Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2002
03/12/2002US6355514 Dual bit isolation scheme for flash devices
03/12/2002US6355513 Asymmetric depletion region for normally off JFET
03/12/2002US6355512 Method for producing semiconductor device
03/12/2002US6355511 Method of providing a frontside contact to substrate of SOI device
03/12/2002US6355510 Method for manufacturing a thin film transistor for protecting source and drain metal lines
03/12/2002US6355509 Removing a crystallization catalyst from a semiconductor film during semiconductor device fabrication
03/12/2002US6355507 Method of forming overmolded chip scale package and resulting product
03/12/2002US6355504 Electrical interconnections, methods of conducting electricity, and methods of reducing horizontal conductivity within an anisotropic conductive adhesive
03/12/2002US6355502 Semiconductor package and method for making the same
03/12/2002US6355501 Three-dimensional chip stacking assembly
03/12/2002US6355500 Semiconductor device and manufacturing method thereof
03/12/2002US6355499 Method of making ball grid array package
03/12/2002US6355497 Removable large area, low defect density films for led and laser diode growth
03/12/2002US6355495 Method and apparatus for analyzing minute foreign substance, and process for semiconductor elements or liquid crystal elements by use thereof
03/12/2002US6355494 Method and apparatus for controlling material removal from a semiconductor substrate using induced current endpointing
03/12/2002US6355493 Method for forming IC's comprising a highly-resistive or semi-insulating semiconductor substrate having a thin, low resistance active semiconductor layer thereon
03/12/2002US6355492 Forming layer of ruthenium or iridium, including yttrium or yttrium oxide, oxidizing surface in diffusion controlling reaction by heat treating in pressurized oxidizing atmosphere, forming oxide of electrode in interface to insulation layer
03/12/2002US6355399 One step dual damascene patterning by gray tone mask
03/12/2002US6355387 Method of making a mask pattern
03/12/2002US6355385 Providing a silicon substrate comprising an active silicon layer on silicon support portion; forming a wet-etching mask; wet-etching the silicon support portion, exposed in the openings; forming protective film; annealing, removing film
03/12/2002US6355383 Electron-beam exposure system, a mask for electron-beam exposure and a method for electron-beam exposure
03/12/2002US6355382 Photomask and exposure method using a photomask
03/12/2002US6355299 Depositing a first material over a substrate comprising conductive components; forming cavities within the deposited first material; transforming deposited first material into an insulative second material
03/12/2002US6355199 Method of molding flexible circuit with molded stiffener
03/12/2002US6355184 Method of eliminating agglomerate particles in a polishing slurry
03/12/2002US6355183 Apparatus and method for plasma etching
03/12/2002US6355182 High selectivity etching process for oxides
03/12/2002US6355181 Method and apparatus for manufacturing a micromechanical device
03/12/2002US6355153 Chip interconnect and packaging deposition methods and structures
03/12/2002US6355147 Porous electrode apparatus for electrodeposition of detailed metal structures or microelectronic interconnections
03/12/2002US6355111 Method for removing contaminants from a workpiece using a chemically reactive additive
03/12/2002US6355109 Vacuum processing apparatus
03/12/2002US6355106 Deposition of copper with increased adhesion
03/12/2002US6355105 Protecting photoresist coating system by photochopper sensor
03/12/2002US6355075 Polishing composition
03/12/2002US6354922 Polishing apparatus
03/12/2002US6354916 Modified plating solution for plating and planarization and process utilizing same
03/12/2002US6354915 Hydrophilic polishing material; sufficiently thin to generally improve predictability and polishing performance. polishing surface comprising a plurality of nanoasperities
03/12/2002US6354913 Abrasive and method for polishing semiconductor substrate
03/12/2002US6354912 Workpiece cutting method for use with dicing machine
03/12/2002US6354908 Method and apparatus for detecting a planarized outer layer of a semiconductor wafer with a confocal optical system
03/12/2002US6354832 Substrate processing apparatus and substrate processing method
03/12/2002US6354794 Method for automatically transferring wafers between wafer holders in a liquid environment
03/12/2002US6354792 IC receiving tray storage device and mounting apparatus for the same
03/12/2002US6354791 Water lift mechanism with electrostatic pickup and method for transferring a workpiece
03/12/2002US6354789 Article feeding apparatus
03/12/2002US6354781 Semiconductor manufacturing system
03/12/2002US6354601 Seal for wafer containers
03/12/2002US6354480 Apparatus for positioning a thin plate
03/12/2002US6354474 Apparatus for measuring valve dispensing time and method of using the same
03/12/2002US6354445 Rack holding device
03/12/2002US6354313 Apparatus for rinsing and drying semiconductor wafers in a chamber with a movable side wall
03/12/2002US6354311 Substrate drying apparatus and substrate processing apparatus
03/12/2002US6354309 Process for treating a semiconductor substrate
03/12/2002US6354285 Attachment for a dicing saw
03/12/2002US6354241 Heated electrostatic particle trap for in-situ vacuum line cleaning of a substrated processing
03/12/2002US6354240 Plasma etch reactor having a plurality of magnets
03/12/2002CA2286193C Nonvolatile memory
03/12/2002CA2233115C Semiconductor substrate and method of manufacturing the same
03/11/2002CA2357177A1 Fluid control apparatus and gas treatment system comprising same
03/07/2002WO2002019783A1 Circuit board unit and method of manufacture thereof
03/07/2002WO2002019781A1 Electromagnetic radiation generation using a laser produced plasma
03/07/2002WO2002019443A1 Organic field effect transistor, method for structuring an ofet and integrated circuit
03/07/2002WO2002019435A1 A spin filter and a memory using such a spin filter
03/07/2002WO2002019434A1 Trench igbt
03/07/2002WO2002019432A2 Trench mosfet with structure having low gate charge
03/07/2002WO2002019431A2 Method and device to reduce gate-induced drain leakage (gidl) current in thin gate oxide mosfets
03/07/2002WO2002019428A1 Cluster globular semiconductor device
03/07/2002WO2002019426A1 Method for producing an antifuse and antifuse for allowing selective electrical connection of neighbouring conductive zones
03/07/2002WO2002019422A2 Method for manufacturing diode subassemblies used in rectifier assemblies of engine driven generators
03/07/2002WO2002019421A1 Dram fabricated on a silicon-on-insulator (soi) substrate having bi-level digit lines
03/07/2002WO2002019420A2 Fabrication of semiconductor devices with air gaps for ultra low capacitance interconnection structures
03/07/2002WO2002019419A2 Substractive metallization structure and method of making
03/07/2002WO2002019418A2 Method for achieving copper fill of high aspect ratio interconnect features
03/07/2002WO2002019417A1 Method for forming a self-aligned dual damascene interconnection,and formed structure
03/07/2002WO2002019416A1 Method of manufacturing a semiconductor device having a porous dielectric layer and air gaps
03/07/2002WO2002019415A1 Overlay marks, methods of overlay mark design and methods of overlay measurements
03/07/2002WO2002019414A1 Methods of inspecting and manufacturing silicon wafer, method of manufacturing semiconductor device, and silicon wafer
03/07/2002WO2002019413A1 An exposed paddle leadframe for semiconductor die packaging
03/07/2002WO2002019412A1 A method of forming a bottom-gate thin film transistor
03/07/2002WO2002019411A2 Method of forming a pre-metal dielectric film on a semiconductor substrate
03/07/2002WO2002019410A1 Porous siliceous film having low permittivity, semiconductor devices and coating composition
03/07/2002WO2002019409A2 Method for selective etching of oxides
03/07/2002WO2002019408A2 Method of etching carbon-containing silicon oxide films
03/07/2002WO2002019407A2 A method for spatial distribution of chemical groups on a semiconductor surface
03/07/2002WO2002019405A1 Polishing device
03/07/2002WO2002019404A1 Method of processing silicon single crystal ingot
03/07/2002WO2002019403A1 Composite structure for electronic microsystems and method for production of said composite structure
03/07/2002WO2002019400A1 Ceramic heater for semiconductor manufacturing and inspecting equipment
03/07/2002WO2002019399A1 Ceramic substrate for semiconductor production and inspection
03/07/2002WO2002019398A2 Planarization of metal container structures
03/07/2002WO2002019397A2 Keyed wafer lift system
03/07/2002WO2002019396A1 Damascene double gated transistors and related manufacturing methods
03/07/2002WO2002019395A1 Ion-ion plasma processing with bias modulation sychronized to time-modulated discharges
03/07/2002WO2002019394A1 Wafer alignment system and method
03/07/2002WO2002019393A2 Method of processing a semiconductor wafer
03/07/2002WO2002019392A1 A method and device for docking a substrate carrier to a process tool
03/07/2002WO2002019391A2 Apparatus and method for floe of process gas in an ultra-clean environment
03/07/2002WO2002019389A2 Epitaxial template and barrier for the integration of functional thin film heterostructures on silicon
03/07/2002WO2002019386A2 High density mram cell array