Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2002
03/14/2002DE10043600A1 Vorrichtung zum Abscheiden insbesondere kristalliner Schichten auf einem oder mehreren, insbesondere ebenfalls kristallinen Substraten Device for depositing in particular crystalline layers on one or more, in particular likewise crystalline substrates
03/14/2002DE10043599A1 Vorrichtung zum Abscheiden insbesondere kristalliner Schichten auf einem oder mehreren insbesondere ebenfalls kristalliner Substraten Device for depositing in particular crystalline layers on in particular also one or more crystalline substrates
03/14/2002DE10043450A1 Improved method for mounting chips with protuberances in manufacturing process, for use in microelectronics
03/14/2002DE10043218A1 Schaltungsanordnung und Verfahren zur Alterungsbeschleunigung bei einem MRAM Circuit arrangement and method for accelerating aging in an MRAM
03/14/2002DE10043137A1 Vorrichtung und Verfahren zur Kennzeichnung der Version bei integrierten Schaltkreisen und Verwendung zur Steuerung von Betriebsabläufen Apparatus and method for identifying the version of integrated circuits and use for the control of operations
03/14/2002DE10042140A1 Beleuchtungs- und Abbildungseinrichtung für mehrere Spektralbereiche und Koordinatenmessmaschine mit einer Beleuchtungs- und Abbildungseinrichtung für mehrere Spektralbereiche Illumination and imaging device for several spectral and coordinate measuring machine with an illumination and imaging device for several spectral
03/14/2002DE10042098A1 Gasversorgung für Additive Lithographie Gas supply for additives lithography
03/14/2002DE10041749A1 Vertikale nichtflüchtige Halbleiter-Speicherzelle sowie Verfahren zu deren Herstellung Vertical non-volatile semiconductor memory cell as well as processes for their preparation
03/14/2002DE10041748A1 SOI-Substrat sowie darin ausgebildete Halbleiterschaltung und dazugehörige Herstellungsverfahren SOI substrate and formed therein semiconductor circuit and associated manufacturing processes
03/14/2002DE10041698A1 Verfahren zur Herstellung einer ferroelektrischen Festkörperschicht unter Verwendung eines Hilfsstoffes A method of manufacturing a ferroelectric solid state layer using an excipient
03/14/2002DE10041691A1 Halbleiteranordnung Semiconductor device
03/14/2002DE10041689A1 Verfahren zur Herstellung von dotiertem Halbleitermaterial Process for the preparation of doped semiconductor material
03/14/2002DE10041139A1 Anordnung zur Verbesserung des ESD-Schutzes bei einem CMOS Buffer Arrangement for improving the ESD protection in a CMOS buffer
03/14/2002DE10041084A1 Verfahren zur Bildung eines dielektrischen Gebiets in einem Halbleitersubstrat A method of forming a dielectric area in a semiconductor substrate,
03/14/2002DE10040998A1 Projektionsbelichtungsanlage Projection exposure apparatus
03/14/2002DE10040811A1 Monolithisch integrierbare Induktivität Monolithically integrated inductor
03/14/2002DE10038925A1 Elektronische Treiberschaltung für Wortleitungen einer Speichermatrix und Speichervorrichtung Electronic driver circuit for word lines of a memory array and memory device
03/14/2002DE10036356C2 Magnetisches Dünnschichtbauelement Magnetic thin film device
03/14/2002DE10034083C1 Halbleiterspeicher mit wahlfreiem Zugeriff mit reduziertem Signalüberkoppeln Semiconductor random Zugeriff with reduced signal overcoupling
03/14/2002DE10007642C2 Verfahren zum Trennen von Substraten im Nutzenformat mit vorgegebenen Sollbruchstellen A method of separating substrates in the panel format with predetermined breaking points
03/13/2002EP1187521A1 Process for manufacturing a supporting board for electronic components
03/13/2002EP1187518A2 Conductive adhesive agent, packaging structure, and method for manufacturing the same structure
03/13/2002EP1187511A1 Hot plate and method of producing the same
03/13/2002EP1187321A2 Piezoelectric device and method of manufacturing it
03/13/2002EP1187320A2 Method for manufacturing radio frequency module components with surface acoustic wave element
03/13/2002EP1187230A2 Thermoelectric material and method of manufacturing the same
03/13/2002EP1187225A2 Etching liquid composition
03/13/2002EP1187221A2 Linear color image sensor array with IR filter and method of forming the same
03/13/2002EP1187216A1 Method for manufacturing bonded wafer
03/13/2002EP1187215A2 Vertical non-volatile semiconductor memory cell and method for manufacture thereof
03/13/2002EP1187214A2 Semiconductor device with a protection against ESD
03/13/2002EP1187212A2 Display apparatus
03/13/2002EP1187206A1 Integrated electromagnetic protection device
03/13/2002EP1187205A2 Chip scale package with thermally and electrically conductive pad and manufacturing method thereof
03/13/2002EP1187204A2 Circuit device and method of manufacturing the same
03/13/2002EP1187203A2 A semiconductor device and method of manufacturing the same
03/13/2002EP1187202A2 Semiconductor package
03/13/2002EP1187201A1 Multiple-chip module
03/13/2002EP1187200A2 Semiconductor device with an improved bonding pad structure
03/13/2002EP1187199A2 Heatsink for Semiconductor Device, Method of Mannufacturing the same, as well as Molding Die therefore
03/13/2002EP1187195A2 Method of manufacturing field effect transistors in integrated semiconductor circuits and semiconductor integrated circuit comprising such a field effect transistor
03/13/2002EP1187194A2 Method for manufacturing semiconductor integrated circuit device
03/13/2002EP1187193A2 Semiconductor integrated circuit device and method of manufacturing the same
03/13/2002EP1187192A2 Process for the fabrication of an electrically conductive connection
03/13/2002EP1187191A2 SOI substrate with semiconductor circuit therein and method of manufacturing same
03/13/2002EP1187189A1 Silicon boat with protective film, method of manufacture thereof, and silicon wafer heat-treated using silicon boat
03/13/2002EP1187188A1 Method of processing wafer
03/13/2002EP1187187A1 Plasma processing apparatus
03/13/2002EP1187185A1 Hot plate unit
03/13/2002EP1187184A2 Thin film capacitor for temperature compensation
03/13/2002EP1187183A1 Method of manufacturing semiconductor device and manufacturing line thereof
03/13/2002EP1187182A2 Method and apparatus for separating substrates
03/13/2002EP1187181A2 Method and apparatus for mounting semiconductor chips
03/13/2002EP1187180A1 Method and apparatus for mounting semiconductor chips
03/13/2002EP1187172A2 Sputtering apparatus and film manufacturing method
03/13/2002EP1187171A2 Processor and method for processing
03/13/2002EP1187170A2 Plasma resistant quartz glass jig
03/13/2002EP1187169A2 Corpuscular optical components and assembly using same
03/13/2002EP1187139A1 Information storage device
03/13/2002EP1187138A2 Semiconductor integrated circuit
03/13/2002EP1187137A1 Modular MRAM device
03/13/2002EP1187121A2 Substrate rotating device, and manufacturing method and apparatus of recording medium master
03/13/2002EP1187103A2 Magnetoresistance effect device, head, and memory element
03/13/2002EP1187045A2 Production process standardization system of semiconductor device and method of same and storage medium storing that method
03/13/2002EP1186957A2 Lithographic projection apparatus
03/13/2002EP1186956A2 Projection exposure apparatus
03/13/2002EP1186903A2 Wafer inspection device and wafer inspection method
03/13/2002EP1186900A2 Arrangement for testing integrated circuits
03/13/2002EP1186854A2 Illuminating und imaging device for a plurality of spectral regions and coordinates measuring machine with a illuminating and imaging device for a plurality of spectral regions
03/13/2002EP1186685A2 Method for forming silicon carbide films
03/13/2002EP1186624A1 Organosiloxane polymers and photo-curable resin compositions
03/13/2002EP1186585A1 Gas for plasma reaction and method for production thereof
03/13/2002EP1186212A1 Integrated circuit package having a substrate vent hole
03/13/2002EP1186065A1 Flexible organic electronic device with improved resistance to oxygen and moisture degradation
03/13/2002EP1186054A1 Current controlled field effect transistor
03/13/2002EP1186053A2 A FIELD EFFECT TRANSISTOR OF SiC FOR HIGH TEMPERATURE APPLICATION, USE OF SUCH A TRANSISTOR AND A METHOD FOR PRODUCTION THEREOF
03/13/2002EP1186052A2 Source-down power transistor
03/13/2002EP1186051A1 Semiconductor device with compensated threshold voltage and method for making same
03/13/2002EP1186049A2 A bipolar transistor
03/13/2002EP1186048A1 Chip and method for fitting out a chip comprising a plurality of electrodes
03/13/2002EP1186047A1 Minimally-patterned semiconductor devices for display applications
03/13/2002EP1186045A1 Layout and wiring scheme for memory cells with vertical transistors
03/13/2002EP1186044A1 Memory cell unit and method of producing same
03/13/2002EP1186043A1 Trench capacitor dram cell with vertical transistor
03/13/2002EP1186040A1 Improved rf power transistor
03/13/2002EP1186039A1 Security method and device for a chip stack with a multidimensional structure
03/13/2002EP1186038A1 Integrated circuits with multiple low dielectric-constant inter-metal dielectrics
03/13/2002EP1186037A1 Multi-chip module for leads-on-chip (loc) assembly and method for production of the same.
03/13/2002EP1186036A1 Electronic device with flexible contacting points
03/13/2002EP1186035A1 Electronic component with flexible contact structures and method for the production of said component
03/13/2002EP1186034A1 Robust interconnect structure
03/13/2002EP1186033A1 Carrier for electronic components and a method for manufacturing a carrier
03/13/2002EP1186032A2 Method for producing a portable electronic device with an integrated circuit protected by a photosensitive resin
03/13/2002EP1186031A1 Substrate with at least two metallized polymer bumps for soldered connection to wiring
03/13/2002EP1186030A1 Capacitor for a semiconductor arrangement and method for producing a dielectric layer for the capacitor
03/13/2002EP1186029A2 Method of structuring a metal or metal-silicide layer and a capacitor produced according to said method
03/13/2002EP1186028A1 Method for expanding trenches by an anisotropic wet etch
03/13/2002EP1186027A1 Double gated transistor
03/13/2002EP1186026A1 Fabrication method for self-aligned cu diffusion barrier in an integrated circuit
03/13/2002EP1186025A1 Tungsten-filled deep trenches