased adhesion |
03/12/2002 | US6355105 Protecting photoresist coating system by photochopper sensor |
03/12/2002 | US6355075 Polishing composition |
03/12/2002 | US6354922 Polishing apparatus |
03/12/2002 | US6354916 Modified plating solution for plating and planarization and process utilizing same |
03/12/2002 | US6354915 Hydrophilic polishing material; sufficiently thin to generally improve predictability and polishing performance. polishing surface comprising a plurality of nanoasperities |
03/12/2002 | US6354913 Abrasive and method for polishing semiconductor substrate |
03/12/2002 | US6354912 Workpiece cutting method for use with dicing machine |
03/12/2002 | US6354908 Method and apparatus for detecting a planarized outer layer of a semiconductor wafer with a confocal optical system |
03/12/2002 | US6354832 Substrate processing apparatus and substrate processing method |
03/12/2002 | US6354794 Method for automatically transferring wafers between wafer holders in a liquid environment |
03/12/2002 | US6354792 IC receiving tray storage device and mounting apparatus for the same |
03/12/2002 | US6354791 Water lift mechanism with electrostatic pickup and method for transferring a workpiece |
03/12/2002 | US6354789 Article feeding apparatus |
03/12/2002 | US6354781 Semiconductor manufacturing system |
03/12/2002 | US6354601 Seal for wafer containers |
03/12/2002 | US6354480 Apparatus for positioning a thin plate |
03/12/2002 | US6354474 Apparatus for measuring valve dispensing time and method of using the same |
03/12/2002 | US6354445 Rack holding device |
03/12/2002 | US6354313 Apparatus for rinsing and drying semiconductor wafers in a chamber with a movable side wall |
03/12/2002 | US6354311 Substrate drying apparatus and substrate processing apparatus |
03/12/2002 | US6354309 Process for treating a semiconductor substrate |
03/12/2002 | US6354285 Attachment for a dicing saw |
03/12/2002 | US6354241 Heated electrostatic particle trap for in-situ vacuum line cleaning of a substrated processing |
03/12/2002 | US6354240 Plasma etch reactor having a plurality of magnets |
03/12/2002 | CA2286193C Nonvolatile memory |
03/12/2002 | CA2233115C Semiconductor substrate and method of manufacturing the same |
03/11/2002 | CA2357177A1 Fluid control apparatus and gas treatment system comprising same |
03/07/2002 | WO2002019783A1 Circuit board unit and method of manufacture thereof |
03/07/2002 | WO2002019781A1 Electromagnetic radiation generation using a laser produced plasma |
03/07/2002 | WO2002019443A1 Organic field effect transistor, method for structuring an ofet and integrated circuit |
03/07/2002 | WO2002019435A1 A spin filter and a memory using such a spin filter |
03/07/2002 | WO2002019434A1 Trench igbt |
03/07/2002 | WO2002019432A2 Trench mosfet with structure having low gate charge |
03/07/2002 | WO2002019431A2 Method and device to reduce gate-induced drain leakage (gidl) current in thin gate oxide mosfets |
03/07/2002 | WO2002019428A1 Cluster globular semiconductor device |
03/07/2002 | WO2002019426A1 Method for producing an antifuse and antifuse for allowing selective electrical connection of neighbouring conductive zones |
03/07/2002 | WO2002019422A2 Method for manufacturing diode subassemblies used in rectifier assemblies of engine driven generators |
03/07/2002 | WO2002019421A1 Dram fabricated on a silicon-on-insulator (soi) substrate having bi-level digit lines |
03/07/2002 | WO2002019420A2 Fabrication of semiconductor devices with air gaps for ultra low capacitance interconnection structures |
03/07/2002 | WO2002019419A2 Substractive metallization structure and method of making |
03/07/2002 | WO2002019418A2 Method for achieving copper fill of high aspect ratio interconnect features |
03/07/2002 | WO2002019417A1 Method for forming a self-aligned dual damascene interconnection,and formed structure |
03/07/2002 | WO2002019416A1 Method of manufacturing a semiconductor device having a porous dielectric layer and air gaps |
03/07/2002 | WO2002019415A1 Overlay marks, methods of overlay mark design and methods of overlay measurements |
03/07/2002 | WO2002019414A1 Methods of inspecting and manufacturing silicon wafer, method of manufacturing semiconductor device, and silicon wafer |
03/07/2002 | WO2002019413A1 An exposed paddle leadframe for semiconductor die packaging |
03/07/2002 | WO2002019412A1 A method of forming a bottom-gate thin film transistor |
03/07/2002 | WO2002019411A2 Method of forming a pre-metal dielectric film on a semiconductor substrate |
03/07/2002 | WO2002019410A1 Porous siliceous film having low permittivity, semiconductor devices and coating composition |
03/07/2002 | WO2002019409A2 Method for selective etching of oxides |
03/07/2002 | WO2002019408A2 Method of etching carbon-containing silicon oxide films |
03/07/2002 | WO2002019407A2 A method for spatial distribution of chemical groups on a semiconductor surface |
03/07/2002 | WO2002019405A1 Polishing device |
03/07/2002 | WO2002019404A1 Method of processing silicon single crystal ingot |
03/07/2002 | WO2002019403A1 Composite structure for electronic microsystems and method for production of said composite structure |
03/07/2002 | WO2002019400A1 Ceramic heater for semiconductor manufacturing and inspecting equipment |
03/07/2002 | WO2002019399A1 Ceramic substrate for semiconductor production and inspection |
03/07/2002 | WO2002019398A2 Planarization of metal container structures |
03/07/2002 | WO2002019397A2 Keyed wafer lift system |
03/07/2002 | WO2002019396A1 Damascene double gated transistors and related manufacturing methods |
03/07/2002 | WO2002019395A1 Ion-ion plasma processing with bias modulation sychronized to time-modulated discharges |
03/07/2002 | WO2002019394A1 Wafer alignment system and method |
03/07/2002 | WO2002019393A2 Method of processing a semiconductor wafer |
03/07/2002 | WO2002019392A1 A method and device for docking a substrate carrier to a process tool |
03/07/2002 | WO2002019391A2 Apparatus and method for floe of process gas in an ultra-clean environment |
03/07/2002 | WO2002019389A2 Epitaxial template and barrier for the integration of functional thin film heterostructures on silicon |
03/07/2002 | WO2002019386A2 High density mram cell array |