Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2002
03/14/2002US20020030244 Lateral bipolar transistor and method of making same
03/14/2002US20020030243 Semiconductor device and method for fabricating the same
03/14/2002US20020030242 Integrated inductive circuits
03/14/2002US20020030241 Integrated radio frequency circuits
03/14/2002US20020030240 Semiconductor component and corresponding fabrication process
03/14/2002US20020030238 Semiconductor device
03/14/2002US20020030237 Power semiconductor switching element
03/14/2002US20020030236 A semiconductor device with an improved gate electrode pattern and a method of manufacturing the same
03/14/2002US20020030235 Boron incorporated diffusion barrier material
03/14/2002US20020030234 Semiconductor device having gate electrode of stacked structure including polysilicon layer and metal layer and method of manufacturing the same
03/14/2002US20020030233 Semiconductor device and a method of fabricating the same
03/14/2002US20020030231 Semiconductor device having electrostatic protection circuit and method of fabricating the same
03/14/2002US20020030230 Semiconductor device having electrostatic discharge protection circuit
03/14/2002US20020030229 Implementing contacts for bodies of semiconductor-on-insulator transistors
03/14/2002US20020030228 Thin film transistor and fabrication method thereof
03/14/2002US20020030227 Strained-silicon diffused metal oxide semiconductor field effect transistors
03/14/2002US20020030225 Field effect transistor
03/14/2002US20020030224 Mosfet power device manufactured with reduced number of masks by fabrication simplified processes
03/14/2002US20020030223 Semiconductor device and method of manufacturing the same
03/14/2002US20020030222 Capacitor electrode for integrating high k materials
03/14/2002US20020030221 Conductive container structures having a dielectric cap
03/14/2002US20020030220 Conductive container structures having a dielectric cap
03/14/2002US20020030219 Side wall contact structure and method of forming the same
03/14/2002US20020030218 Method of making a thin film capacitor with an improved top electrode
03/14/2002US20020030217 Semiconductor memory device having plug contacted to a capacitor electrode and method for fabricating a capacitor of the semiconductor memory device
03/14/2002US20020030216 Polysilicon capacitor having large capacitance and low resistance
03/14/2002US20020030215 Semiconductor device
03/14/2002US20020030214 Semiconductor device and method for manufacturing the same
03/14/2002US20020030213 Semiconductor integrated circuit device and process for manufacturing the same
03/14/2002US20020030212 Semiconductor integrated circuit device
03/14/2002US20020030210 Method of manufacturing semiconductor devices utilizing underlayer-dependency of deposition of capacitor electrode film, and semiconductor device
03/14/2002US20020030209 Semiconductor device and method of manufacturing the same
03/14/2002US20020030208 Dram trench cell
03/14/2002US20020030207 Semiconductor device having a channel-cut diffusion region in a device isolation structure
03/14/2002US20020030206 Photodetector with built-in circuit and method for producing the same
03/14/2002US20020030205 Artificial neuron on the base of beta-driven threshold element
03/14/2002US20020030204 Voltage level shifter circuit and nonvolatile semiconductor storage device using the circuit
03/14/2002US20020030203 Buried channel strained silicon FET using a supply layer created through ion implantation
03/14/2002US20020030199 Reverse conducting thyristor
03/14/2002US20020030196 Semiconductor device having ZnO based oxide semiconductor layer and method of manufacturing the same
03/14/2002US20020030192 III-V compounds semiconductor device with an AIxByInzGa1-x-y-zN non continuous quantum dot layer
03/14/2002US20020030191 High voltage, high temperature capacitor structures and methods of fabricating same
03/14/2002US20020030190 Electro-optical device and semiconductor circuit
03/14/2002US20020030189 Semiconductor device and manufacturing method thereof
03/14/2002US20020030187 Method of evaluating critical locations on a semiconductor apparatus pattern
03/14/2002US20020030185 Method for locally modifying the effective bandgap energy in indium gallium arsenide phosphide (InGaAsP) quantum well structures
03/14/2002US20020030174 Using as treatment gas octafluoropentane
03/14/2002US20020030167 Dose monitor for plasma doping system
03/14/2002US20020030165 Proximity exposure method by oblique irradiation with light
03/14/2002US20020030089 Method and apparatus for mounting semiconductor chips
03/14/2002US20020030088 Device and method for clamping and wire-bonding the leads of a lead frame one set at a time
03/14/2002US20020030087 Bump bonding device and bump bonding method
03/14/2002US20020030086 Pitch and roll mechanism for a flip chip bonding machine
03/14/2002US20020030046 Apparatus for hard baking photoresist pattern
03/14/2002US20020030033 High density plasma chemical vapor deposition process
03/14/2002US20020029978 Plating a surface of a semiconductor workpiece (wafer, flat panel, magnetic films) using a liquid conductor such as mercury
03/14/2002US20020029973 Coated anode apparatus and associated method
03/14/2002US20020029963 Semiconductor wafer holder and electroplating system for plating a semiconductor wafer
03/14/2002US20020029962 Conductive biasing member for metal layering
03/14/2002US20020029961 Electro-chemical deposition system
03/14/2002US20020029960 Sputtering apparatus and film manufacturing method
03/14/2002US20020029958 On a semiconductor surface, while protecting the surface to be applied from contamination and wear by impacting ions, by first traditional sputtering with low bias, and then ion deposition sputtering, with high substrate bias
03/14/2002US20020029936 Multiple independent robot assembly and apparatus for processing and transferring semiconductor wafers
03/14/2002US20020029905 Method for manufacturing modular board
03/14/2002US20020029902 Microelectronic assemblies having solder-wettable pads and conductive elements
03/14/2002US20020029894 Resin sealed semiconductor device, circuit member for use therein and method of manufacturing circuit member
03/14/2002US20020029867 Heat sink Assembly
03/14/2002US20020029857 Process for mounting semiconductor device and mounting apparatus
03/14/2002US20020029854 Vacuum treatment equipment
03/14/2002US20020029853 Methods for running a high density plasma etcher to achieve reduced transistor device damage
03/14/2002US20020029852 Rotary processing apparatus
03/14/2002US20020029851 Plasma processing method and apparatus using dynamic sensing of a plasma environment
03/14/2002US20020029850 System for the plasma treatment of large area substrates
03/14/2002US20020029849 Method and apparatus for separating composite member using fluid
03/14/2002US20020029818 Vacuum processing methods
03/14/2002US20020029794 Surface treatment of semiconductor substrates
03/14/2002US20020029791 Processing apparatus having particle counter and cleaning device, cleaning method, cleanliness diagnosis method and semiconductor fabricating apparatus using the same
03/14/2002US20020029789 A processing container formed so as to surround a processing chamber in which substrates to be cleaned are accommodated, a nozzle for supplying processing liquid, the nozzle having ejecting apertures to eject liquid in the form of a plane
03/14/2002US20020029788 Method and apparatus for wafer cleaning
03/14/2002US20020029748 Shower head structure and cleaning method thereof
03/14/2002US20020029746 Operation method of ion source and ion beam irradiation apparatus
03/14/2002US20020029745 Worktable device and plasma processing apparatus for semiconductor process
03/14/2002US20020029744 Photoresist dispense arrangement by compensation for substrate reflectivity
03/14/2002US20020029743 Method and apparatus for applying adhesives to a lead frame
03/14/2002US20020029742 Apparatus and method for modifying the configuration of an exposed surface of a viscous fluid
03/14/2002US20020029741 Apparatus and method for controlling the depth of immersion of a semiconductor element in an exposed surface of a viscous fluid
03/14/2002US20020029740 Flow controller
03/14/2002US20020029738 Apparatus for pulling a single crystal
03/14/2002US20020029734 Method for producing single
03/14/2002US20020029473 Method of manufacturing a plated electronic termination
03/14/2002US20020029462 Magnetoresistive trimming of GMR circuits
03/14/2002US20020029431 Substrate cleaning apparatus
03/14/2002DE10136285A1 Integrierte Halbleiterschaltungsvorrichtung und Verfahren zum Anbringen von Schaltungsblöcken in der integrierten Halbleiterschaltungsvorrichtung A semiconductor integrated circuit apparatus and method for attaching of circuit blocks in the semiconductor integrated circuit device
03/14/2002DE10130998A1 Integrated fabricating device having multi-function for semiconductor and plate display
03/14/2002DE10121501A1 Test station mount for ICs has indexed rotation reduces height maintains planarity
03/14/2002DE10118902A1 Fotolackzusammensetzungen aus zyklischen Olefinpolymeren mit Laktonanteil Photoresist compositions of cyclic olefin polymers with Laktonanteil
03/14/2002DE10106430A1 Verfahren zum Ausbilden eines Halbleitervorrichtungsmusters, Verfahren zur Konstruktion eines Photomaskenmusters, Photomaske und Prozeß für eine Photomaske A method for forming a semiconductor device pattern, method of designing a photomask pattern for a photomask and photomask process
03/14/2002DE10047221C1 Storage capacitor used in integrated circuits has a thick insulating layer formed on the dielectric intermediate layer on an upper section of the trench wall in the lower region of the trench
03/14/2002DE10044537A1 Detecting short-circuits between memory cells on wafer by measuring conductivity between contacted conductive tracks
03/14/2002DE10043601A1 Vorrichtung und Verfahren zum Abscheiden insbesondere kristalliner Schichten auf insbesondere kristallinen Substraten Apparatus and method for depositing in particular crystalline layers on in particular crystalline substrates