Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2002
03/13/2002EP1186024A1 Method for making a silicon substrate comprising a buried thin silicon oxide film
03/13/2002EP1186023A1 A super-self-aligned trench-gate dmos with reduced on-resistance
03/13/2002EP1186022A2 Method and apparatus for enabling conventional wire bonding to copper-based bond pad features
03/13/2002EP1186021A1 Microelectronic subassembly
03/13/2002EP1186020A1 A method of manufacturing a semiconductor device
03/13/2002EP1186019A1 Trench semiconductor device having gate oxide layer with multiple thicknesses and processes of fabricating the same
03/13/2002EP1186018A2 Cmos process
03/13/2002EP1186017A2 Self-aligned source and drain extensions fabricated in a damascene contact and gate process
03/13/2002EP1186016A1 Process of using siloxane dielectric films in the integration of organic dielectric films in electronic devices
03/13/2002EP1186015A1 Low temperature oxidation of conductive layers for semiconductor fabrication
03/13/2002EP1186014A1 Techniques for etching a low capacitance dielectric layer
03/13/2002EP1186013A1 Differential trench open process
03/13/2002EP1186012A1 Method for producing an element with material that has been made porous
03/13/2002EP1186011A1 Controlled-stress stable metallization for electronic and electromechanical devices
03/13/2002EP1186010A1 Nitrided re-oxidised polysilicon gate to improve hot carrier performance
03/13/2002EP1186009A1 Method for removal of sic
03/13/2002EP1186007A2 Process chamber assembly with reflective hot plate
03/13/2002EP1186006A1 Method and system for cleaning a semiconductor wafer
03/13/2002EP1186005A1 Multi-zone resistive heater
03/13/2002EP1186004A2 Processing chamber with optical window cleaned using process gas
03/13/2002EP1186003A1 Apparatus for processing material at controlled temperatures
03/13/2002EP1186002A1 Ic-compatible parylene mems technology and its application in integrated sensors
03/13/2002EP1185903A1 Method of manufacturing a device by means of a mask and phase-shifting mask for use in said method
03/13/2002EP1185894A1 Method of fabricating a semiconductor device
03/13/2002EP1185855A1 Optical inspection method and apparatus utilizing a variable angle design
03/13/2002EP1185841A1 Measuring positions or coplanarity of contact elements of an electronic component with a flat illumination and two cameras
03/13/2002EP1185727A1 Sequential hydride vapor-phase epitaxy
03/13/2002EP1185723A1 Utilization of sih4, soak and purge in deposition processes
03/13/2002EP1185722A1 Pecvd of tan films from tantalum halide precursors
03/13/2002EP1185538A1 Copper source reagent compositions, and method of making and using same for microelectronic device structures
03/13/2002EP1185481A1 Improved methods of fabricating microelectromechanical and microfluidic devices
03/13/2002EP1185475A1 Cassette buffering within a minienvironment
03/13/2002EP1171802A4 Novel photosensitive resin compositions
03/13/2002EP1010151A4 Radio frequency data communications device
03/13/2002EP0975705B1 Buffer solutions for suspensions used in chemical-mechanical polishing
03/13/2002EP0950191B1 Contact probe unit
03/13/2002EP0912351B1 Rigid thin windows for vacuum applications
03/13/2002EP0898785A4 Active matrix displays and method of making
03/13/2002EP0865342B1 Improvements in and relating to grinding machines
03/13/2002CN2482220Y Wafer bearing device
03/13/2002CN2482219Y Water protection device for etching process
03/13/2002CN2482218Y Large round silicon chip film expansion heating device
03/13/2002CN2482217Y Improved drainage module for semiconductor exhaust gas treating apparatus
03/13/2002CN2482195Y Integrated transformer
03/13/2002CN2481446Y Spot welder capable of direct welding enamelled wire
03/13/2002CN1340243A Electronic element with reduced inductive coupling
03/13/2002CN1340240A Surface wave device connected to a base with conductive adhesive
03/13/2002CN1340215A Nitride semiconductor device and its manufacturing method
03/13/2002CN1340214A Integrated circuit comprising an inductor which prevents latch-up and method for its manufacture
03/13/2002CN1340212A Integrated circuit device, electronic module for chip card using said device and method for making same
03/13/2002CN1340211A Semiconductor device with deep substrate contacts
03/13/2002CN1340210A Method and system for polishing semiconductor wafers
03/13/2002CN1340082A 环氧树脂组合物 The epoxy resin composition
03/13/2002CN1339988A Method and device for treating substrates
03/13/2002CN1339873A Method for producing piezoelectric device
03/13/2002CN1339827A Semi-insulation diffusion potential barrier of low resistivity grid conductor
03/13/2002CN1339826A Single chip integrated inductance
03/13/2002CN1339825A Semiconductor and its design method and design device
03/13/2002CN1339824A Semiconductor device and its producing method
03/13/2002CN1339820A Method for preventing semiconductor layer bending and semiconductor device formed by said method
03/13/2002CN1339819A Lead wire frame and its producing method
03/13/2002CN1339818A Local chip connection method
03/13/2002CN1339800A MRAM capable of effectively overcoming noise
03/13/2002CN1339617A Chemical gas phase deposit method for non-crystalline silicon and forming film
03/13/2002CN1080984C Panel assembly structure
03/13/2002CN1080936C Method for forming metal wiring of semiconductor device
03/13/2002CN1080935C Bump forming method
03/13/2002CN1080934C Resin-package moulding die for production of semiconductor element
03/13/2002CN1080932C Metallic film for sealing semiconductor
03/13/2002CN1080931C Techonlogy for production of frame for enclosing semiconductor leadwire
03/13/2002CN1080930C Method for making a semiconductor structure
03/13/2002CN1080929C Method for forming fine patterns of semiconductor device
03/13/2002CN1080928C Method for planarization of semiconductor device
03/13/2002CN1080927C Method for detecting water defects
03/13/2002CN1080926C Manufacture of semiconductor components
03/13/2002CN1080895C A reticle and a method for measuring blind setting accuracy using the same
03/13/2002CN1080703C Preparing system for super high purity ammonia, producing system for super high precision electronic components and method for supplying high purity ammonina reagent on production line
03/12/2002USRE37580 Guard ring electrostatic chuck
03/12/2002US6356976 LSI system capable of reading and writing at high speed
03/12/2002US6356958 Integrated circuit module has common function known good integrated circuit die with multiple selectable functions
03/12/2002US6356861 Deriving statistical device models from worst-case files
03/12/2002US6356653 Method and apparatus for combined particle location and removal
03/12/2002US6356616 Apparatus and methods for detecting position of an object along an axis
03/12/2002US6356485 Merging write cycles by comparing at least a portion of the respective write cycle addresses
03/12/2002US6356479 Semiconductor memory system
03/12/2002US6356477 Cross point memory array including shared devices for blocking sneak path currents
03/12/2002US6356453 Electronic package having flip chip integrated circuit and passive chip component
03/12/2002US6356338 Semiconductor production system with an in-line subsystem
03/12/2002US6356333 Conductive adhesive with conductive particles, mounting structure, liquid crystal device and electronic device using the same
03/12/2002US6356326 Active matrix substrate of a liquid crystal display comprising an insulating layer being made of solid solution of SiOx /SINy
03/12/2002US6356318 Active-matrix liquid crystal display having storage capacitors of area smaller than that of pixel electrodes
03/12/2002US6356300 Automatic visual inspection apparatus automatic visual inspection method and recording medium having recorded an automatic visual inspection program
03/12/2002US6356183 Method of manufacturing an inductor
03/12/2002US6356144 LSI core including voltage generation circuit and system LSI including the LSI core
03/12/2002US6356136 Nonlinear resistor circuit using capacitively-coupled multi-input MOSFETS
03/12/2002US6356118 Semiconductor integrated circuit device
03/12/2002US6356097 Capacitive probe for in situ measurement of wafer DC bias voltage
03/12/2002US6356096 Test board for testing a semiconductor device utilizing first and second delay elements in a signal-transmission-path
03/12/2002US6356095 Semiconductor integrated circuit
03/12/2002US6356091 Automatic wafer mapping in a wet environment on a wafer cleaner